Mitsubishi Chemical Corporation

Shinji Saiki

Masashi Uzawa

Akira Yamazaki

Asako Kaneko

Hironobu Ikeda

Yoshiko Irie

Hiroya Fukuda

Hiroaki Iriyama

Osamu Numata

Toshio Nagasaka

Saki Makigawa

Naoko Yamada

A conductive composition may include a conductive polymer (A), a water-soluble polymer (B), and a solvent (C1). The water-soluble polymer (B) may include a water-soluble polymer (B11) of formula (11), and a water-soluble polymer (B2) of formula (2) as the water-soluble polymer (B) of 0.15% by mass or less, based on a total mass of the conductive composition: wherein Ris a linear or branched alkyl group with 6 to 20 carbon atoms, each of Rand Ris independently a methyl or ethyl group, Ris a hydrophilic group, Ris H or a methyl group, Yis a single bond, —S—, —S(═O)—, —C(═O)—O—, or —O—, Z is a cyano group or a hydroxy group, each of p1 and q is an average number of repetitions, and is a number of from 1 to 50, and m is a number of from 1 to 5.

Conductive composition and production method therefor, and water-soluble polymer and production method therefor

The conductive film of the present invention includes a conductive polymer (A) and has a film thickness of 35 nm or less, wherein: a surface resistance of the conductive film is 1×10Ω/sq. or less, and a standard deviation of current that flows through the conductive film upon application of voltage to the conductive film is 5 or less. The conductor of the present invention has a substrate, and the conductive film provided on at least a part of the surface of the substrate. The resist pattern forming method of the present invention includes a lamination step of forming the conductive film on a surface of a resist layer including a chemically amplified resist, said resist layer formed on one surface of a substrate, and an exposure step of irradiating the substrate with an electron beam according to a pattern on its side on which the conductive film is formed. The laminate of the present invention has a resist layer and an antistatic film formed on the surface of the resist layer, wherein the antistatic film is the above-mentioned conductive film.

Conductive film, method for producing same, conductor, resist pattern formation method, and laminate

The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5×10Ω/□ or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.

Conductor, conductive composition and laminate

The conductive composition of the present invention includes a conductive polymer (A) having an acidic group, and a basic compound (B) having a cyclic amide and an amino group in its molecule. The conductive film of the present invention is formed from the conductive composition. The laminate of the present invention includes a substrate; an electron beam resist layer, formed on at least one surface of the substrate; and a conductive film formed on the electron beam resist layer.

Electrically conductive composition, electrically conductive film, and laminate

A conductive composition comprising a conductive polymer (A), a water-soluble polymer (B), and a solvent (C1), wherein: the water-soluble polymer (B) comprises a water-soluble polymer (B11) represented by formula (11), and an amount of a water-soluble polymer (B2) represented by formula (2) as the water-soluble polymer (B) is 0.15% by mass or less, based on a total mass of the conductive composition: wherein Rdenotes a linear or branched alkyl group with 6 to 20 carbon atoms, each of Rand Rindependently denotes a methyl or ethyl group, Rdenotes a hydrophilic group, Rdenotes a hydrogen atom or a methyl group, Ydenotes a single bond, &#x2014;S&#x2014;, &#x2014;S(&#x2550;O)&#x2014;, &#x2014;C(&#x2550;O)&#x2014;O&#x2014; or &#x2014;O&#x2014;, Z denotes a cyano group or a hydroxy group, each of p1 and q denotes an average number of repetitions, and is a number of from 1 to 50, and m denotes a number of from 1 to 5.

The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5&#xd7;10&#x3a9;/&#x25a1; or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.

The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5&#xd7;10&#x3a9;/&#x25a1; or less, the Raof the conductive coating film is 0.7 nm or less, the Ravalue of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.

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Otake, Japan

Shinji Saiki