Tokyo Electron Limited

Shinji Koga

Norihisa Koga

Naoto Yoshitaka

Akira Nishiya

Hiroshi Tomita

Shinji Nagashima

Shuji Iwanaga

Takeshi Tamura

Hiroyuki Miyamoto

Shizuo Ogawa

Akinori Miyahara

According to an embodiment of the present disclosure, an apparatus of inspecting an overlapped substrate obtained by bonding substrates together is provided. The apparatus includes a first holding unit configured to hold and rotate the overlapped substrate, and a displacement gauge configured to measure displacements of peripheral sides of a first substrate and a second substrate constituting the overlapped substrate while rotating the overlapped substrate held by the first holding unit.

Inspection device, bonding system and inspection method

A drain port and an exhaust port arranged at the bottom of a cup surrounding a substrate holding unit. A drainage tray is arranged below the cup so as to cover the moving area of the drain port when the substrate holding unit and the cup move in X-directions and Y-directions. An exhaust unit is arranged at a position corresponding to the position of the exhaust port of the cup when the substrate holding unit is in its spin-drying position. The exhaust unit is connected to the exhaust port to suck the interior of the cup when the spin-drying of the substrate is executed. The use of a flexible tube which is always connected to the exhaust port is no longer necessary.

Laser treatment apparatus

Before applying a processing laser beam to a surface of a substrate through a film of liquid, distance Mbetween a reference point on an axis of a first laser displacement meter and the surface of the substrate is measured to correct distance Mbetween a lower end of an optical unit and the surface of the substrate, on the basis of distance M, the processing laser beam is applied to the surface of the substrate, thereby cutting and removing a part of the surface of the substrate, and a depth to which the surface of the substrate has been cut and removed with the processing laser beam is measured by a second laser displacement meter.

Laser processing apparatus and laser processing method for cutting and removing a part of a surface region of a substrate

A notch or the like of a wafer is detected via a guide member by means of a CCD camera provided so that an optical axis is coaxial to an optical axis of a laser beam, and alignment of the wafer is carried out. Next, in a state in which liquid ejected from a main nozzle or sub-nozzles is guided by means of the guide member, a laser beam whose optical axis is provided to be coaxial to the optical axis of the CCD camera is irradiated via the guide member. In addition, a predetermined processing operation is carried out with respect to the surface while an irradiation position of the laser beam is moved in a horizontal direction. The wafer is then transported from a chuck to the outside, and then, a purge gas is supplied to a bottom face of the guide member, and the bottom face is dried.

Laser processing apparatus and laser processing method

A laser processing apparatus comprises a laser source, a substrate-holding unit, a liquid-supplying unit, a support which has a plurality of mask patterns including a specific mask pattern for imparting a cross-sectional shape to the laser beam, and a support-driving mechanism which moves the support. The liquid-supplying unit supplies the liquid to the substrate, forming a liquid film thereon. The support-driving mechanism moves the support, aligning the specific mask pattern with an axis of the laser beam. The laser beam emitted from the laser unit passes through the specific mask pattern, acquiring a specific cross-sectional shape, and is applied to the substrate through the liquid film, illuminating.

An apparatus for forming a coating film comprising, a coating unit for forming a coating film by applying a coating solution onto a substrate, and a curing unit for curing the coating film by applying a heating and a cooling to the substrate, in which, the curing unit comprises a heating chamber having a hot plate for heating substrates having the coating solution applied thereon one by one, a cooling chamber communicated with the heating chamber and having a cooling plate for cooling the substrates processed with heat, an inert gas supply mechanism for supplying an insert gas to the heating chamber and the cooling chamber, and an evacuation mechanism for evacuating each of the heating chamber and the cooling chamber.

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Kikuchi-gun, Japan

Shinji Koga