Kabushiki Kaisha Toshiba

Tyco Electronics Japan G.k.

Sony Corporation

Yazaki Corporation

Mitsubishi Denki Kabushiki Kaisha

Toyo Seikan Kaisha, Ltd.

Calsonic Kansei Corporation

Toyo Seikan Group Holdings, Ltd.

Sony Corporation of America

Hino Jidosha Kogyo Kabushiki Kaisha

Kyocera Elco Corporation

Marusan Packing Manufacturing Co.

Shinji Yamada

Hiroshi Katsuno

Yasuo Ohba

Kei Kaneko

Mitsuhiro Kushibe

Shinya Nunoue

Jumpei Tajima

Satoshi Mitsugi

Atsushi Fukumoto

Naoharu Sugiyama

Kentaro Nagai

Hisashi Kawafuji

Gary Durack

Katsuhiro Seo

Tomiji Tanaka

Mitsuru Toishi

Tooru Iwagami

Sukehisa Noda

Taisuke Nagasaki

Koji Takasaki

Yusuke Okada

Takashi Shimoyasu

Seiki Iwagaki

Hirohito Toriyama

Hiroshi Ono

Shigeya Kimura

Yasuo Suzuki

Hiroyuki Suzuki

Masaaki Hara

Hitoshi Okada

Hideo Kurashima

Kotaro Zaima

Mitsuhiro Yoshida

Hiroaki Goto

Jeffrey D Wallace

Satoru Seko

Toru Gotoda

Shingo Chiba

Ryo Kasegawa

Naoki Takahashi

Shinya Otsuka

Kazutatsu Tokuyama

Kevin A Keilbach

Shigenobu Murakami

Hideki Yamanaka

Yoshinori Hirayama

Michael Zordan

Haruyuki Matsushita

Makoto Arakawa

Kageyasu Sako

Tomoki Maruyama

Yasunori Onozawa

Larry W Arnold

Noriyuki Akai

Yasuhiro Takasaki

Nobuyuki Otomo

Bharath K Narahari

Elizabeth C Eaton

Takayoshi Otsu

Katsuhiro Agatsuma

Tooru Shimomura

Katsuyuki Hirata

Keiichi Tsuchihashi

Osamu Aizawa

Gary P Durack

Michael D Zordan

A motor is provided with a circuit board that is connected to a coil of a stator. A male connection portion is formed in part of the outer periphery of the circuit board. A casing accommodates the circuit board. The male connection portion is exposed to the outside from an opening formed in the casing. A female connector is connected to a cable and is able to engage with the male connection portion.

Motor and female connector

A connector assembly is provided and includes receptacle connector and a header connector. The receptacle connector includes a connector housing with a receptacle contact, a fastener, and a lock. The fastener includes a fastening section fixed at an outer end portion thereof. The lock attaches to the connector housing and is movable along a length thereof. The header connector is engageable with the receptacle connector and includes a header contact that is connectable with the receptacle contact, a header housing, and an elastic fastener. The header housing has an engagement portion to which the header contact is attached and that engages the connector housing, and the elastic fastener extends outward from the engagement portion of the header housing.

Connector Assembly

A heating device and a heating method are disclosed, by which an irregularly shaped object can be evenly and efficiently heated by a plurality of conductive pins smoothly sliding inside through holes so that their tips sufficiently follow the irregular shape of the object, while damage to the conductive pins or the object is prevented. The heating deviceheats an object M placed between opposing electrodesand. At least one of the electrodesincludes a retention platefor retaining a plurality of conductive pinssupported in an electrode platein a state in which the conductive pinsare slid away from an opposite electrode, and a release mechanismfor releasing the plurality of conductive pinsfrom retention by the retention plate

Heating device and heating method

A connector mounted to a circuit board and mating with a mating connector in a mating direction extending along the circuit board is disclosed. The connector comprises a contact having a resilient contact portion, a housing retaining the contact and having a pair of restricting projections, and a retainer having a resilient retainer portion. The retainer is disposed between the pair of restricting projections and retains the housing on the circuit board. The pair of restricting projections restricts movement between the housing and the circuit board in the mating direction and the resilient contact portion and the resilient retainer portion permit movement between the housing and the circuit board in a plurality of directions perpendicular to the mating direction.

Connector and connection structure

A connector is provided and includes a barrel, an end bell, an assembly nut, and a securing mechanism. The end bell includes a spring arm and a seat portion. The assembly nut includes a projection disposed on the seat portion and engaging the spring arm to couple the barrel to the end bell. The securing mechanism secures the barrel and the assembly nut to each other.

Connector having a barrel and an end bell

A nitride semiconductor wafer includes a silicon substrate, a first layer, a second layer, a third layer, a fourth layer, a fifth layer, and a sixth layer. The first layer is provided on the silicon substrate. The second layer is provided on the first layer. The third layer is provided on the second layer. The fourth layer is provided on the third layer. The fifth layer is provided on the fourth layer. The sixth layer is provided on the fifth layer. A composition ratio x4 of the fourth layer decreases in a first direction from the third layer toward the fifth layer. A maximum value of the composition ratio x4 is not more than a composition ratio of the third layer. A minimum value of the composition ratio x4 is not less than a composition ratio of the fifth layer.

Nitride semiconductor wafer, nitride semiconductor element, and method for manufacturing nitride semiconductor wafer

According to one embodiment, a semiconductor light emitting device includes: a first semiconductor layer of a first conductivity type; a second semiconductor layer of a second conductivity type; a light emitting layer; a conductive metal layer; and a first stress application layer. The first semiconductor layer contains a nitride semiconductor crystal and receives tensile stress in a (0001) plane. The second semiconductor layer contains a nitride semiconductor crystal. The light emitting layer has an average lattice constant larger than a lattice constant of the first semiconductor layer. The conductive metal layer has a thermal expansion coefficient larger than a thermal expansion coefficient of a nitride semiconductor crystal. The first stress application layer is provided between the second semiconductor layer and the light emitting layer. The first stress application layer relaxes tensile stress applied from the metal layer to the second semiconductor layer.

Semiconductor light emitting device

According to one embodiment, a semiconductor light emitting device includes a stacked structure body and an electrode. The stacked structure body has a first conductivity type first semiconductor layer including a nitride-based semiconductor, a second conductivity type second semiconductor layer including a nitride-based semiconductor, and a light emitting layer provided between the first and second semiconductor layers. The electrode has first, second and third metal layers. The first metal layer is provided on the second semiconductor layer and includes silver or silver alloy. The second metal layer is provided on the first metal layer and includes at least one element of platinum, palladium, rhodium, iridium, ruthenium, osmium. The third metal layer is provided on the second metal layer. A thickness of the third metal layer along a direction from the first toward the second semiconductor layer is equal to or greater than a thickness of the second metal layer.

Method for manufacturing semiconductor light emitting device

A locking structure includes a terminal fitting and a terminal containing portion that holds and contains the terminal fitting so that the terminal fitting is electrically connected to a connection counterpart in a condition that at least part of the connection counterpart is inserted in the terminal containing portion. A first lock projection which is elastically deformable and is provided on the terminal fitting is locked on a second lock projection which is provided on the terminal containing portion. The at least part of the connection counterpart inserted in the terminal containing portion restricts elastic deformation of the first lock projection in a direction in which the first lock projection is unlocked from the second lock projection.

Locking structure of terminal fitting and bulb socket

A semiconductor light emitting element includes a substrate and a stacked body. The stacked body is aligned with the substrate. The stacked body includes first and second semiconductor layers, a light emitting layer, and first and second electrodes. The first semiconductor layer has a first face including first and second portions. The first portion is provided with a plurality of convex portions. The second portion is aligned with the first portion. The second semiconductor layer is provided facing the second portion. The light emitting layer is provided between the second portion and the second semiconductor layer. The second semiconductor layer is disposed between the second electrode and the light emitting layer. An interval of each of the convex portions is no less than 0.5 times and no more than 4 times a wavelength of a light emitted from the light emitting layer.

Semiconductor light emitting element and method for manufacturing the same

According to one embodiment, a semiconductor light emitting element includes an n-type semiconductor layer including a nitride semiconductor, a p-type semiconductor layer including a nitride semiconductor, a light emitting unit, a first layer, a second layer, and a third layer. The light emitting unit is provided between the n-type and p-type semiconductor layers, and includes a first well layer including a nitride semiconductor. The first layer is provided between the first well layer and the p-type semiconductor layer, and includes AlGaInN having a first Mg concentration. The second layer is provided between the first layer and the p-type semiconductor layer, and includes AlGaInN having a second Mg concentration higher than the first Mg concentration. The third layer is provided between the second layer and the p-type semiconductor layer, and includes AlGaInN having a third Mg concentration higher than the first Mg concentration and lower than the second Mg concentration.

Semiconductor light emitting element and method for manufacturing semiconductor light emitting element

An electrical connector housing is disclosed having a first housing member, and a second housing member mated with the first housing member. A front wall is disposed on an outer surface of at least one of the housing members and extends perpendicular to an insertion direction. A first sidewall is disposed on the outer surface of the first housing member and extends along the insertion direction, perpendicular to the front wall. A second sidewall is disposed on the outer surface of the second housing member and extends along the insertion direction, parallel with the first sidewall and perpendicular to the front wall. A cantilevered first lock arm extends along an insertion direction and is positioned between the first sidewall and second sidewall. The lock arm includes a fixed end, a free end, and a hook.

Connector

The various embodiments disclosed herein utilize multiple lasers that have different wavelengths and a single detection path. The lasers are mounted orthogonal to one another so that one laser will provide a forward angle light scatter (FALS) signal in the detection path, and one laser will provide a side scatter signal in the detection path (i.e., the single detection optics are approximately in-line with the FALS laser and approximately orthogonal to the side scatter laser). The single detector path spectrally separates the forward and side scatter signals prior to applying them to their respective detectors for measurement.

System and method for measuring narrow and wide angle light scatter on a high-speed cell sorting device

Growing community of inventors

Tokyo, Japan

Shinji Yamada