Tokyo Ohka Kogyo Co., Ltd.

Shinkichi Asahi

Hiroyuki Obiya

Ryuma Mizusawa

Naoya Katsumata

Syunzi Nakazato

Yukihiko Tanaka

It is disclosed a photosensitive resin composition comprising (a) a binder polymer based on a copolymer containing benzyl (meth)acrylate as a building block, (b) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule and (c) a photopolymerization initiator based on a hexarylbisimidazole compound, with a light-initiated color former being optionally contained as component (d). The composition has long-term keeping quality, exhibits particularly high resistance to plating and dry etching, as well as assuring improvement in resolution and adhesion; the composition may be used to form a photosensitive dry film.

Photosensitive resin compositions and photosensitive dry films using the same

A photosensitive composition for sandblasting and a photosensitive film laminate having a photosensitive layer comprising the photosensitive composition are disclosed, the photosensitive composition comprising (A) a photopolymerizable urethane (meth)acrylate oligomer having at least two acryloyl groups and/or methacryloyl groups and a structural unit represented by formula:

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Kanagawa, Japan

Shinkichi Asahi