Tohoku Pioneer Corporation

Pioneer Corporation

Pioneer Oled Lighting Devices Corporation

Shinji Nakajima

Yuji Saito

Shinsuke Tanaka

Koji Fujita

Toshinao Yuki

Hirotsugi Hatakeyama

Yusuke Nakajima

Miho Sugimoto

A light emitting apparatus () includes a substrate (), an insulating layer (), a light emitting element (), a coating film (), and a structure (). The insulating layer () is formed over one surface of the substrate (), and includes an opening (). The light emitting element () is formed in the opening (). The coating film () is formed over the one surface of the substrate (), and covers a portion of the light emitting element (), the insulating layer (), and the one surface of the substrate (). The coating film () does not cover another portion of the substrate () (for example, a portion of an end portion: hereinafter, referred to as a first portion). The structure () is located between the first portion of the substrate () and the insulating layer (). The coating film () also covers the insulating layer ().

Light emitting apparatus

A first side surface () is positioned at a light emitting region () side. The first side surface () is inclined toward the light emitting region () with distance from the first surface () of the substrate (). A second side surface () is positioned opposite to the first side surface (). The second side surface () is inclined away from the light emitting region () with distance from the first surface () of the substrate (). A first upper surface () is positioned between the first side surface () and the second side surface (), and is substantially parallel to the first surface () of the substrate ().

Light emitting device

A light-emitting unit () is formed over a first surface () of a substrate (). A first terminal () and a second terminal () are formed on the first surface () of the substrate (), and are electrically connected to the light-emitting unit (). A sealing layer () is formed over the first surface () of the substrate (), and seals the light-emitting unit (). In addition, the sealing layer () does not cover the first terminal () and the second terminal (). A cover layer () is formed over the sealing layer (), and is formed of a material different from that of the cover layer (). In at least a portion of a region located next to the first terminal () and a region located next to the second terminal (), a portion of an end of the cover layer () protrudes from the sealing layer ().

Light-emitting device

An organic EL element () is formed on a substrate (), and an insulating layer () surrounds the organic EL element (). A conductive layer () is located between the substrate () and the insulating layer () in a thickness direction, and is across an edge () of the insulating layer () opposite the organic EL element (). The conductive layer () includes a first layer () and a second layer (). The second layer () is formed on the first layer (). The conductive layer () does not include a portion of the second layer () in a portion overlapped with the edge () of the insulating layer ().

A light emitting device () includes a substrate (), an organic EL element (), a buffer film (), and a sealing film (). The organic EL element () is formed over the substrate (). The sealing film () is located over the substrate () and over the organic EL element (), and seals the organic EL element (). In addition, the buffer film () is located between the organic EL element () and the sealing film (), and comes into close contact with the sealing film (). The sealing film () includes at least one layer formed of, for example, an oxide.

An organic EL panel including at least a light-emitting part and a sealing structure. The light-emitting part further includes at least an organic EL element formed on a substrate. The sealing structure further includes a sealing adhesive layer that contacts a coating film. The organic EL panel emits light from the light-emitting part through the substrate. The organic EL element includes at least the organic layer formed on a first electrode. The organic EL element further includes a second electrode formed on the at least one organic layer. The organic EL panel further includes the coating film coating the light-emitting part. A surface of the sealing adhesive forms a convex part formed by an inorganic material. A surface of the coating film forms a concave part that contacts the convex part.

Organic EL panel comprising a light-emitting part and a seal structure sealing the light-emitting part and method for manufacturing the same

An organic EL panel has a light-emitting part including one or a plurality of organic EL elements over a substrate and having a sealing structure sealing the light-emitting part. The organic EL element includes an organic layer formed on a first electrode, and a second electrode formed on the organic layer. The organic EL panel includes a coating film coating the light-emitting part. A contact object is arranged on an inner surface of the sealing structure. One or a plurality of convex parts is formed on the contact object. The coating film is formed to have a thickness larger than the length of the convex part.

Organic EL panel comprising a light-emitting part and a sealing structure sealing the light-emitting part and method for manufacturing the same

An organic EL panel includes a light-emitting part including one or a plurality of organic EL elements on a substrate and having a sealing structure sealing the light-emitting part. The organic EL element includes a light-emitting layer, an organic layer formed on a first electrode formed directly, or via another layer, on the substrate, and a second electrode formed on the organic layer. The organic EL panel includes a coating film formed on the substrate, directly at least on the second electrode, so as to coat the light-emitting part. The coating film is made of an amorphous organic material and has a thickness absorbing a surface irregularity of the contact object contacted by the surface of the coating film.

Organic EL panel and its manufacturing method

A self-emission panel and a method of manufacturing a self-emission panel which can prevent emission failures from occurring due to various factors, thereby achieving a self-emission panel that is free from emission failures. The self-emission panel is manufactured by forming a first conductive layer on a substrate directly or via other layers, forming a deposition layer including a luminescent layer on the first conductive layer, and forming a second conductive layer on the deposition layer. This manufacturing method includes: a first step of forming a sectioning layer for sectioning an opening for making a emission area on the first conductive layer after the formation of the first conductive layer; a second step of applying surface treatment to at least the surface of the first conductive layer inside the opening; and a third step of depositing a deposition layer on the first conductive layer given surface treatment in the second step.

Growing community of inventors

Yonezawa, Japan

Shinji Nakajima