Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Shinjiro Tsuji

Ryouichirou Katano

Takahiko Murata

Satoshi Adachi

Yasutaka Tsuboi

Kozo Odawara

Tomotaka Nishimoto

Masayuki Ida

Shinji Kanayama

Akira Yamada

Toshihiko Tsujikawa

Akira Kameda

Nobuhiko Muraoka

Keiji Fujiwara

Kenichi Nishino

Shuichi Hirata

Nobuhisa Watanabe

Masahiko Ikeya

Shingo Yamada

Nobuyuki Kakita

Ryoichiro Katano

Yuichi Takakura

Yasuhiro Noma

Masaya Watanabe

Akimitsu Mukai

Ikuko Obata

Hirohisa Mozaki

A component bonding device includes a bonding tool which sucks a film-like component and which bonds the film-like component to a substrate. The bonding tool includes: a plurality of suction blocks, each of which has a suction hole for sucking the film-like component; and a suction block holding portion which has a block holding-available region capable of holding the plurality of suction blocks, and which holds the plurality of suction blocks so as to be arranged in a row in the block holding-available region. The suction block holding portion allows change of a holding position of at least one of the plurality of suction blocks to any desired position in the block holding-available region.

Component bonding device

A component crimping apparatus includes a crimping tool that sucks a film-like component and presses a crimping section of the sucked film-like component against the substrate to crimp the film-like component to the substrate. The crimping tool includes a block holding portion that includes a guide member extending in one direction within a horizontal plane, first suction blocks that are provided movably along the guide member and that sucks an upper part of the crimping section of the film-like component, a second suction block that is provided movably along the guide member of the block holding portion and that sucks an upper part of a non-crimping section of the film-like component and a block fixation unit that fixes the first suction blocks and the second suction block to the guide member.

Component crimping apparatus

A component mounting line includes a first and a second component mounting devices. The first component mounting device adheres anisotropic conductive members to a region of a part of one side and a region of the other side of the substrate, temporarily crimps electronic components onto the region of the part of the one side and the region of the other side to which the anisotropic conductive members are adhered, and mainly crimps the electronic components onto the region of the other side. The second component mounting device adheres the anisotropic conductive members to remaining regions of the one side of the substrate, temporarily crimps the electronic components onto the remaining regions of the one side to which the anisotropic conductive members are adhered, and mainly crimps the electronic components onto the region of the part of the one side and the remaining regions of the one side.

Component mounting line and component mounting method

A component crimping apparatus includes: a substrate holding part that holds a substrate of a transparent material, a component previously attached to each electrode of electrodes juxtaposed in an edge of the substrate through a photo-curable adhesive member; a supporting part that supports, by a transparent member, a region under the electrodes in the substrate; crimping tools that are juxtaposed over the transparent member and press the components to the substrate; and a light irradiating part that irradiates the adhesive member with light through the transparent member when the crimping tools press the components to the substrate. The crimping tools are configured movably in an arrangement direction of the crimping tools, the transparent member has a dimension capable of covering a whole region of a movable range of the crimping tools, and the light irradiating part irradiates a whole region of the transparent member with the light.

A component crimping apparatus includes: a substrate holding part that holds a substrate of a transparent material, a component previously attached to each electrode of electrodes juxtaposed in an edge of the substrate through a photo-curable adhesive member; a supporting part having a base part with an optical path and a transparent member on the base part and connected to the optical path, and supports, by the transparent member, a region under a targeted electrode in the substrate; a crimping tool arranged over the transparent member and presses the component to the substrate; a light irradiating part that irradiates the adhesive member attached to the targeted electrode with light through the optical path; and a light shielding member that covers a portion in which the transparent member is not installed in an opening part of the optical path in the base part.

Provided is an apparatus capable of easily splicing ACF tapes that are thin and are hard to handle. The tape splicing apparatus splices two ACF tapes () each having an ACF (), and includes: a first holding unit that holds one of the ACF tapes (); a second holding unit that holds the other one of the ACF tapes (); a positioning unit () that positions the ACF tapes () to be overlapped in a thickness direction; and a pressing unit () that presses the overlapped ACF tapes () in the thickness direction.

Tape splicing apparatus and attaching apparatus

A substrate edge part cleaning apparatus judging a cleaning degree of glass substrates when cleaning edge parts of the glass substrates used for liquid crystal display. The substrate edge part cleaning apparatushaving a cleaning head wiping an edge part of a substrate for display A while moving rectilinearly, and having a cameracapturing images of the proximity of an edge of a color filter which is placed on the substrate, by moving together with the cleaning head. The cameraobtains surface status information of the substrate part which has been cleaned, and the substrate edge part cleaning apparatusfurther includes a cleaning degree judgment unitjudging a cleaning degree based on the surface status information.

Substrate edge part cleaning apparatus and substrate edge part cleaning method

A board terminal cleaning apparatus for cleaning a terminal portion by bringing a cleaning member in contact with the terminal portion of a board comprises a first support member that supports the cleaning member in a first position, a second support member that supports the cleaning member in a second position, a cleaning head that pressurizes part of the cleaning member supported between the first position and the second position by bringing the part in contact with the terminal portion of the board, a support member moving unit that moves the first support member and the second support member in the direction along the terminal portion, and a cleaning head moving unit that moves the cleaning head in the direction along the terminal portion at a second movement velocity different from the first movement velocity of the first support member and the second support member by the support member moving unit.

Apparatus and method for cleaning a board terminal

A method for transferring a substrate includes moving first and second substrate holding sections opposite each other, moving a first substrate stage holding the substrate so as to be disposed between the first and second substrate holding sections, delivering the substrate from the first substrate stage to the first and second substrate holding sections by releasing the holding of the substrate by the first substrate stage and holding the substrate by the first and second substrate holding sections, moving the first and second substrate holding sections from a first substrate taking-over position to a second substrate taking-over position, moving a second substrate stage so as to be disposed in the interval between the first and second substrate holding sections at the second substrate taking-over position, and delivering the substrate to the second substrate stage by releasing the substrate and holding the substrate by the second substrate stage.

Method for transferring a substrate

The final-bonder is equipped with a warping correction unit that is equipped in parallel with a backup stage with a distance of about 20 mm from such backup stage, and that includes accordion pads for sucking a liquid crystal panel; the backup stage that supports, from the back, the liquid crystal panel when pressure is applied to its outer edge portion at the bonding of semiconductor components; and a pressure head that carries out final bonding of the semiconductor components onto the outer edge portion of the liquid crystal panel by applying pressure and heat to them.

Substrate processing apparatus and mounter

An adhesive sheet attaching device is provided with: a stage (); a feeder () for feeding adhesive sheet () onto the stage (); a cutter (); a pressurizer () for attaching the adhesive sheet () to a target object mounted on the stage (); a detector () for detecting a connecting portion (); and a controller. When the detector () detects the connecting portion (), the controller stops the operation of the feeder () after adhesive sheet () of an attachable length up to the connecting portion () has been attached. This makes it possible to reliably prevent adhesive sheet () containing a connecting portion () from being attached to a target object, and to effectively use the adhesive sheet up to the connecting portion (), thus making it possible to suppress resource loss.

Adhesive sheet stamping device, adhesive sheet stamping method

Component mounting equipment mounts an FPC board onto an LCD board. The LCD board has a first electrode section on one side edge and a second electrode section on another side edge. The FPC board has a first section on one side edge and a second section on another side edge. A first mounting apparatus mounts the first section on the first electrode section. A second mounting apparatus mounts the second section on the second electrode section. In the second component mounting apparatus, the second section is separated from the second electrode section at an ACF supply section and released at a pre-press bonding section.

Electronic component, component mounting equipment, and component mounting method

Transfer of liquid crystal panels to subsequent processes is performed with the panels placed on transfer arms and held by suction pads. A small suction force can be sufficient, and a suction irregularity is prevented. The transfer arms are arranged at a lower side of the liquid crystal panels, thus not obstructing the liquid crystal panels. In arranging the liquid crystal panels at an image pickup device, a panel holding device is controlled to be driven so as to position panel marks to a bonding height position while negating a deflection amount of the liquid crystal panels, and furthermore a component holding device is controlled to be driven so as to position component marks to the bonding height position and to mount electronic components to the liquid crystal panels at the bonding height position.

Component mounting apparatus and component mounting method, and recognition apparatus for a component mount panel, component mounting apparatus for a liquid crystal panel, and component mounting method for a liquid crystal panel

A component-mounting apparatus is provided with a pallet-carrying unit that carries a pallet, holding boards, within the apparatus. The pallet-carrying unit carries the pallet to a loading unit for feeding boards to the pallet, an ACF applying unit for applying an ACF tape onto the boards, a pre-press bonding unit for positioning components relative to the boards and bonding the components with a first pressing force, a final bonding unit for bonding the components to the boards with a second pressing force larger than the first pressing force so as to fix the components onto the boards, and an unloading unit for removing the boards, with the components mounted thereon, from the pallet. Then, the pallet-carrying unit returns the pallet from the unloading unit to the loading unit.

Component mounting apparatus and component mounting method

An apparatus, for applying a pressing tape to an object by applying pressure to the object, includes a pair of vertically movable members spaced at a certain interval. A tape-shaped material is traveled members and including a supporting tape carrying a pressing tape thereon. A pressure applying device is positioned between the movable members for pressing the tape-shaped member against an object. A tape feed-out device is provided upstream of one of the movable members for feeding out the tape-shaped material therefrom. A tape winding device is positioned downstream of the other movable member, for winding the tape-shaped material thereon. A tape feeding device is positioned between the other movable member and the winding device for feeding the tape-shaped material by a predetermined length by pulling the tape-shaped material. A first chuck is positioned on one movable member for chucking the tape-shaped material. A second chuck is positioned on the other movable member for chucking the tape-shaped material, and a third chuck device is provided for holding the tape-shaped material between the tape feeding device and the winding device.

Growing community of inventors

Nara, Japan

Shinjiro Tsuji