Rohm Co., Ltd.

Omron Corporation

Shinji Nakamura

Chojiro Kuriyama

Miki Hasegawa

Hideki Ando

Yui Tada

Takeshi Miura

Choujirou Kuriyama

Motonari Fujikawa

Syuichi Sugimoto

The capacitor element includes a porous chip body and an anode wire having an end portion embedded in the chip body. The chip body includes a surface provided with a dielectric film which in turn is formed with a solid electrolyte layer thereon. Further, the solid electrolyte layer is laminated with a cathode film. The chip body is formed by sintering a mixture of valve metal powder and a sintering inhibitor added as impurities. Similarly, the anode wire is made of valve metal containing a sintering inhibitor.

Capacitor element for solid electrolytic capacitor and method of making the same

A capacitor element includes an anode chip body formed by sintering valve metal powder, an anode wire projecting from an end surface of the anode chip body, and a ring member made of a water-repellent thermoplastic synthetic resin and fitted around a root portion of the anode wire connected to the anode chip body. The ring member is fitted and attached to the anode wire. The ring member adheres closely to both of the anode chip body and the anode wire without a gap by thermally melting the ring member in its fitted state around the anode wire.

Capacitor element for solid electrolytic capacitor, process of making the same and solid electrolytic capacitor utilizing the capacitor element

A sintered fuse is structured by forming a sintered body of metal powders into a wire form or a plate form. As for the metal powders, powders of the grain diameter of approximately a few &mgr;m, such as Cu or Al, can be used and different types of metal powders can be mixed. In addition, by interposing this sintered fuse ( ) between, for example, the negative electrode ( ) and the second external lead ( ), a solid electrolytic capacitor is formed. As a result, a fuse which melts at the same level of temperature as in a prior art can be obtained without utilizing toxic Pb and a solid electrolytic capacitor, which has this fuse built into it and which is safe and highly reliable, can be obtained.

Sintered fuse and solid electrolytic capacitor utilizing the same

A method for manufacturing an electronic component by seal-molding with resin a die pad mounted by an electronic element thereon and loads of input-and-output terminals which are supported by a lead frame having an outer frame and removing such sealed electronic component with mold materials from the outer frame of the lead frame which includes suspending pins for supporting the leads and a first mold holder disconnected from the leads, the method including the steps of resin molding a first mold member on the leads and the first mold holder to join the leads and the first mold member with the first mold member, cutting the suspending pins between the first mold member and the outer frame, resin-molding a second mold member on the first mold member to cover the cut ends of the suspending pins, and cutting the first mold holder between the second mold member and the outer frame to remove thus molded electronic component from the lead frame.

Molded electronic component

The use of a wire of a metal other than tantalum as a lead wire fixed to a chip formed by sintering tantalum powder is enabled. Prior to the formation of a dielectric film on a chip through anodic oxidation, an insulating material is applied to a surface of the lead wire fixed to the chip at a connection with the chip. With the application of the insulating material, a short circuit between the lead wire and a chemical conversion solution is prevented when the entire chip is drenched in the chemical conversion solution in anodic oxidation, so that a dielectric film of tantalum pentoxide is surely formed on the chip. As the lead wire, an arbitrary metal having conductivity may be used.

Method of manufacturing a tantalum solid state electrolytic capacitor

A solid electrolytic capacitor is provided which comprises a capacitor element including a porous sintered chip of metal particles, a solid electrolytic substance electrically insulated from the metal particles by a dielectric substance, an anode terminal layer electrically connected to the metal particles, and a cathode terminal layer electrically connected to the solid electrolytic substance. The capacitor element has a terminal portion located adjacent to the anode terminal layer and provided with barrier means for preventing the solid electrolytic substance from entering to the terminal portion.

Solid electrolytic capacitor and method of making the same

A solid electrolytic capacitor comprising a sintered body made of a valve metal having a terminal wire, a dielectric film, a metallic oxide layer, and a conductive polymer layer formed on the sintered body in this order is described. The polymer layer is so formed that it covers the entire surface of the sintered body. Methods of manufacturing a solid electrolytic capacitor provided with a conductive polymer layer are also described. In the electrolytic polymerization process, the wire attached to the sintered body is used as an anode terminal, and a conductive paste is applied to connect the terminal and a metallic oxide layer electrically over an insulating dielectric film in order for the polymerization to proceed. Electrolytic polymerization is also performed by forming a graphite layer beforehand, a part of which is made in contact with the terminal. Chemical polymerization in an acid environment is applicable, too.

Growing community of inventors

Kyoto, Japan

Shinji Nakamura