Google Inc.

Shinnosuke Yamamoto

Sue Yun Teng

Ryohei Urata

Woon-Seong Kwon

Melanie Beauchemin

Houle Gan

William F Edwards

Yujeong Shim

Xu Zuo

An assembly includes a printed circuit board ('PCB'). An aperture extends through the PCB. The assembly also includes an array of pins and a processor package. The array of pins extends around a perimeter of the aperture, and the processor package extends over the aperture. The processor package is pressed against the array of pins by a compressive force couple.

Structure for optimal XPU socket compression

The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit ('ASIC') ball grid array ('BGA') package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

Compression-loaded printed circuit assembly for solder defect mitigation

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San Francisco, CA, United States of America

Shinnosuke Yamamoto