Dai Nippon Printing Co., Ltd.

Shinji Kumon

Terutoshi Momose

Yoichi Hitomi

Katsuya Sakayori

Yoichi Miura

Tsuyoshi Yamazaki

Kiyohiro Takachi

Hiroaki Miyazawa

A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3&#xd7;10/% RH and 30&#xd7;10/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5&#xd7;10/% RH or less.

Substrate for suspension, process for producing the same, suspension for magnetic head, and hard disk drive

A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.

Substrate for suspension

Growing community of inventors

Kitamoto, Japan

Shinji Kumon