Ngk Spark Plug Company, Limited

Shinji Yuri

Hiroshi Yamamoto

Masaki Muramatsu

Kazuhiro Urashima

Motohiko Sato

Toshitake Seki

Manabu Sato

Makoto Origuchi

Jun Otsuka

Yasuhiro Sugimoto

Hajime Saiki

Kozo Yamasaki

Akifumi Tosa

Kazuhiro Hayashi

Kazuhisa Sato

Masao Kuroda

Tomoe Suzuki

Tadahiko Kawabe

Shinya Miyamoto

Shinya Suzuki

Kenichi Saita

Kohki Ogawa

A method for manufacturing a wiring board including, as steps executed in written order: a sub-core accommodation step of accommodating the ceramic sub-core in the sub-core accommodation space through the first-major-surface-side opening of the sub-core accommodation space; and a film formation and charging step of forming a lowest resin insulating layer of the first-major-surface-side wiring laminate by sticking a resin material to the core body and the ceramic sub-core from the first major surface side, and forming a groove-filling portion that is continuous with the lowest resin insulating layer by charging the resin material into a gap between the core body and the ceramic sub-core.

Method for manufacturing a wiring board

A capacitor comprising: a capacitor body including a plurality of laminated dielectric layers, a plurality of inner electrode layers which are respectively disposed between mutually adjacent ones of the dielectric layers, a first main surface located in a laminated direction of the dielectric layers, and a second main surface opposite to the first main surface; a first outer electrode formed on the first main surface of the capacitor body and electrically connected to the inner electrode layers; a second outer electrode formed on the second main surface of the capacitor body and electrically connected to the inner electrode layers; a first dummy electrode formed on the first main surface of the capacitor body; and a second dummy electrode formed on the second main surface of the capacitor body.

Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment

A component built-in wiring substrate () which includes: a core substrate (); a plate-shaped component (); a resin filling portion (); and a wiring stacking portion (), wherein, when viewed from the core principal surface () side, the projected area of the mounting area () is larger than the projected area of the plate-shaped component () and the resin filling portion, and the plate-shaped component and the resin filling portion are positioned directly below the mounting area (), and wherein a value of the coefficient of thermal expansion (CTE &#x3b1;) for a temperature range that is equal to or higher than the glass transition temperature of the resin filling portion is set to be larger than a value of the coefficient of thermal expansion of the plate-shaped component and smaller than a value of the coefficient of thermal expansion of the core substrate for the subject temperature range.

Component built-in wiring substrate and manufacturing method thereof

An intermediate board has a board core formed by a main core body and a sub-core portion. The main core body has a plate-like shape and includes an open sub-core housing portion in which the sub-core portion is housed. A first terminal array of the board core has an area that overlaps an orthogonal projection of the sub-core portion. The latter incorporates a laminated ceramic capacitor formed by first and second conductor layers with a ceramic (dielectric) layer therebetween. The first layer is connected to first and second side terminals of a first type while the second layer is connected to first and second side terminals of a second type. The housing portion has an inner edge which, in cross section, is of a quadrate shape, and a radius portion is formed at each corner having a dimension of between 0.1 and 2 mm.

Wiring board and capacitor to be built into wiring board

A wiring board includes a substrate core and a ceramic chip to be embedded therein. The substrate core has a housing opening portion opening at a core main surface. The ceramic chip is accommodated in the housing opening portion so that the core main surface and a chip first main surface face the same way. The ceramic chip includes a plurality of second terminal electrodes comprised of a metallized layer and formed on the chip second main surface so as to protrude therefrom. A projecting portion, disposed on the second main surface side so as to surround a plurality of the second terminal electrodes, is formed on the chip second main surface so as to protrude therefrom.

Wiring board and ceramic chip to be embedded

A circuit board ('&#x2033;) comprising: a board core () having a main core surface () and a rear core surface (); a ceramic capacitor (&#x2033;&#x2033;&#x2033;) having a main capacitor surface () and a rear capacitor surface (), having a structure in which a first inner electrode layer () and a second inner electrode layer () are alternately stacked with a ceramic dielectric layer () interposed therebetween, and having a plurality of capacitor function units () being electrically independent from each other, the ceramic capacitor (&#x2033;&#x2033;&#x2033;) being buried in the board core () in a state where the main core surface () and the main capacitor surface () are directed in a same direction; and a buildup layer () having a structure in which an interlayer insulating layer () and a conductor layer () are alternately stacked on the main core surface () and the main capacitor surface () and having a semiconductor integrated circuit device mounting region () for mounting a semiconductor integrated circuit device () having a plurality of processor cores () on a surface () of the buildup layer (), wherein the plurality of capacitor function units () are capable of being electrically connected to the plurality of processor cores (), respectively.

Ceramic capacitor

A wiring board having an excellent electrical property and reliability or the like. The wiring board includes a core board, a capacitor and a resin filler. The core board includes an accommodation hole therein and a core board main surface side conductor disposed on the core main surface thereof. A capacitor main surface side electrode is disposed on a capacitor main surface of the capacitor. A gap between the capacitor accommodated in the accommodation hole and the core board is filled with the resin filler so that the capacitor is fixed to the core board. Further, the resin filler has a main surface side wiring forming portion on which a main surface side connecting conductor, which is connected to an end portion of a via conductor, is disposed so as to connect the core board main surface side conductor to the capacitor main surface side electrode.

Wiring board

A wiring board comprising: a board core () having a core main surface () and a core reverse surface (); a capacitor (A,B,C,D,E,F,G,H,J,'&#x2033;&#x2033;) having a capacitor main surface () and a capacitor reverse surface () and having a structure in which first inner electrode layers () and second inner electrode layers () are alternately laminated and arranged via a dielectric layer (), the capacitor (A,B,C,D,E,F,G,H,J,&#x2032;&#x2033;&#x2033;) being accommodated in the board core () in a state in which the core main surface () and the capacitor main surface () are oriented on a same side; and a wiring laminated portion () having a structure in which interlayer insulating layers () and conductor layers () are alternately laminated on the core main surface () and the capacitor main surface (), wherein an inductor () or a resistor () is formed on or in the capacitor (A,B,C,D,E,F,G,H,J,&#x2032;&#x2033;&#x2033;).

Wiring board and capacitor

A method for manufacturing a wiring board which can simplify a manufacturing step. In a preparation step, a core board and an electronic component are prepared. In an insulating layer formation and fixing step, after accommodating the electronic component in an accommodation hole, a lowermost resin insulating layer is formed, and a gap between the electronic component and the core board is filled with a part of the lowermost resin insulating layer so as to fix the electronic component to the core board. In an opening portion formation step, a portion of the lowermost resin insulating layer located directly above the gap between the electronic component and the core board is removed so as to form an opening portion exposing a part of a core board main surface side conductor and a component main surface side electrode. In a main surface side connecting conductor formation step, a main surface side connecting conductor is formed in the opening portion so as to connect the core board main surface side conductor to the component main surface side electrode.

Method for manufacturing wiring board

A wiring board comprising: a core board including a core body and a ceramic sub-core which is accommodated in a sub-core accommodation space that is a through-hole that communicates with major surfaces of the core body or a recess having an opening in a first major surface of the core body; and wiring laminates each formed by resin insulating layers and conductor layers laminated on each of major surfaces of the core board, wherein: a groove-filling portion which fills a gap between the core body and the ceramic sub-core is integral with a lowest resin insulating layer of the first-major-surface-side wiring laminate; and via conductors that are connected to respective conductor patterns formed on a first major surface of the ceramic sub-core penetrate through the lowest resin insulating layer.

Wiring board and manufacturing method of wiring board

A wiring board includes a plurality of via pads disposed on a ceramic sub-core accommodated in a core board. A Cu-plated layer is formed on the surface of a conductor pad and serves as a processed face, i.e., a face to which Cu surface chemical processing is applied in order to improve the adhesion between the surface of the Cu-plated layer and that of an adjacent polymer material. The lowermost dielectric layer of a laminated wiring portion, and a via conductor formed in the dielectric layer, are in electrical contact with the processed face.

Wiring board and method for manufacturing the same

A wiring board includes a substrate core, ceramic capacitors and a built-up layer. The substrate core has a housing opening portion therein which opens at a core main surface. The ceramic capacitors are accommodated in the housing opening portion and oriented such that the core main surface and a capacitor main surface of each capacitor face the same way. The built-up layer includes semiconductor integrated circuit element mounting areas at various locations on a surface thereof. In the substrate core, each ceramic capacitor is respectively disposed in an area corresponding to each semiconductor integrated circuit element mounting area.

Growing community of inventors

Kasugai, Japan

Shinji Yuri