Denso Corporation

Shinji Hiramitsu

Masayuki Takenaka

Hiroshi Ishino

Noriyuki Kakimoto

Tetsuto Yamagishi

Toshihiro Nagaya

Shunsuke Arai

Takuo Nagase

Hideki Kawahara

Syunsuke Arai

A semiconductor device has a joint part in which a first conducting part and a second conducting part are joined by a joint material. The first conducting part has a high wettability region and a low wettability region in a surface opposite to the second conducting part. The low wettability region is adjacent to the high wettability region to define an outer periphery of the high wettability region and has wettability lower than the high wettability region to the joint material. The high wettability region has an overlap region overlapping a formation region of the joint part in the second conducting part in a planar view, and a non-overlap region connected to the overlap region and not overlapping the formation region of the joint part in the second conducting part. The non-overlap region includes a holding region capable of holding the joint material that is surplus for the joint part.

Semiconductor device

A semiconductor device includes: multiple semiconductor elements each having a one surface and a rear surface in a plate thickness direction; a first member that sandwiches the multiple semiconductor elements and is electrically connected to an electrode on the one surface; a second member electrically connected to an electrode on the rear surface; and multiple terminals that are continuous from the first or second member. An area of the second member is smaller than that of the first member. Semiconductor elements are arranged in a longitudinal direction of the second member. The semiconductor device further includes a first joint portion that electrically connects each semiconductor element and the second member and a second joint portion that electrically connects a terminal and the second member. The multiple solder joint portions are symmetrically placed.

Plurality of chips between two heat sinks

In a semiconductor module, two switching elements are connected in parallel to each other. Each of the switching elements includes a first main electrode formed on one surface side, and a second main electrode and a gate electrode formed on a rear surface side opposite to the one surface side. A first conductor plate is coupled with two first main terminals at first coupling portions and is electrically connected with the first main electrodes. A second conductor plate is coupled with one second main terminal at a second coupling portion and is electrically connected with the second main electrodes. The second coupling portion is disposed between the switching elements in an alignment direction of the switching elements, and the first coupling portions are provided on both sides of the second coupling portion in the alignment direction.

Semiconductor module

In a semiconductor device, a first semiconductor chip and a second semiconductor chip are aligned in a direction orthogonal to a plate thickness direction of the first semiconductor chip. A pair of first heat sinks is disposed on opposite sides of the first semiconductor chip in the first direction, and a pair of second heat sinks disposed on opposite sides of the second semiconductor chip in the first direction. The semiconductor chips and the heat sinks are sealed in a resin molded body. A plurality of main terminals are aligned in the second direction and project from a same side surface of a resin molded body. The main terminals includes a positive electrode terminal, a negative electrode terminal, an output terminal, and an auxiliary terminal. The first relay members are disposed in the resin molded body, and electrically connecting the main terminals and the corresponding heat sinks.

Semiconductor device configuring upper and lower arms including auxiliary terminals

In a semiconductor device, a plurality of semiconductor chips included in an upper-arm circuit are connected in parallel between a pair of upper-arm plates, while a plurality of semiconductor chips included in a lower-arm circuit are connected in parallel between a pair of lower-arm plates. In each of the arm circuits, the plurality of semiconductor chips are arranged in a direction perpendicular to a direction in which emitter electrodes and pads are arranged, the pads are disposed on the same side of the emitter electrodes, and signal terminals extend in the same direction. A series-connecting part between the upper- and lower-arm circuits includes a joint partcontinued to respective side surfaces of the corresponding upper- and lower-arm plates. Each of inductances of respective parallel-connecting parts of the upper- and lower-arm plates which connect the semiconductor chips in parallel is smaller than an inductance of the series-connecting part.

An electronic device includes: a resin substrate that includes insulation resin on which wiring made of conductive material is provided; a heat-generation element that is a circuit element mounted on a first surface of the resin substrate, and is operated to generate heat; and a sealing resin that is provided on the first surface, and seals the heat-generation element. An opposite surface of the sealing resin opposite to a surface of the sealing resin in contact with the first surface is thermally connected to a heat radiation member and mounted on the heat radiation member. Each of the resin substrate and the sealing resin has a bend shape convex toward the opposite surface when each of surrounding temperatures is a normal temperature and has a linear expansion coefficient for maintaining a bend shape convex toward the opposite surface when each of the surrounding temperatures is a high temperature.

Electronic device having sealed heat-generation element

A manufacturing method of an electronic device, including: a circuit board with a substrate through hole; a circuit element; and a resin mold with a mold through hole, using a first mold, a second mold having a cavity, and a pressing member protruding from a bottom of the cavity includes: fixing the circuit board to the first mold; fixing the second mold to the first mold to cover an opening of the substrate through hole by the pressing member; and forming the resin mold while covering the circuit element with the constituent material in the cavity. The circuit board is deformed by press-contacting the pressing member to the circuit board in a state where a part of the pressing member is inserted into the substrate through hole so that an opening area of the substrate through hole decreases toward a reverse surface from the one surface.

Method for manufacturing electronic device, and electronic device

A power converter includes: a circuit board having an insulating substrate and a plurality of wirings in the insulating substrate; and first and second switching elements on a first surface of the circuit board that are connected in series. The first switching element has first and second electrodes. The second switching element has a third electrode and a fourth electrode. The circuit board has a first wiring connected to the first electrode, a second wiring connected to the second and third electrodes, a third wiring connected to the fourth electrode, a fourth wiring as an output wiring connected to the third electrode, and a fifth wiring connected to the third wiring. The first, second, third and fourth wirings are arranged in order on the first surface, and the fifth wiring on a second surface opposite to the first surface is opposed to the first, second, and third wirings.

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Kariya, Japan

Shinji Hiramitsu