Tokyo Electron Limited

Shinji Orimoto

Naoyuki Suzuki

Manabu Nakagawasai

Hiroshi Sone

Hiroyuki Yokohara

Motoi Yamagata

Koji Maeda

Kaoru Yamamoto

Katsuyoshi Aikawa

Hiroaki Chihaya

Junichi Takei

Tamaki Takeyama

There is provided a method for processing a substrate, comprising: preparing a substrate processing device including a rotatable stage on which a substrate is placed, a frozen heat transfer body fixed on a backside of the stage with a gap interposed therebetween and cooled to an extremely low temperature, a gas supply mechanism configured to supply to the gap a cooling gas for transferring a cold heat of the frozen heat transfer body to the stage, a rotation mechanism configured to rotate the stage, and a processing mechanism configured to process the substrate; preheating the stage such that a temperature of the stage reaches a steady cooling temperature within a fixed range; and after preheating, continuously processing a plurality of substrates by the processing mechanism while rotating the stage that has reached the steady cooling temperature in a state where a substrate having a specific temperature higher than or equal to room temperature is placed on the stage.

Method and device for substrate processing

There is provided a mounting table. The mounting table comprises: a dielectric plate having a through-hole at an outer peripheral portion thereof and having a substrate support on which a substrate is placed; a support member; a first heat insulating member disposed between the dielectric plate and the support member; a first biasing member disposed between the first heat insulating member and the support member, and a fastening member configured to detachably fix the dielectric plate to the support member by way of penetrating through the through-hole of the dielectric plate, the first heat insulating member, and the first biasing member.

Mounting table and substrate processing apparatus

A temperature measuring device that measures a temperature of a rotatable stage that holds a substrate, includes: a contact portion provided at a position that does not hinder placing of the substrate on the stage, and a temperature detector having a temperature sensor, and provided at a position separated from the temperature detection contact portion except when measuring a temperature. When measuring the temperature of the stage, the temperature detection contact portion and the temperature detector are relatively moved and brought into contact with each other in a state where the stage is not rotating to detect the temperature of the stage.

Temperature measuring mechanism, temperature measuring method, and stage device

A substrate processing apparatus includes a processing chamber where a substrate support on which a substrate is placed and a target holder configured to hold a target are disposed, a freezing device disposed with a gap with respect to a bottom surface of the substrate support and having a chiller and a cold heat medium laminated on the chiller, and a rotating device configured to rotate the substrate support. The substrate processing apparatus further includes a first elevating device configured to raise and lower the substrate support, a coolant channel formed in the chiller to supply a coolant to the gap, and a cold heat transfer material disposed in the gap and being in contact with the substrate support and the cold heat medium so as to transfer heat therebetween.

Substrate processing apparatus and method

A sputtering device includes a processing chamber where a substrate is accommodated, and a slit plate that partitions the processing chamber into a first space where a target member is disposed and a second space where the substrate is disposed. The slit plate includes an inner member having an opening that penetrates therethrough in a thickness direction of the slit plate, and an outer member disposed around the inner member. The inner member is attachable to and detachable from the outer member.

Sputtering device

A stage device includes a stage configured to hold a target substrate in a vacuum chamber, a cold heat transfer body fixedly disposed below a bottom surface of the stage with a gap between the stage and the cold heat transfer body and cooled to an extremely low temperature by a chiller disposed below the cold heat transfer body, and cooling fluid supplied to the gap to transfer cold heat of the cold heat transfer body to the stage. The stage device further includes a stage support configured to rotatably support the stage and formed in a cylindrical shape to surround an upper part of the cold heat transfer body wherein the stage support has a vacuum insulation structure, and a rotation part configured to support the stage support and rotated by a driving mechanism while being sealed with magnetic fluid.

Stage device and processing apparatus

A stage device includes a stage configured to hold a target substrate in a vacuum chamber, a chiller having a cold head maintained at an extremely low temperature and a cold heat transfer body fixed in contact with the cold head and disposed below a bottom surface of the stage with a gap between the stage and the cold heat transfer body. The stage device further includes a heat insulating structure unit having a vacuum insulated structure and configured to surround at least the cold head and a connection portion between the cold head and the cold heat transfer body, cooling fluid supplied to the gap to transfer cold heat of the cold heat transfer body to the stage, and a stage support rotated by a driving mechanism and configured to rotatably support the stage.

A fixing unit fixes a plate-shaped member to a fixing base member. The fixing unit includes: a pressing unit configured to press the plate-shaped member toward the fixing base member; and a plurality of positioning units, installed at the fixing base member to be in contact with side surfaces of the plate-shaped member, and configured to place the plate-shaped member with respect to the fixing base member. Each of the positioning units includes: a shaft to be installed at the fixing base member; and a slide part movable along the shaft, and the slide part includes a contact part to be in contact with one of the side surfaces of the plate-shaped member and a clearance part formed on the contact part to have a smaller width than that of the contact part.

Fixing unit of plate-shaped member, PVD processing apparatus and fixing method of plate-shaped member

Provided is an electrostatic attraction apparatus in which a first insulating layer is formed on a base in an electrostatic chuck. A first portion of the first insulating layer extends on a first face of the base and a second portion of the first insulating layer extends on at least a portion of a second face of the base. An attraction electrode is formed on the first portion of the first insulating layer. A second insulating layer is formed on the first portion of the first insulating layer and the attraction electrode. A conductor pattern extends from the attraction electrode and provides a power supply terminal on the second portion of the first insulating layer. A contact part of a terminal member urged by an urging unit is in contact with the power supply terminal. The terminal member is connected with a wiring line connected to a supply power.

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Yamanashi, Japan

Shinji Orimoto