Kabushiki Kaisha Shinkawa

Shinji Maki

Minoru Torihata

Nobuto Yamazaki

Kuniyuki Takahashi

Shinsuke Tei

Noriko Mori

Noriko Suzuki

A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point.

Wire bonding apparatus, record medium storing bonding control program, and bonding method

So as to achieve accurate detection of the bonding tool position in, for instance, a wire bonding apparatus, the positional relationship between a position detection camera and a reference hole formed in, for instance, a clamper is measured by imaging the reference hole by the position detection camera. The position detection camera and a bonding tool are moved by an XY table, and the tip end of the bonding tool is inserted into the reference hole. Then, the bonding tool is moved in the X and Y directions, and the contact of the bonding tool to an edge of the reference hole is detected based upon changes in the waveform of the ultrasonic vibrations applied to the bonding tool, thus measuring the positional relationship between the tool and the reference hole. The offset amount between the position detection camera and the bonding tool is then determined based upon the measured values and the amounts of movement of the bonding tool between the locations for such measured values.

Tool position measurement method, offset measurement method, reference member and bonding apparatus

A guide rail mechanism for a bonding apparatus for transferring a workpiece such as a lead frame, etc. including a pair of guide rails each comprising an edge surface guide rail element for guiding the edge surface of the workpiece and an undersurface guide rail element disposed beneath the edge surface guide rail element so as to support the undersurface of the edge portion of the workpiece. A driver for the undersurface guide rail element comprised of a rotational shaft with an eccentric cam portion and other parts is installed so as to move the undersurface guide rail element, thus changing the positional relationship between the edge surface guide rail element and the undersurface guide rail element for workpieces of different thicknesses.

Guide rail mechanism for a bonding apparatus

A guide rail mechanism used for, for instance, a die boding apparatus and a wire bonding apparatus, including a pair of guide rail sections that face each other and convey a workpiece such as a lead frame in between. The guide rail sections include rail height adjustment spacers held by spring force between guide rails and guide rail stands, and this rail height adjustment spacer is replaced for other rail height adjustment spacers of different thicknesses by moving guide rail raising-and-lowering shafts by way of overcoming the spring forces of the springs provided thereon, thus assuring the same upper surface height level of workpieces of different thicknesses to be conveyed.

A bonding apparatus including a pair of guide rails, a main heating block and a pair of pre-stage and after-stage heating blocks so as to heat a lead frame conveyed on the pair of guide rails, and the pre-stage and after-stage heating blocks can be moved in the direction of width of the lead frame together with one of the pair of guide rails and are installed so that they are positioned beneath the other frame guide rail.

Bonding apparatus with adjustable heating blocks, clamps, and rails

A device for applying tension to a bonding wire installed between a wire spool and a capillary of a wire bonding apparatus including a nozzle for blowing out a gas for applying tension to the wire and a single gas guide plate installed along the direction of the flow of the gas blown out of the nozzle so as to guide the gas to the bonding wire.

Wire bonding apparatus

A non-contact type moving table including a guide table having a flat guide surface at the top and a moving table which is placed on the guide table and has a moving surface which faces the guide surface of the guide table. The moving table has air blowing openings that blow out compressed air towards the guide surface of the guide table and air suction openings sucking air from the guide surface of the guide table, thus obtaining a single plane, non-contact type bearing or supporting system via the guide surface and the moving surface. As a result, the structure is simple and overall size can be small with low manufacturing costs. In addition, a wide range of materials can be used to build the moving table system.

Non-contact type moving table

A non-contact type moving table including a guide table having a flat guide surface at the top and a moving table which placed on the guide table and has a moving surface which faces the guide surface of the guide table. The moving table has air blowing openings that blow out compressed air towards the guide surface of the guide table and air suction openings sucking from the guide surface of the guide table, thus obtaining a single plane, non-contact type bearing or supporting system via the guide surface and the moving surface. As a result, the structure is simple and overall size can be small with low manufacturing costs. In addition, a wide range of materials can be used to build the moving table system.

A non-contact type moving table system comprising a guide table and a moving table. The guide table and the moving table have air holes and vacuum holes on the surfaces facing each other, and compressed air is blown out of the air holes so that a space is created between the moving table and the guide tale, thus the moving table can move above the guide table without making contact with the guide table. In addition, vacuum suction is applied between the guide table and the moving table so that the moving table is stabilized on the guide table. Several modifications are obtained by combining pairs of the guide table and the moving table so that the moving table is moved in any desired horizontal direction. The non-contact type moving table can be simple in structure, compact in size, light in weight and is manufactured at low costs.

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Fussa, Japan

Shinji Maki