Screen Holdings Co., Ltd.

Dainippon Screen Mfg. Co., Ltd.

Shinji Kiyokawa

Ichiro Mitsuyoshi

Jun Shibukawa

Tomohiro Kurebayashi

Takeshi Takada

Kenji Kamei

Nobutoshi Orgami

A substrate processing apparatus has an indexer block and a processing block. One side of the processing block has a vertical stack of a plurality of top surface cleaning units and the other side of the processing block has a vertical stack of a plurality of back surface cleaning units. Reversing units for reversing the substrate W are provided one above the other between the indexer block and the processing block. For example, one reversing unit is used for reversing the substrate before a back surface cleaning processing by the back surface cleaning unit or for other purposes, and the other reversing unit is used for placing the substrate W after a top surface cleaning processing by the top surface cleaning unit or for other purposes.

Substrate processing method

A substrate processing apparatus is composed of an indexer block, a first processing block and a second processing block that are provided in parallel with one another. The indexer block is provided with an indexer robot. The first processing block is provided with a plurality of back surface cleaning units and a first main robot. The second processing block is provided with a plurality of end surface cleaning units, a plurality of top surface cleaning units and a second main robot.

Substrate processing apparatus

A substrate processing apparatus includes: a brush for cleaning a substrate; a seesaw member which is swingable with a support member serving as a fulcrum and which has a force point section at one side with respect to the fulcrum and an actuating point section at the other side with respect to the fulcrum; a pushing actuator arranged to give a driving force to the force point section of the seesaw member, thereby to swing the seesaw member around the fulcrum, thus giving, to the seesaw member, a pushing force for pushing the brush to the substrate; and a transmission member which has an affected point section for receiving, from the actuating point section of the seesaw member, a driving force given to the force point section, and which transmits, to the brush, a pushing force for pushing the same to the substrate.

A periphery exposing apparatus for exposing a periphery of a wafer having a curved circumferential peripheral portion and a linear portion comprises a spin chuck for rotatably supporting the wafer, a light source disposed above the spin chuck for exposing the wafer periphery, and a detector for detecting the line or portion. When the linear portion is being exposed, the light source is moved along the linear portion, rather than circularly around the periphery.

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Kyoto, Japan

Shinji Kiyokawa