Teikoku Tsushin Kogyo Co., Ltd.

Teikoku Tsuhin Kogyo Co., Ltd.

Shinji Mizuno

Kozo Morita

Nobuyuki Yagi

Yasutoshi Kaku

Jiroh Inagaki

Nobuyuki Kikuchi

Atsushi Hari

Yasuo Kojima

Tatsuya Okamura

Kimitane Kimura

Daisuke Makino

Takashi Yamada

Naoki Fukuda

Shinichi Suzuki

Takashi Shinoki

Jiro Inagaki

Masahiro Kitahara

Yosutoshi Kaku

Akiko Yamanaka

Koji Mitsui

Shigemasa Takahashi

Katsutoshi Yanoshita

Kazutaka Nakagome

An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the flexible circuit board surrounding the light-emitting component placed thereon, whereby the electrodes of the light-emitting component and the terminal connection patterns of the flexible circuit board are connected in abutting contact with each other.

Mounting structure and method for mounting electronic component onto circuit board

An electronic component substrate (-) includes an insulating base () and a flexible circuit board () mounted on the insulating base (). The flexible circuit board () is a synthetic resin film provided thereon with terminal patterns () and a conductor pattern () whose surface is slidingly contacted with a slider. The insulating base () is a synthetic resin molded piece. The flexible circuit board () is insert-molded to the insulating base (). The electronic component substrate (-) is produced by preparing the flexible circuit board () and first and second mold members () having a cavity (C) with a shape that corresponds to the external shape of the electronic component substrate (-). Then, the flexible circuit board () is accommodated in the cavity (C) between the first and second mold members (), and the cavity (C) is filled with a molten molding resin. After the molding resin has solidified, the first and second mold members () are removed.

Electronic parts board and method of producing the same

A first film plateand a second film plate, each made of flexible resin film, are attached to a top surface and a bottom surface of a key topmade of mold-resin, respectively, so as to cover the key top. The first film plateis pressed upward to form a recessed portion, the key topis molded within this recessed portion. The second film plateis arranged on the bottom surface of the key top. All of the first film plate, the key top, and the second film plateare transparent. Decorative layersandare formed on the first film plateand the second film plate, respectively.

Key top plate

Key top plate and a method for manufacturing the same

A mount for electronic parts includes a flexible board made of a thermoplastic resin film and having electrically conductive patterns formed thereon, and an electrically conductive bonding agent for bonding terminals of the electronic parts to the conductive patterns. Some or all of the electronic parts to be mounted are resin-molded to the flexible board so as to be integrated therewith.

Mount for electronic parts

A molded resin casing of an electronic part equipped with a flat cable and internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part. A flexible board having various electric conductor patterns formed on a synthetic resin film is used as the board, the flexible board is formed integral with a flat cable including a synthetic resin film on which are formed electric conductor patterns electrically connected to the aforementioned various electric conductor patterns, and when the molded resin casing is molded by injecting a molten synthetic resin, the flexible board is inserted in such a manner that the electric conductor patterns are exposed within the casing, thereby integrating the flexible board and synthetic resin casing, with the flat cable extending outwardly from a side portion of the synthetic resin casing.

Method of making molded resin casing of electronic part with flat cable

Disclosed is a molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such a manner that the electric conductor patterns are exposed to the interior of the casing.

Molded resin casing of electronic part incorporating flexible board

A molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such as manner that the electric conductor patterns are exposed to the interior of the casing.

A molded resin casing of an electronic part equipped with a flexible flat cable and internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, includes a flexible board having various electric conductor patterns formed on a synthetic resin film used as the board. The flexible board is formed integrally with a flexible flat cable comprising a synthetic resin film on which are formed electric conductor patterns electrically connected to the aforementioned various electric conductor patterns. When the molded resin casing is molded by injecting a molten synthetic resin, the flexible board is inserted in such a manner that the electric conductor patterns are exposed within the casing, thereby integrating the flexible board and synthetic resin casing, with the flexible flat cable extending outwardly from a side portion of the synthetic resin casing.

Molded resin casing of electronic part with flexible flat cable

A flexible printed circuit board terminal structure includes a flexible printed circuit board composed of electrically conductive patterns formed on a flexible insulative film of a thermoplastic synthetic resin by the screen-printing of an electrically conductive coating, and an insulative coating of synthetic resin disposed on the insulative film on a portion thereof except for a terminal section defined at one edge. Metallic terminal members are placed on the electrically conductive patterns at the printed circuit board terminal section directly or through the intermediary of an electrically conductive adhesive, a terminal fixing film made of a thermoplastic synthetic resin having the same properties as the thermoplastic insulative film is placed on the terminal section from above the metallic terminal members, and predetermined portions of the thermoplastic insulative film and terminal fixing film, with the exception of portions at which the metallic terminal members are situated, are thermally fused.

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Kanagawa, Japan

Shinji Mizuno