Hitachi, Ltd.

Hitachi Powdered Metals Co., Ltd.

Hitachi Chemical Company, Ltd.

Japan As Represented by Director General of Agency of Industrial Science

Shinji Yamada

Satoru Amou

Takao Ishikawa

Akira Nagai

Takashi Naito

Hiroki Yamamoto

Akio Takahashi

Takao Miwa

Shinichi Tachizono

Kei Yoshimura

Toshiya Satoh

Yuichi Satsu

Takuya Aoyagi

Kazuhiro Suzuki

Takumi Ueno

Yuji Hashiba

Morimichi Umino

Keiichi Kanazawa

Hiroshi Nakano

Hiroshi Fukui

Takeyuki Itabashi

Hiroshi Yoshida

Katsumi Mabuchi

Shin Kimura

Masao Kato

Masayoshi Sato

Hachiro Nakanishi

Hiroshi Kanemoto

Masafumi Noujima

Masatoshi Sugimasa

Shuji Okada

Shuji Musha

Takashi Fukuda

Hiroo Matsuda

Akira Masuda

Xuan-Ming Duan

Tatsumi Kimura

A low softening point glass composition, which is substantially free from lead, bismuth and antimony and comprises oxides of vanadium, phosphorous, tellurium and iron, a softening point of the composition being 380&#xb0; C. or lower.

Low softening point glass composition, bonding material using same and electronic parts

A glass composition substantially free from lead and bismuth and containing vanadium oxide and phosphor oxide as main ingredients, wherein the sintered glass of the glass composition exhibits 10&#x3a9;cm or more at 25&#xb0; C.

Glass composition and its applications

Recovery of dehydrogenation product must be done separately from supply of hydrogen fuel. However, there is a problem that it takes much time when dehydrogenation product recovery and fuel filling are done separately. A fuel filling/waste solution recovery apparatus includes measuring means to measure a volume of supplied fuel and a volume of recovered waste solution by measuring flow rates of solutions passing through a fuel filling nozzle and a recovery nozzle or piping, and a display which shows the volume of supplied fuel and the volume of recovered waste solution which are measured by the measuring means.

Fuel filling and waste solution recovery apparatus and fuel vessel

According to the present invention, there is provided a low dielectric loss tangent resin composition containing a crosslinking component having a weight average molecular weight of not more than 1,000 and a plurality of styrene groups and represented by the formula [1], wherein R is a hydrocarbon skeleton which may have a substituent, Ris hydrogen, methyl or ethyl, m is an integer of 1-4 and n is an integer of 2 or more, and further containing at least one member selected from a high polymer having a weight average molecular weight of not less than 5,000 and a filler, which resin composition can give a cured product having a good flexibility, high tensile strength and low dielectric constant and dielectric loss tangent.

Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof

An electronic device for high frequency signals having a small dielectric loss and a high efficiency is provided, in which a low dielectric loss tangent resin composition is used, for coping with high frequency signals, as an insulating layer. The electronic device is fabricated using an insulating layer containing a crosslinked structure of a crosslinking ingredient represented by the following general formula (I): (where R represents a hydrocarbon skeleton, R, which may be identical or different from each other, represents a hydrogen atom or a hydrocarbon group of 1 to 20 carbon atoms, R, Rand R, which may be identical or different from each other, each represents a hydrogen atom or a hydrocarbon group of 1 to 6 carbon atoms, m is an integer of 1 to 4 and n is an integer of 2 or greater).

Electronic device using low dielectric loss tangent insulators for high frequency signals

A curing low dielectric loss tangent film using a low dielectric loss tangent composition containing a polyfunctional styrene compound having excellent dielectric characteristics, and a wiring film using the same as an insulating layer are provided. The low dielectric loss tangent film contains a high molecular weight material and a crosslinking ingredient with a weight average molecular weight of 1000 or less having a plurality of styrene groups shown by the following general formula: (where R represents a hydrocarbon skeleton, R, which may be identical or different with each other, represents a hydrogen atom or a hydrocarbon group of 1 to 20 carbon atoms, R, Rand R, which may be identical or different with each other, each represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, m represents an integer of 1 to 4, and n represents an integer of 2 or greater).

Low dielectric loss tangent films and wiring films

According to the present invention, there is provided a low dielectric loss tangent resin composition containing a crosslinking component having a weight average molecular weight of not more than 1,000 and a plurality of styrene groups and represented by the formula [1],wherein R is a hydrocarbon skeleton which may have a substituent, Ris hydrogen, methyl or ethyl, m is an integer of 1-4 and n is an integer of 2 or more, and further containing at least one member selected from a high polymer having a weight average molecular weight of not less than 5,000 and a filler, which resin composition can give a cured product having a good flexibility, high tensile strength and low dielectric constant and dielectric loss tangent.

A semiconductor device wherein a resin containing as a cross-linking component a compound having a plurality of styrene group and represented by chemical formula [1] is used as an insulating material:where R is a hydrocarbon structure which may have a substituent group or groups, Ris hydrogen, methyl, or ethyl, m is and integer of 1 to 4, and n is an integer of not less than 2. With this, a semiconductor device and a semiconductor package which show excellent transmission characteristics and less power consumption are provided.

Semiconductor device and semiconductor package

Thermal stable low elastic modulus material and device using the same

Disclosed is a novel aromatic ester compound represented by the general formula ##STR1## in which Pn is a 1,4-phenylene group, R.sup.1 is an alkyl group having 1 to 4 carbon atoms, R.sup.2 is a group selected from the group consisting of perfluoroalkyl groups having 1 to 4 carbon atoms, cyano group, nitro group, 2,2-dicyanoethenyl group and methylsulfonyl group and the subscript n is a number of 2, 3 or 4. These aromatic ester compounds are useful as a second-order non-linear optical material in the ultraviolet wavelength range so that a resin film containing the compound has a good second-order non-linear optical coefficient d.sub.33 of 2-4.times.10.sup.-9 esu.

Aromatic ester compound and second-order non-linear optical material

In a mobile radio communication device, a gain of a GaAs FET for high frequency power amplification is controlled by a negative voltage based on a clock signal generated by a microcomputer in the device.

Using a clock signal generated by a microcomputer for providing a

A parallel connected gate turn-off thyristor device including an additional short circuiting conductor connected between the gate terminals of the respective gate turn-off thyristors so as to bypass a part of the turn-on and turn-off gate currents of one gate turn-off thyristor to other gate turn-off thyristors to increase the turn-on and turn-off gate currents of the other gate turn-off thyristors thereby hastening the turn-on and turn-off operations of the other gate turn-off thyristors.

Parallel-connected gate turn-off thyristors

Growing community of inventors

Tsukuba, Japan

Shinji Yamada