Kabushiki Kaisha Toshiba

Toshiba Memory Corporation

Shinji Mikami

Ikuo Yoneda

Ryoichi Inanami

Tetsuro Nakasugi

Hirofumi Inoue

Masayuki Hatano

Takumi Ota

Takuya Kono

Hiroshi Tokue

Yohko Furutono

Certain embodiments provide an imprint recipe creating device comprising first to fifth creation units. The first creation unit creates inside-standard-shot information by use of filling amount information and residual film thickness information. The second creation unit creates first inside-substrate-surface information by use of shot position information, edge information, and the inside-standard-shot information. The third creation unit creates first correction information by use of unevenness information indicating unevenness in a substrate and unevenness distribution information indicating variations in depth of the unevenness inside the substrate surface. The fourth creation unit creates second correction information by use of post-process information indicating the variations in processing size. The fifth creation unit synthesizes the first inside-substrate-surface information, the first correction information and the second correction information, to create second inside-substrate-surface information.

Imprint recipe creating device and imprint device

In an imprint method of an embodiment, in the imprinting of an imprint shot including an outermost peripheral region of a substrate where resist is not desired to be entered at the time of imprinting, light curing the resist is applied to a light irradiation region with a predetermined width including a boundary between the outermost peripheral region and a pattern formation region more inside than the outermost peripheral region, whereby the resist which is to enter inside the outermost peripheral region is cured. Then, light curing the resist filled in a template pattern is applied onto a template.

Imprint method, imprint apparatus, and method of manufacturing semiconductor device

A template formed of an optically-transparent material according to an embodiment includes a contact surface which contacts a resist material, a concave portion for resist pattern formed on the contact surface in which the resist material is filled and cured so as to form a resist pattern part, and a concave portion for alignment mark formed on the contact surface which is used for an optical alignment of the template, includes an opening and a bottom portion and has a shape that an area of the opening is larger than that of the bottom portion or a shape that a depth thereof is deeper than that of the concave portion for resist pattern.

Template and method of manufacturing a semiconductor device

In one embodiment, an imprint apparatus includes a template holding part configured to hold a template for imprint. The apparatus further includes a template moving part configured to move the template to press the template onto a light curing resin on a transfer target substrate or to demold the template from the light curing resin. The apparatus further includes a light source configured to irradiate the light curing resin with light to cure the light curing resin. The apparatus further includes a demold control part configured to control a demold speed or a demold angle of the template, based on a position of a shot region from which the template is to be demolded, when demolding the template from the light curing resin.

Imprint apparatus and method

According to one embodiment, a droplet dispensing control method includes detecting an amount of positional deviation between a stage on which a substrate is mounted and a template as a template positional deviation amount and detecting an amount of positional deviation between a movement direction of the stage and a nozzle array direction as a nozzle positional deviation amount. The method further includes calculating a stage movement direction correction value and an ejection timing correction value of the imprint material as correction values for eliminating the positional deviation of the landing position of the imprint material. The method further includes controlling the movement direction of the stage using the stage movement direction correction value and controlling the ejection timing of the imprint material using the ejection timing correction value.

Droplet dispensing control method, droplet dispensing control device, and method of manufacturing semiconductor devices

An imprint method, in which pattern forming is performed by having a light curable material applied on a sample face of a substrate being a processing target hardened by being exposed to light in a state where the light curable material and a pattern formed surface of a template contact each other, the pattern formed surface having a concave-convex pattern formed thereon; wherein in one exposure performed with respect to a predetermined shot of the light curable material, an exposure amount at a light curable material on a first region which contacts a pattern formed region including the concave-convex pattern of the template is greater than an exposure amount at a light curable material on a second region which at least contacts a part of a pattern periphery region of the template, the pattern periphery region existing in a periphery of the pattern formed region of the template.

Imprint method and template for imprinting

A patterning method according to an embodiment of the present invention comprises: acquiring information about a surface state of an underlying film formed on a substrate; determining, based on the surface state, whether irregularity/foreign matter is present in each shot region in which a pattern is to be formed; and solidifying a resist agent while a first template, when it is determined that no irregularity/foreign matter is present in the shot region, or a second template that is different from the first template, when it is determined that irregularity/foreign matter is present in the shot region, is brought close to the underlying film on the shot region at a certain distance with the resist agent therebetween.

Patterning method

An imprint method includes contacting a template on a first substrate. The template includes a pattern to be transferred on the first substrate. The first substrate includes a first semiconductor substrate, and a first light curable resin coated on the first semiconductor substrate. The method further includes separating the template from the first substrate, and removing particles adhered on the template. The particle removal includes: pressing the template on an adhesive member which is distinct from the first substrate. The adhesive member includes a dummy substrate, a particle removing film formed on the dummy substrate and configured to remove the particles, and a second light curable resin coated on the particle removing film. The second light curable resin is thicker than the first light curable resin.

Imprint method

An imprint system has a design data storing section which stores template information and remaining film thickness set value information, a vaporization-to-be-compensated storing section which stores a plurality of distributions of applied amounts for compensating vaporization, an arithmetic section which calculates a distribution of an applied amount for filling a pattern based upon the template information, calculates a distribution of an applied amount for forming a remaining film thickness based upon the remaining film thickness set value information, calculates a pattern density of the template from the template information, extracts a distribution of an applied amount for compensating vaporization, corresponding to this pattern density, from the vaporization-to-be-compensated storing section, and adds up this extracted distribution of an applied amount for compensating vaporization, the distribution of an applied amount for filling a pattern, and the distribution of an applied amount for forming a remaining film thickness, to calculate a distribution of an applied amount of the imprint member, and an application section which applies the imprint member on the substrate based upon the distribution of an applied amount of the imprint member.

Imprint system and imprint method

A semiconductor device manufacturing method has forming a first resist pattern on the semiconductor substrate, and then, forming a first pattern on the semiconductor substrate by the use of the first resist pattern, and forming a second resist pattern on the semiconductor substrate by using an imprinter, and then, forming a second pattern on the semiconductor substrate by the use of the second resist pattern. The forming the first pattern, the first pattern smaller than a design pattern corresponding to the design data for forming a plurality of patterns on a semiconductor substrate being formed.

Semiconductor device manufacturing method

An imprint system has a design data storing section which stores template information and remaining film thickness set value information, a vaporization-to-be-compensated storing section which stores a plurality of distributions of applied amounts for compensating vaporization, an arithmetic section which calculates a distribution of an applied amount for filling a pattern based upon the template information, calculates a distribution of an applied amount for forming a remaining film thickness based upon said remaining film thickness set value information, calculates a pattern density of the template from the template information, extracts a distribution of an applied amount for compensating vaporization, corresponding to this pattern density, from the vaporization-to-be-compensated storing section, and adds up this extracted distribution of an applied amount for compensating vaporization, the distribution of an applied amount for filling a pattern, and the distribution of an applied amount for forming a remaining film thickness, to calculate a distribution of an applied amount of the imprint member, and an application section which applies the imprint member on the substrate based upon the distribution of an applied amount of the imprint member.

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Kawasaki, Japan

Shinji Mikami