Toyo Kohan Co., Ltd.

Toyota Jidosha Kabushiki Kaisha

Shinji Ohsawa

Kazuo Yoshida

Kinji Saijo

Hiroaki Okamoto

Kenji Kimura

Mitsuhiro Watanabe

Satoshi Aoyama

Kouji Nanbu

Yasuhiro Izawa

Tsutomu Seki

Koji Nanbu

A method of manufacturing a hydrogen separation membrane with a carrier is characterized by including a first step of providing, between the hydrogen separation membrane and the carrier that supports the hydrogen separation membrane, a low-hardness metal membrane having a hardness that is lower than the hardness of the hydrogen separation membrane, and a second step of joining the hydrogen separation membrane, the low-hardness metal membrane, and the carrier by a cold joining method. In this case, it is possible to suppress the deformation of the hydrogen separation membrane, the low-hardness metal membrane, and the carrier and, as a result, it is possible to prevent damaging of the hydrogen separation membrane. The adhesion of the contact between the hydrogen separation membrane and the carrier is also improved. The result is that it is not necessary to increase the severity of the cold joining conditions.

Hydrogen separation membrane with a carrier, fuel cell and hydrogen separation apparatus having same, and method of manufacturing same

A printed wiring board and a method for manufacturing the printed wiring board in which widths of a first and a second circuit are close to each other and substantial miniaturization can be achieved. In order to achieve this object, a first circuit and a second circuit having different thicknesses are formed in the same reference plane by etching a metal-clad laminate including a conductive layer and an insulating layer. The thicker of the circuits has a clad-like configuration in which three layers, a first copper layer/a different kind of metal layer/a second copper layer, are sequentially stacked. The manufacture of the printed wiring board includes a clad composite material in which three layers of a first copper layer/a different kind of metal layer/a second copper layer are sequentially stacked as a start material, and selective etching characteristics between the layers are utilized.

Printed wiring board and method for manufacturing printed wiring board

A multilayer printed wiring board having a wiring lead-out port has a signal circuit conductor perfectly covered by an earth circuit in its inside and a wiring lead-out port. A signal circuit conductor having a branch pattern is preferable. A large number of products can be easily manufactured with good size reproducibility. The multilayer printed wiring board is manufactured by selectively etching the copper of a cladding sheet manufactured by bonding a copper foil to a nickel foil with 0.1-3% reduction and forming a signal circuit conductor covered by an earth circuit and the wiring lead-out port.

Multilayer printed wiring board and method of manufacturing the same

An adhesive-free multilayered metal laminate having a given thickness which is obtained by bonding a metal sheet having a thin metal film on a surface thereof to a metal foil without using an adhesive; and a process for continuously producing the laminate. The process comprises the steps of; setting a metal sheet on a reel for metal sheet unwinding; setting a metal foil on a reel for metal foil unwinding; unwinding the metal sheet from the metal sheet-unwinding reel and activating a surface of the metal sheet to thereby form a first thin metal film on the metal sheet surface; unwinding the metal foil from the metal foil-unwinding reel and activating a surface of the metal foil to thereby form a second thin metal film on the metal foil surface; and press-bonding the activated surface of the first thin metal film to that of the second thin metal film so that the first thin metal film formed on the metal sheet is in contact with the second thin metal film formed on the metal foil.

Multilayered metal laminate and process for producing the same

A method for manufacturing a gas separating unit which comprises laminating a metal plate on a material capable of separating a hydrogen gas (palladium alloy foil) by cladding, etching selectively a central portion of a cut clad plate (K) using an etching solution, to thereby expose an underlying palladium alloy foil layer, and providing a metal supporting plate on the other side of the palladium alloy foil layer. The method allows the manufacture of a gas separating unit having an enhanced effective area of a material capable of separating a hydrogen gas and is excellent in the handlability of a material capable of separating a hydrogen gas during manufacturing.

Gas separating unit and method for manufacturing the same

A clad plate for forming an interposer for a semiconductor device which can be manufactured at low cost and has good characteristics, an interposer for a semiconductor device, and a method of manufacturing them. Copper foil materials () forming conductive layers () and nickel plating () forming etching stopper layers () are formed and pressed to form a clad plate () for forming an interposer for a semiconductor device. Thus, a clad plate () for forming an interposer for a semiconductor device is manufactured. The clad plate () is selectively etched to form a columnar conductor (), and an insulating layer () is formed on the copper foil material forming a wiring layer (). A bump () for connection of a semiconductor chip and the wiring layer () are formed on the opposite side to the side on which the columnar conductor () is formed. Thus, an interposer for a semiconductor device is manufactured.

Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them

A means for highly precisely and economically fabricating wiring on a semiconductor and highly precisely and economically forming a bump on an electrodes. () A semiconductor device comprising a semiconductor, a metal foil for fabricating wiring and conductor wiring on the semiconductor, and a method of fabricating a conductor wiring circuit on a semiconductor, comprising the steps of laying a metal foil for fabricating wiring on the electrode-forming side of the semiconductor, forming a resist wiring pattern by photo-etching the metal foil, etching the metal foil, and removing the resist to form the wiring. () A semiconductor device which comprises a multilayer metal foil for fabricating wiring in place of the metal foil for forming wiring of the semiconductor device described in (); and a method of fabricating conductor wiring having a bump on a semiconductor, comprising the steps of the method described in () and further comprising the steps of forming a resist pattern for forming the bump by photo-etching the multilayer metal foil for forming the wiring, forming a bump by selective etching, and removing an etch-stop layer.

Semiconductor device, metal laminated plate for fabricating circuit on semiconductor, and method of fabricating circuit

Clad board for printed-circuit board, multilayered printed-circuit board, and method of manufacture thereof

A method of manufacturing a high-quality metal foil/ceramics joining material ( ) and a metal foil laminated ceramic substrate ( ) which can prevent a damage to a ceramic material and enhance the productivity of the metal foil/ceramics joining material and the metal foil etched, are pressure-joined to ensure an easy and positive subsequent pressure-joining and the ceramic material ( ) can be prevented from being broken because the ceramics material ( ) is heated while being placed on a holder ( ) and is pressure-joined under a pressure of 1 kg/mm or lower.

Growing community of inventors

Yamaguchi-ken, Japan

Shinji Ohsawa