Denso Corporation

Citizen Machinery Co., Ltd.

Shinji Mukota

Hitoshi Matsumoto

Satoru Yamaguchi

Hiromi Katou

Bahman Hossini Soltani

Hiroshi Kasuya

Umeo Tsuyusaki

Manabu Tomisaka

Satoru Akimoto

Yosuke Ando

Yasuo Ishihara

Satoshi Ishikawa

Shusaku Nakazawa

Tetsuji Yamaguchi

Toru Nitta

Kazufumi Aoki

Yuya Kato

Naoki Maruno

Kyohei Kotake

Provided is a surface processing apparatus and a surface processing method for a SiC substrate using anodization. The surface processing apparatus for the SiC substrate includes a surface processing pad and a power supply device. The surface processing pad includes a grinding wheel layer. The grinding wheel layer is disposed facing a workpiece surface of the SiC substrate. The power supply device passes a pulsed current having a period greater than 0.01 seconds and less than or equal to 20 seconds for anodizing the workpiece surface to be processed by the grinding wheel layer through the SiC substrate as an anode in the presence of an electrolyte.

Surface processing apparatus and surface processing method for SiC substrate

A method for machining a work in a work machining apparatus provided with a movable main spindle moving between a work supply position and a work take-out position, includes arranging a tool rest on the movable main spindle to move integrally with the movable main spindle, supplying the work at the work supply position to the movable main spindle, moving the movable main spindle from the work supply position toward the work take-out position, machining the work held on the movable spindle with a tool of the tool rest while moving the movable main spindle from the work supply position toward the work take-out position, and taking out the work at the work take-out position from the movable main spindle.

Work machining method

Cutting method for hard, brittle materials

Growing community of inventors

Kariya, Japan

Shinji Mukota