Nec Tokin Corporation

Nec Tokin Toyama, Ltd.

Other

Shinji Arai

Kenji Araki

Toshihisa Nagasawa

Akihiro Kawai

Hitoshi Takata

Takahiro Kayamori

Katsuhiro Yoshida

Tadamasa Asami

Fumio Kida

Masahiko Tanaka

Takeshi Saitou

Yuuichi Maruko

Sadamu Toida

Masao Hinazuru

Osamu Funaya

An electrically conductive polymer composition contains an electrically conductive polymer obtained by using a polymer in the form of cations composed of repeating structural units of 3,4-ethylene dioxythiophene and polystyrene sulfonic acid as anions and further contains naphthalene sulfonic acid as an additive. A solid electrolytic capacitoror a surface-mount transmission line elementhas a polypyrrole conductive polymer layeras a first solid electrolyte and a poly(3,4-ethylene dioxythiophene) conductive polymer layeras a second solid electrolyte.

Electrically conductive polymer composition and solid electrolytic capacitor using the same

A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.

Surface-mount capacitor and method of producing the same

A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portionsat opposite ends thereof and a cathode portionat the center, an anode terminalconnected to each anode lead portionvia a strip-like plate, and a cathode terminalconnected to the cathode portion. The anode and the cathode terminalsandhave a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin casehas a bottom portion filling a gap between the anode and the cathode terminalsandand mechanically connecting the anode and the cathode terminalsand, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminalsandhave upper surfaces exposed on an inner bottom surface of the mold resin caseto be connected to the anode lead portionsand the cathode portion

A solid electrolytic capacitor having at least two capacitor elements using a valve action metal, such as tantalum or niobium, and laminated in a direction perpendicular to a mounting surface of a substrate. The capacitor elements have a width parallel to the mounting surface of the substrate greater than a thickness perpendicular to the mounting surface of the substrate, and an anode terminal is connected with anode leads led out to at least one side of an anode body made of the valve action metal generally in parallel to the mounting surface of the substrate. A cathode layer on a dielectric oxide film of the anode body is connected to a cathode terminal and is coated with exterior coating resin with a part of the anode terminal and a part of the cathode terminal exposed.

Solid electrolytic capacitor and method of manufacturing the same

A solid electrolytic capacitor is provided in which non-conductive particles are made to be present between a dielectric layer and an electrolyte layer. A second electrolyte layer is formed of a conductive polymer including graphite particles and non-conductive particles.

Solid electrolytic capacitor and method of producing the same

A chip-type solid electrolytic capacitor having two capacitor elements using a valve metal and laminated in a direction perpendicular to a mounting surface to be mounted on a substrate. A pair of anode lead wires are extracted on one side from anode members of the capacitor elements in parallel to the mounting surface. The anode lead wires are connected to two branches of an anode terminal portion, respectively. A cathode terminal is connected to cathode layers on dielectric oxide films of the anode members. The solid electrolytic capacitor is encapsulated in an encapsulating resin with the anode terminal and the cathode terminal partially exposed. The branches of the anode terminal portion are configured so that they overlap each other by rotation of 180&deg; around a center line.

Chip-type solid electrolytic capacitor having a terminal of a unique shape and method of producing the same

A solid electrolytic capacitor is disclosed which combines low LC with Low ESR and which has good characteristics even in a high frequency range, and a method for preparing the same is also disclosed. In the solid electrolytic capacitor whose electrolytic layer contains electrically conductive particles, non-conductive particles are present in at least a part of an interface between a dielectric layer and the electrolyte layer. By employing the structure, local intensifications of field strength in the dielectric layer are prevented to enable a problem of increase in LC to be overcome while keeping ESR low. By the method which comprised a step of applying a colloidal dispersion containing the non-conductive particles in the form of colloidal particles to the post-electrolytic layer formation step product, the solid electrolytic capacitor having the above-mentioned structure can be prepared efficiently.

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Toyama, Japan

Shinji Arai