Matsushita Electric Industrial Co., Ltd.

Shinji Umeda

Tadashi Nakamura

Koji Nomura

Takeshi Masutani

Daizo Ando

Kunihiko Oishi

Hiroaki Fujimoto

Kazuki Komaki

Hiroshi Fujii

Katsumasa Miki

Kazuhiko Fujikawa

Akihiko Ibata

Tsutomu Nakanishi

Shin-itsu Takehashi

The present invention relates to an infrared detector element to detect infrared rays by means of a pyroelectric material, and an infrared sensor unit and an infrared detecting device using the infrared detector element and has an object of realizing an omnidirectional infrared detector element that can gain an output against an object to be detected moving in whatever directions. In order to accomplish this object, the present invention proposes a setup comprising a pair of first electrodes ( ), which have a function of absorbing infrared rays, are close to trapezoidal in shape, respectively, and are disposed on one of the surfaces of a pyroelectric material ( ) with electrical connections made in such a way that the first electrodes are opposite to each other in polarity, and a pair of second electrodes ( ) disposed on the other surface of the pyroelectric material ( ) and electrically connected with each other, in which the lower side of the close to trapezoidal shape of the first electrodes ( ) of one hand is aligned in the same direction as the lower side of the close to trapezoidal shape of the second electrodes ( ) of the other hand, thereby producing an effect of gaining an output against an object to be detected making a movement from whatever directions.

Infrared detector element, and infrared sensor unit and infrared detecting device using it

A sensor in which a field effect transistor element having a gate electrode on its rear side is electrically connected onto a resistive element having a top surface electrode and a bottom surface electrode in such a way that the gate electrode and a portion of the top surface electrode of the resistive element coincides, and a grounding electrode on a substrate is electrically connected with the bottom surface electrode of the resistive element so that they coincides.

Method of manufacturing sensor and resistor element

An electronic element which is free of many of the impurities that tend to adversely affect its operation. The electronic element is hermetically sealed in a space formed by a framework having a first and second plate directly joined to its sides. Directly joining the first and second plates to the framework prevents splashes of adhesive and soldering material from effecting the operation of the electronic element.

Method of manufacturing electronic component

Electronic component and its manufacturing method

The present invention discloses a semiconductor chip removal method of removing a semiconductor chip having thereon a chip electrode from a board having thereon a board electrode wherein the semiconductor chip is bonded to the board with a resin and these chip and board electrodes are connected together electrically by a wire. This semiconductor chip removal method comprises the following steps of: (a) cutting the bonding wire into two pieces by a cutter that presses its cutting edge against the base of the bonding wire on the board electrode's side; (b) separating the semiconductor chip from the board by a chip remover that forces the semiconductor chip sideways, with the adhesive strength of the resin weakened by the application of heat thereto; and (c) removing the semiconductor chip together with a piece of the bonding wire left on the chip electrode's side.

Semiconductor chip removal process and apparatus

Growing community of inventors

Osaka, Japan

Shinji Umeda