Fuji Electric Co., Ltd.

Shinji Sano

Kazunaga Onishi

Yoshihiro Kodaira

Masayuki Soutome

Tatsuo Nishizawa

Shunsuke Saito

Hirohiko Watanabe

Masahiro Ono

Takashi Watanabe

A member for semiconductor device includes a metal portion configured to be bonded to another member by solder, and a treated coating covering a surface of the metal portion, the treated coating including a treatment agent. The treated coating vaporizes at a temperature lower than or equal to a solidus temperature of the solder.

Member for semiconductor device

There is provided a method for producing a member for semiconductor device which can reduce generation of a large number of voids in a solder-bonded portion without increasing production cost. The method includes the step of preparing a first member including a metal portion capable of being bonded by solder and the step of coating the surface of the metal portion of the first member with a treatment agent to form a treated coating which vaporizes at a temperature lower than or equal to the solidus temperature of the solder.

Method for producing member for semiconductor device and semiconductor device, and member for semiconductor device

In a soldering method for Ag-containing lead-free solders to be soldered to an Ag-containing member, void generation is prevented and solder wettability is improved. The soldering method for Ag-containing lead-free solders of the present invention is a soldering method for Ag-containing lead-free solders includes a first step of bringing a lead-free solder having a composition that contains Ag that a relation between a concentration C (mass %) of Ag contained in an Sn&#x2014;Ag-based lead-free solder before soldering of a mass M(g) and an elution amount B(g) of Ag contained in the Ag-containing member becomes 1.0 mass %&#x2264;(M&#xd7;C+B)&#xd7;100/(M+B)&#x2264;4.6 mass % and that the balance consists of Sn and unavoidable impurities into contact with the Ag-containing member, a second step of heating and melting the lead-free solder, and a third step of cooling the lead-free solder.

Lead-free soldering method and soldered article

A method for manufacturing a semiconductor device, includes preparing a solder, a soldering article, a base material, a weight having a foot where a center of gravity of the weight is shifted from a center of the soldering article, a positioning jig having a hole for holding the soldering article in the base material, and a dam member; disposing the dam member on a side having a relatively lower height due to a warp of an edge portion of the base material; placing the positioning jig on a principal surface of the base material; placing the soldering article on the solder in the hole; placing the weight on an upper surface of the soldering article to position the center of gravity on the side having relatively lower height; and raising the temperature of the solder to a temperature equal to or higher than the melting point of the solder.

Growing community of inventors

Matsumoto, Japan

Shinji Sano