Matsushita Electric Works, Ltd.

Shinji Okamoto

Kazunari Yoshimura

Tomoharu Nakahara

Toshinori Fujii

A pattern inspection method capable of providing an improved inspection reliability includes the following steps. A pattern classification is set every pixel-value range of a reference-image data obtained from a reference pattern. Each of the pattern classifications has reference-data preparing parameters. With respect to each pixel of the reference-image data, pixel values of a pixel window which is composed of the pixel as a center pixel and neighbor pixels around the center pixel are checked to prepare a reference data. When all of the pixels in the pixel window are within a single pixel-value range, the center pixel is decided as a pattern uniform portion, and the reference data is prepared according to the parameters of a corresponding pattern classification. When all of the pixels in the pixel window are not within the single pixel-value range, the center pixel is decided as a pattern step portion, and internal and external pattern classifications are determined, so that the reference data is prepared according to the parameters of at least one of the internal and external pattern classifications. An inspection-image data of a pattern to be inspected is compared with the reference data to detect a defect of the pattern.

Pattern inspecting method and pattern inspecting device

An optical object profile measurement system utilizes a light beam to scan an object surface and a position detector which receives a light beam reflected from the object surface to obtain position data of individual scanned points on the object surface. The position data is processed to determine a profile of the object profile along the scanned points. The position detector comprises a number of light receiving elements arranged in at least two linear arrays each extending in the direction of following the light beam moving across the object surface and is divided into subdivisions having one or more of the light receiving elements. The arrays are disposed side-by-side to receive the light beam. In a first one of the arrays, the light receiving elements are designated by first values which have differing subdivisions such that the elements designated by the same first value are coupled to provide a single first output when any one of such elements detects the light beam. In a second one of the arrays, the light receiving elements are designated by the second values which are different within each subdivision but are common to those of the other subdivisions such that the elements designated by the same second values are coupled to provide a single second output when any one of such elements detects the light beam. The first and second values are combined to provide the position data in a coded form for surface profile analysis.

Optical measurement system for determination of an object profile

A method for drilling reference holes in a multi-layer printed wiring board assembly, in which drilling position marks provided on inner-layer circuit board in the assembly are roughly detected through each of two outer-layer boards of the assembly, a spot-facing is made with respect to the outer-layer boards at roughly detected points of the marks, and thereafter the marks are precisely detected at the faced spots. Positions for drilling the reference holes can be thereby determined at the spots precisely in close proximity to the internally provided drilling position marks, to allow the drilling performed very accurately in simpler and economical manner.

Method for drilling reference holes in multi-layer printed wiring board

A soldering inspection system wherein light is irradiated on a soldered part at different incident angles by a light emitting means to collect information indicative of three-dimensional configuration of the soldered part and discriminate whether or not the configuration is acceptable. The three-dimensional configurational information can be obtained with light irradiated at least from two positions mutually of different angles with respect to the soldered part, the inspection is thereby made from quantitative viewpoint, and a highly precise result of the inspection is obtainable.

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Yawata, Japan

Shinji Okamoto