Shimadzu Corporation

Matsushita Electric Industrial Co., Ltd.

Mitsubishi Materials Corporation

Mitsubishi Shindoh Co., Ltd.

Megachips Corporation

Panasonic Intellectual Property Management Co., Ltd.

Osakawan Marine Corporation

Shinji Tanaka

Keiichiro Oishi

Kouichi Suzaki

Kenichi Yasunaga

Yoshiyuki Goto

Nobuyuki Yoshiike

Jun Yanagibayashi

Shigeyuki Inoue

Takayuki Oka

Koki Miyazaki

Ryo Hosono

Akio Konishi

Katsuya Morinaka

Hisashi Takahashi

Kenji Kawamata

Hiroharu Ogawa

Yoshiki Maeda

Koichiro Hirabayashi

Kazuhiko Hashimoto

Sachio Nagamitsu

Makoto Miyamoto

Shigeo Obata

Shinya Imamura

Hiroaki Iijima

Yoshitaka Kawasaki

Tetsuo Furuichi

Masaya Hirade

Kazuo Shibukawa

Yosuke Nakasato

Yuko Kishimoto

Akiyoshi Hattori

Hiroki Goto

Shuzo Takeda

Atsushi Imai

Masahiko Miyamoto

Masami Mitsuse

Kohei Murata

Yoshihiro Masui

Hiromu Yamasaki

Koshi Abe

Hirosi Yamamoto

Katsuhiko Hata

Yoshinobu Ono

An imaging device includes pixels. Each of the pixels includes a first electrode, a second electrode, a photoelectric conversion layer that is located between the first electrode and the second electrode, that contains a donor semiconductor material and an acceptor semiconductor material, and that generates a pair of an electron and a hole, a first charge blocking layer located between the first electrode and the photoelectric conversion layer, a second charge blocking layer located between the second electrode and the photoelectric conversion layer, and a charge storage region that is electrically connected to the second electrode and that stores the hole. The difference between the electron affinity of the acceptor semiconductor material and the electron affinity of the first charge blocking layer is larger than the difference between the ionization potential of the donor semiconductor material and the ionization potential of the second charge blocking layer.

Imaging device

A resin tube connection device includes a resin tube, a resin expanding portion and a metal sleeve. The resin expanding portion has a sealing surface being able to come into contact with a contact surface. Further, the resin expanding portion has a second flow path that communicates with a first flow path of the resin tube and opens in the sealing surface. The sealing surface projects farther than an end surface of the metal sleeve in an axial direction. The maximum length of a contact region where the resin expanding portion and the metal sleeve come into contact with each other in the axial direction in an outer surface is larger than the thickness of a resin layer in a radial direction.

Resin tube connection device

A bioinert pipe includes a flow path inside, an inner wall of the flow path is composed of a resin tube and an outer peripheral surface of the resin tube is covered with a metal tube. The bioinert pipe includes an end portion extension member attached to an end portion of the metal tube, and the end portion extension member is made from a material harder than the resin tube and has a first surface and a second surface. The first surface is facing and in contact with an end surface of the metal tube and the second surface is directed opposite to the first surface. a through hole having an inner diameter substantially the same as an inner diameter of the metal tube is provided so as to pass from the first surface to the second surface in the end portion extension member. An edge of the through hole on the second surface of the end portion extension member has a chamfered shape, and the resin tube is inserted into the through hole. An end portion of the resin tube forms a flange portion by being by being bent outward in a radial direction of the flow path along the chamfered shape of the edge of the through hole.

Bioinert pipe with hollow member accepting a metal tube and liquid chromatograph

A resin tube is prepared. Further, a formation tool having a pressing surface and a projection that projects from the pressing surface and is insertable into the resin tube is prepared. The projection of the formation tool is inserted from an end of the resin tube into the resin tube. The pressing surface of the formation tool is pressed against an end surface of the resin tube. Thermal energy is applied to the end of the resin tube, whereby a shape of the pressing surface of the formation tool is transferred to the end surface of the resin tube, and the end of the resin tube is formed into a flange shape.

Resin-tube end formation method and formation tool

This free-cutting copper alloy comprises 75.4-78.7% Cu, 3.05-3.65% Si, 0.10-0.28% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the following relations: 76.5&#x2264;f1=Cu+0.8&#xd7;Si&#x2212;8.5&#xd7;Sn+P&#x2264;80.3; 60.7&#x2264;f2=Cu&#x2212;4.6&#xd7;Si&#x2212;0.7&#xd7;Sn&#x2212;P&#x2264;62.1; and 0.25&#x2264;f7=P/Sn&#x2264;1.0. The area percentage (%) of respective constituent phases satisfies the following relations: 28&#x2264;&#x3ba;&#x2264;67; 0&#x2264;&#x3b3;&#x2264;1.0; 0&#x2264;&#x3b2;&#x2264;0.2; 0&#x2264;&#x3bc;&#x2264;1.5; 97.4&#x2264;f3=&#x3b1;+&#x3ba;; 99.4&#x2264;f4=&#x3b1;+&#x3ba;+&#x3b3;+&#x3bc;; 0&#x2264;f5=&#x3b3;+&#x3bc;&#x2264;2.0; and 30&#x2264;f6=&#x3ba;+6&#xd7;&#x3b3;+0.5&#xd7;&#x3bc;&#x2264;70. The long side of the &#x3b3; phase is at most 40 &#x3bc;m, the long side of the &#x3bc; phase is at most 25 &#x3bc;m, and &#x3ba; phase is present in &#x3b1; phase.

Free-cutting copper alloy and method for producing free-cutting copper alloy

This free-cutting copper alloy comprises 76.0-78.7% Cu, 3.1-3.6% Si, 0.40-0.85% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the following relations: 75.0&#x2264;f1=Cu+0.8&#xd7;Si&#x2212;7.5&#xd7;Sn+P+0.5&#xd7;Pb&#x2264;78.2; 60.0&#x2264;f2=Cu&#x2212;4.8&#xd7;Si&#x2212;0.8&#xd7;Sn&#x2212;P+0.5&#xd7;Pb&#x2264;61.5; and 0.09&#x2264;f3=P/Sn&#x2264;0.30. The area percentage (%) of respective constituent phases satisfies the following relations: 30&#x2264;&#x3ba;&#x2264;65; 0&#x2264;&#x3b3;&#x2264;2.0; 0&#x2264;&#x3b2;&#x2264;0.3; 0&#x2264;&#x3bc;&#x2264;2.0; 96.5&#x2264;f4=&#x3b1;+&#x3ba;; 99.4&#x2264;f5=&#x3b1;+&#x3ba;+&#x3b3;+&#x3bc;; 0&#x2264;f6=&#x3b3;+&#x3bc;&#x2264;3.0; and 35&#x2264;f7=1.05&#xd7;&#x3ba;+6&#xd7;&#x3b3;+0.5&#xd7;&#x3bc;&#x2264;70. &#x3ba; phase is present in &#x3b1; phase, the long side of the &#x3b3; phase is at most 50 &#x3bc;m, and the long side of the &#x3bc; phase is at most 25 &#x3bc;m.

This free-cutting copper alloy casting contains: 76.0-79.0% Cu, 3.1-3.6% Si, 0.36-0.85% Sn, 0.06-0.14% P, 0.022-0.10% Pb, with the remainder being made up of Zn and unavoidable impurities. This composition satisfies the following relations: 75.5&#x2264;f1=Cu+0.8&#xd7;Si&#x2212;7.5&#xd7;Sn+P+0.5&#xd7;Pb&#x2264;78.7, 60.8&#x2264;f2=Cu&#x2212;4.5&#xd7;Si&#x2014;0.8&#xd7;Sn&#x2212;P+0.5&#xd7;Pb&#x2264;62.2, 0.09&#x2264;f3=P/Sn&#x2264;0.35. The area ratios (%) of the constituent phases satisfy the following relations, 30&#x2264;&#x3ba;&#x2264;63, 0&#x2264;&#x3b3;&#x2264;2.0, 0&#x2264;&#x3b2;&#x2264;0.3, 0&#x2264;&#x3bc;&#x2264;2.0, 96.5&#x2264;f4=&#x3b1;+&#x3ba;, 99.3&#x2264;f5=&#x3b1;+&#x3ba;+&#x3b3;+&#x3c1;, 0&#x2264;f6=&#x3b3;+&#x3bc;&#x2264;3.0, and 37&#x2264;f7=1.05&#xd7;&#x3ba;+6&#xd7;&#x3b3;+0.5&#xd7;&#x3bc;&#x2264;72. The &#x3ba; phase is present within the &#x3b1; phase, the long side of the &#x3b3; phase does not exceed 50 &#x3bc;m, and the long side of the &#x3bc; phase does not exceed 25 &#x3bc;m.

Free-cutting copper alloy casting and method for producing free-cutting copper alloy casting

A device includes a sample rack having a mounting region for mounting a sample plate that holds a sample, a housing in which a temperature adjustment space for adjusting a temperature of the sample plate mounted on the sample rack while accommodating the sample rack inside is provided therein, and the housing having, in a lateral surface, a rack insertion opening through which the sample rack is inserted into the temperature adjustment space; and an air temperature adjustment part having an air intake port for taking in air in the temperature adjustment space, a temperature adjustment element for cooling or heating air taken in from the air intake portion, and an outlet for blowing out air cooled or heated by the temperature adjustment element.

Device with sample temperature adjustment function

To suppress generation of dew condensation in temperature control space when heating temperature control is performed. In an apparatus, an air temperature control part for cooling or heating air in temperature control space has a first temperature control element for performing at least cooling of air, and a second temperature control element for performing at least heating of air downstream of the first temperature control element. In this manner, when heating temperature control is performed, cooling and dehumidification of air taken in from an air intake portion can be performed by the first temperature control element, and then heating of the dehumidified air can be performed by the second temperature control element.

Apparatus equipped with sample temperature control function

This free-cutting copper alloy contains more than 77.0% but less than 81.0% Cu, more than 3.4% but less than 4.1% Si, 0.07% to 0.28% Sn, 0.06% to 0.14% P, and more than 0.02% but less than 0.25% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 1.0&#x2264;f0=100&#xd7;Sn/(Cu+Si+0.5&#xd7;Pb+0.5&#xd7;P&#x2212;75.5)&#x2264;3.7, 78.5&#x2264;f1=Cu+0.8&#xd7;Si&#x2212;8.5&#xd7;Sn+P+0.5&#xd7;Pb&#x2264;83.0, 61.8&#x2264;f2=Cu&#x2212;4.2&#xd7;Si&#x2212;0.5&#xd7;Sn&#x2212;2&#xd7;P&#x2264;63.7. The area ratios (%) of the constituent phases satisfy the following relations, 36&#x2264;&#x3ba;&#x2264;72, 0&#x2264;&#x3b3;&#x2264;2.0, 0&#x2264;&#x3b2;&#x2264;0.5, 0&#x2264;&#x3bc;&#x2264;2.0, 96.5&#x2264;f3=&#x3b1;+&#x3ba;, 99.4&#x2264;f4=&#x3b1;+&#x3ba;+&#x3b3;+&#x3bc;, 0&#x2264;f5=&#x3b3;+&#x3bc;&#x2264;3.0, 38&#x2264;f6=&#x3ba;+6&#xd7;&#x3b3;+0.5&#xd7;&#x3bc;&#x2264;80. The long side of the &#x3b3; phase does not exceed 50 &#x3bc;m, and the long side of the &#x3bc; phase does not exceed 25 &#x3bc;m.

A seat includes a backrest, and a fan that is installed on the backrest at a position corresponding to a height of a head of a sitter sitting on the seat and generates an airflow flowing from a front toward a rear of the backrest. The seat may further include a sitter detector that detects the height of the head of the sitter, a lifting-and-lowering motor that adjusts a height of the fan, and a lifting-and-lowering controller that controls the lifting-and-lowering motor. The lifting-and-lowering controller may control the lifting-and-lowering motor to adjust the height of the fan to the height of the head of the sitter detected by the sitter detector.

Seat

To suppress inflow of external air through a rack insertion opening while a sample rack is pulled out. An apparatus includes a housing, a temperature control space, and an air temperature control part. The housing has the rack insertion opening on one side surface for putting in and taking out the sample rack. The air temperature control part has an air intake portion for intake of air in the temperature control space, a fan for blowing air taken in from the air intake portion toward the sample rack accommodated in the temperature control space, and a cooling element provided to cool the air on a path of air taken in from the air intake portion. The air temperature control part is configured to reduce an amount of air flowing near the rack insertion opening while the sample rack is pulled out from the temperature control space as compared to while the sample rack is accommodated in the temperature control space, so as to suppress inflow of air through the rack insertion opening.

This free-cutting copper alloy contains 76.0%-79.0% Cu, 3.1%-3.6% Si, 0.36%-0.84% Sn, 0.06%-0.14% P, 0.022%-0.10% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 74.4&#x2264;f1=Cu+0.8&#xd7;Si&#x2212;8.5&#xd7;Sn+P+0.5&#xd7;Pb&#x2264;78.2, 61.2&#x2264;f2=Cu&#x2212;4.4&#xd7;Si&#x2212;0.7&#xd7;Sn&#x2212;P+0.5&#xd7;Pb&#x2264;62.8, 0.09&#x2264;f3=P/Sn&#x2264;0.35. The area ratio (%) of the constituent phases satisfies the following relations: 30&#x2264;&#x3ba;&#x2264;65, 0&#x2264;&#x3b3;&#x2264;2.0, 0&#x2264;&#x3b2;&#x2264;0.3, 0&#x2264;&#x3bc;&#x2264;2.0, 96.5&#x2264;f4=&#x3b1;+&#x3ba;, 99.4&#x2264;f5=&#x3b1;+&#x3ba;+&#x3b3;+&#x3bc;, 0&#x2264;f6=&#x3b3;+&#x3bc;&#x2264;3.0, 36&#x2264;f7=1.05&#xd7;&#x3ba;+6&#xd7;&#x3b3;+0.5&#xd7;&#x3bc;&#x2264;72. The &#x3ba; phase is present within the &#x3b1; phase, the long side of the &#x3b3; phase does not exceed 50 &#x3bc;m, and the long side of the &#x3bc; phase does not exceed 25 &#x3bc;m.

Free-cutting copper alloy, and method for producing free-cutting copper alloy

This free-cutting copper alloy contains 75.0%-78.5% Cu, 2.95%-3.55% Si, 0.07%-0.28% Sn, 0.06%-0.14% P, and 0.022%-0.25% Pb, with the remainder being made up of Zn and inevitable impurities. The composition satisfies the following relations: 76.2&#x2264;f1=Cu+0.8&#xd7;Si&#x2212;8.5&#xd7;Sn+P+0.5&#xd7;Pb&#x2264;80.3, 61.5&#x2264;f2=Cu&#x2212;4.3&#xd7;Si&#x2212;0.7&#xd7;Sn&#x2212;P+0.5&#xd7;Pb&#x2264;63.3. The area ratios (%) of the constituent phases satisfy the following relations: 25&#x2264;&#x3ba;&#x2264;65, 0&#x2264;&#x3b3;&#x2264;1.5, 0&#x2264;&#x3b2;&#x2264;0.2, 0&#x2264;&#x3bc;&#x2264;2.0, 97.0&#x2264;f3=&#x3b1;+&#x3ba;, 99.4&#x2264;f4=&#x3b1;+&#x3ba;+&#x3b3;+&#x3bc;, 0&#x2264;f5=&#x3b3;+&#x3bc;&#x2264;2.5, 27&#x2264;f6=&#x3ba;+6&#xd7;&#x3b3;+0.5&#xd7;&#x3bc;&#x2264;70. The long side of the &#x3b3; phase does not exceed 40 &#x3bc;m, the long side of the &#x3bc; phase does not exceed 25 &#x3bc;m, and the &#x3ba; phase is present within the &#x3b1; phase.

This free-cutting copper alloy casting contains 75.0-78.5% Cu, 2.95-3.55% Si, 0.07-0.28% Sn, 0.06-0.14% P, 0.022-0.20% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 76.2&#x2264;f1=Cu+0.8&#xd7;Si&#x2212;8.5&#xd7;Sn+P+0.5&#xd7;Pb&#x2264;80.3, 61.2&#x2264;f2=Cu&#x2212;4.4&#xd7;Si&#x2212;0.8&#xd7;Sn&#x2212;P+0.5&#xd7;Pb&#x2264;62.8. The area ratios (%) of the constituent phases satisfy the following relations: 2.5&#x2264;&#x3ba;65, 0&#x2264;&#x3b3;&#x2264;2.0, 0&#x2264;&#x3b2;&#x2264;0.3, 0&#x2264;&#x3bc;&#x2264;2.0, 96.5&#x2264;f3=&#x3b1;+&#x3ba;, 99.2&#x2264;f4=&#x3b1;+&#x3ba;+&#x3b3;+&#x3bc;, 0&#x2264;f6=&#x3b3;+&#x3bc;&#x2264;3.0, 29&#x2264;f6=&#x3ba;+6&#xd7;&#x3b3;+0.5&#xd7;&#x3bc;&#x2264;66. The long side of the &#x3b3; phase does not exceed 50 &#x3bc;m, the long side of the &#x3bc; phase does not exceed 25 &#x3bc;m, and the &#x3ba; phase is present within the &#x3b1; phase.

Free-cutting copper alloy casting, and method for producing free-cutting copper alloy casting

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Osaka, Japan

Shinji Tanaka