Adv Antest Corporation

Intel Corporation

Tokyo Institute of Technology

Shinji Sugatani

Akio Yamada

Masahiro Takizawa

Masaki Kurokawa

Jun Matsumoto

Shinichi Hamaguchi

Shigeki Nishina

Masayuki Takahashi

Masahiro Seyama

Minoru Soma

Takayuki Ohba

Ryuma Iwashita

Provided is a stacked device comprising: a plurality of circuit layers each having a circuit portion; an insulating layer configured to cover a plurality of circuit portions included in a part of circuit layers of the plurality of circuit layers, and a plurality of conductive vias provided in the insulating layer and electrically connected to the plurality of circuit portions, wherein the conductive via electrically connected to a partial circuit portion of the plurality of circuit portions is electrically insulated on an end surface on an opposite side to the plurality of circuit portions and the partial circuit portion is broken at least partially along a stacking direction.

Fabrication method of stacked device and stacked device

To provide a three-dimensional printing device that irradiates approximately the same ranges on the surface of a powder layer simultaneously with a plurality of electron beams having different beam shapes. An electron beam columnof the three-dimensional printing deviceincludes a plurality of electron sourcesincluding electron sources having anisotropically-shaped beam generating units, and beam shape deforming elementsthat deform the beam shapes of electron beams output from the electron sourceson a surfaceof a powder layer. A deflectorincluded in the electron beam columndeflects an electron beam output from each of the plurality of electron sourcesby a distance larger than the beam space between electron beams before passing through the deflector

Electron beam column for three-dimensional printing device, three-dimensional printing device, and three-dimensional printing method

Provided is a three-dimensional laminating and shaping apparatusincluding a column unitthat is configured to output an electron beam EB and deflect the electron beam EB toward the front surface of a powder layer, an insulating portion that electrically insulates a three-dimensional structurefrom a ground potential member, an ammeterthat is configured to measure the current value indicative of the current flowing into the ground after passing through the three-dimensional structure, a melting judging unitthat is configured to detect that the powder layeris melted based on the current value measured by the ammeterand generate a melting signal, and a deflection controllerthat is configured to receive the melting signal to determine the condition for the irradiation with the electron beam.

Three-dimensional laminating and shaping apparatus and laminating and shaping method

Provided is a three-dimensional laminating and shaping apparatusincluding a column unitthat is configured to output an electron beam EB and deflect the electron beam EB toward the front surface of a powder layer, an electron detectorthat is configured to detect electrons that may be emitted in a predetermined direction from the front surface of the powder layerwhen the powder layeris irradiated with the electron beam EB, a melting judging unitthat is configured to generate a melting signal based on the strength of the detection signal from the electron detector, and a deflection controllerthat is configured to receive the melting signal to determine the condition of the irradiation the electron beam.

To realize a multi-beam formation device that can stably machine a fine pattern using complementary lithography, provided is a device that deforms and deflects a beam, including an aperture layer having a first aperture that deforms and passes a beam incident thereto from a first surface side of the device and a deflection layer that passes and deflects the beam that has been passed by the aperture layer. The deflection layer includes a first electrode section having a first electrode facing a beam passing space in the deflection layer corresponding to the first aperture and a second electrode section having an extending portion that extends toward the beam passing space and is independent from an adjacent layer in the deflection layer and a second electrode facing the first electrode in a manner to sandwich the beam passing space between the first electrode and an end portion of the second electrode.

Device, manufacturing method, and exposure apparatus

To form a complex and fine pattern by combining optical exposure technology and charged particle beam exposure technology, provided is an exposure apparatus that radiates a charged particle beam at a position corresponding to a line pattern on a sample, including a beam generating section that generates a plurality of the charged particle beams at different irradiation positions in a width direction of the line pattern; a scanning control section that performs scanning with the irradiation positions of the charged particle beams along a longitudinal direction of the line pattern; a selecting section that selects at least one charged particle beam to irradiate the sample from among the plurality of charged particle beams, at a designated irradiation position in the longitudinal direction of the line pattern; and an irradiation control section that controls the at least one selected charged particle beam to irradiate the sample.

Exposure apparatus and exposure method

An exposure apparatus is configured to include an electronic optical systemthat generates an electron ray and irradiates a wafer W with the electron ray, a wafer stage WS that holds the wafer W, and an electron detectorand a fog preventing mechanismthat are placed between the electronic optical systemand the wafer stage WS. A substrateconstitutes the fog preventing mechanism, and opening holesthat penetrate up to the upper surface of the substrateare formed in a first area of the bottom surface of the substrate, and opening holesthat are closed in the substrateare formed in a second area of the bottom surface.

Exposure apparatus

Provided is a charged particle beam exposure apparatus configured as follows. An electron beam emitted from an electron gun is deformed by an asymmetric illumination optical system to have an elongated section. The electron beam is then applied to a beam shaping aperture plate provided with a plurality of apertures arranged in a line, thereby generating a plurality of electron beams. Exposure of a predetermined pattern is performed on a semiconductor substrate by moving a stage device in a direction orthogonal to line patterns on the semiconductor substrate and turning the plurality of electron beams on or off in synchronization with the movement of the stage device by use of a blanker plate and a final aperture plate.

Growing community of inventors

Saitama, Japan

Shinji Sugatani