Asahi Glass Company, Limited

Shinji Honda

Hideaki Hayashi

Kenji Imakita

Masamichi Tanida

Yasuko Osaki

Katsuyoshi Nakayama

Yuki Yokoyama

Akihiro Hishinuma

Rui Yanagawa

Kazuyoshi Orihara

Takashi Ootsuki

To provide a light emitting diode package of which the height of protrusion of a thermal via is decreased without decreasing the flexural strength of an insulating substrate. A light emitting diode package comprising a light emitting diode element mounted on a substrate, wherein the substrate is obtained by firing a glass ceramic composition containing a powder of glass containing, as represented by mole percentage, from 57 to 65% of SiO, from 13 to 18% of BO, from 9 to 23% of CaO, from 3 to 8% of AlOand from 0.5 to 6% of at least one of KO and NaO in total, and a ceramic filler.

Light emitting diode package

To provide a glass containing little BO, whereby when its powder is fired, its thermal expansion curve does not have an inflection point, a non-lead glass is provided containing, as represented by mol % based on the following oxides, from 35 to 41.5% of SiO, from 8 to 25% of MgO, more than 27 to 35% of CaO, from 0 to 2% of SrO, from 0 to 4% of BaO, from 5 to 15% of ZnO and from 4.5 to 10% of AlO, wherein the total content of these components is at least 97%, and when SrO and BaO are contained, the total content of SrO and BaO is at most 2%; as well as a non-lead glass containing, as represented by mol % based on the following oxides, from 39.5 to 41.5% of SiO, from 10 to less than 13% of MgO, from 18 to 22% of CaO, more than 12 to 15% of SrO, from 0 to 1% of BaO, from 6 to 11% of ZnO and from 4.5 to 7% of AlO, wherein the total content of these components is at least 97%.

Non-lead glass

Growing community of inventors

Koriyama, Japan

Shinji Honda