Kabushiki Kaisha Toshiba

Oki Electric Industry Co., Ltd.

Shinji Takei

Junichi Asada

Masahiko Hori

Seigo Nambu

Hiroshi Okuaki

Hiroyuki Fukazawa

A resin-sealed semiconductor device includes a plurality of electronic components mounted on a printed wiring board, a circuit mounting surface of the board being resin-sealed, with connection terminals of the electronic components electrically connected to a printed wiring on the board. A surface portion of the board is coated with insulator material which contains tiny hollow spheres and constitutes a thermal expansion resin.

Resin-sealed semiconductor device

Outer leads are buried in a package. At least the contact portions of the outer leads which are connected to a circuit board are exposed from the package and the exposed portions make the same flat surfaces as the package surface. When forming the package, the outer leads are used as the side wall of a mold forming mold, and therefore, they are formed thicker than inner leads inside the package. Thus, the package thickness can be made equal to the thickness of the outer leads.

Process for encapsulating a semiconductor device and lead frame

Semiconductor device, lead frame and method for manufacturing

A plastic-sealed IC device comprises an IC lead frame having a chip mounting area, an IC chip fixedly mounted on the IC lead frame in the chip mounting frame area, and a plastic package molded so as to seal the IC lead frame therein. The plastic package has an opening formed so as to allow the backside of the chip mounting area to communicate with the atomonphere to discharge the moisture accumulating in the vicinity of the IC chip.

Plastic-sealed IC device of heat-resistant construction

A heat-resistant plastic-packaged semiconductor device comprises an IC chip having contacts on its first surface, an island on which the IC chip is mounted with its second surface facing a first surface of the island, a low-adhesion layer which is formed on a second surface of the island, external leads, bonding wires for connection of the contacts on the IC chip and inner ends of the external leads, a package of mold resin for encapsulating the IC chip, the low-adhesion layer, the bonding wires and inner parts of the external leads, the mold resin being provided with a vent hole which extends to the vicinity of the low-adhesion layer. The low-adhesion layer has a low or no adhesive power to the mold resin.

Growing community of inventors

Tokyo, Japan

Shinji Takei