Canon Kabushiki Kaisha

Shinichiro Watanabe

Shinan Wang

Yasuhiro Shimada

Takahisa Kato

Takayuki Teshima

Kazutoshi Torashima

Takashi Nakamura

Yutaka Setomoto

Youichi Fukaya

Yasushi Mizoguchi

Toru Nakakubo

Atsushi Kandori

Kazunari Fujii

Takahiro Akiyama

Toshifumi Yoshioka

Yoshinori Tateishi

Suguru Miyagawa

Yasuhiro Soeda

A manufacturing method of a semiconductor apparatus includes preparing an intermediate member that includes a first member having a first substrate comprising a semiconductor element formed thereon, a second member having a second substrate, the second substrate including a part of a circuit electrically connected to the semiconductor element and having a linear expansion coefficient different from that of the first substrate, and a third member having a third substrate showing such a linear expansion coefficient that a difference between itself and the linear expansion coefficient of the first substrate is smaller than a difference between the linear expansion coefficients of the first substrate and the second substrate, and includes bonding the first member and the second member together. A first bonding electrode containing copper electrically connected to the semiconductor element and a second bonding electrode containing copper electrically connected to the circuit are bonded together.

Manufacturing method of semiconductor apparatus and semiconductor apparatus

An element configured to oscillate or detect an electromagnetic wave, the element comprising: a first dielectric portion having cylindrical shape and including a loop antenna on a first end surface thereof; a second dielectric portion connected to a second end surface of the first dielectric portion which is different from the first end surface; and an electrode portion which is disposed between the second dielectric portion and a substrate and is configured to reflect the electromagnetic wave.

Element for oscillating or detecting an electromagnetic wave and element manufacturing method

A liquid ejection head includes a first substrate and a second substrate. The first substrate includes a pressure chamber communicating with an ejection port that ejects liquid, a diaphragm that forms part of a wall constituting the pressure chamber, and at least one piezoelectric element configured to generate energy for displacing the diaphragm to eject liquid through the ejection port. The second substrate has a cavity containing the piezoelectric element. The first substrate and the second substrate are joined together with an adhesive. A liquid repellent portion surrounding the piezoelectric element is disposed on a surface of the first substrate where the piezoelectric element is disposed.

Liquid ejection head

A probe is provided in which penetration of an acoustic medium into a support layer of an optical reflection member through a pinhole or a scratch on an optical reflection layer is suppressed, occurrence of a solvent crack is suppressed, and noise due to photoacoustic waves that occurs on a receiving surface can be suppressed. The probe includes an element having at least one cell in which a vibration film containing one electrode out of two electrodes that are provided so as to interpose a space therebetween is vibratably supported. The probe further includes a support layer disposed on the vibration film, and an optical reflection layer disposed on the support layer. A protection layer against an acoustic medium is formed on the optical reflection layer.

Probe and object information acquisition apparatus using the same

According to a method for manufacturing a device in which an electrode of an element is electrically connected to a penetrating wire in a substrate, a structure is prepared in which the element is arranged on the first substrate having a through hole formed therein: and a second substrate is prepared which has an electroconductive seed layer formed thereon. Then, a wall part is formed on the first substrate; a seed layer is joined to a face on an element side of the structure through a bonding layer; the bonding layer is removed; and the seed layer is exposed in the inside of the opening. The inside of the wall part and the through hole is filled with a conductor, with the use of the seed layer through electrolytic plating.

Device having element electrode connected to penetrating wire, and method for manufacturing the same

The present inventions provide a capacitive transducer that can reduce film damage on a substrate surface on a vibration film side due to a difference in thermal expansion coefficient between a through wiring and a substrate and a method of manufacturing the same. The capacitive transducer consists of a plurality of cells with each cell comprising a first electrode and a vibration film on a first surface side of a substrate having a through wiring that penetrates the substrate from a first surface to a second surface of the substrate, the vibration film including a second electrode that is formed with a gap from the first electrode. A holding member that holds a leading end of the through wiring is provided on the first surface side of the substrate.

Capacitive transducer and method of manufacturing the same

A microstructure manufacturing method includes forming a first insulating film on an Si substrate, exposing an Si surface by removing a part of the first insulating film, forming a recessed portion by etching the Si substrate from the exposed Si surface, forming a second insulating film on a sidewall and a bottom of the recessed portion, forming an Si exposed surface by removing at least a part of the second insulating film formed on the bottom of the recessed portion, and filling the recessed portion with a metal from the Si exposed surface by electrolytic plating.

Microstructure manufacturing method

Provided is a method of manufacturing an element substrate, including: forming first and second resists on a predetermined surface of a substrate so that part of the predetermined surface is exposed; etching the substrate with the first and second resists being used as a mask to form a first recess in the substrate; removing the second resist to expose a portion of the substrate that is different from the first recess; etching the substrate with the first resist being used as a mask to deepen the first recess and to form a second recess communicating with the first recess in the substrate; and covering openings of the first and second recesses with an orifice forming member to form a pressure chamber by the first recess and an orifice forming member and to form a flow reducing portion by the second recess and the orifice forming member.

Method of manufacturing element substrate

A microstructural body includes a substrate such as an electrode substrate, a support portion, one post that fixes the support portion to the substrate, a frame-shaped movable portion provided around outer periphery of the support portion, and an elastic support portion that elastically connects the movable portion and the support portion. The elastic support portion supports the frame-shaped movable portion such that the movable portion is movable relative to the support portion. The elastic support portion includes torsion springs and an elastically deformable connecting portion.

Microstructural body and production method therefor

A swing member device comprises a swingable part supported by a supporting part to be swingable around a torsional axis on a supporting base in at least one intrinsic oscillation mode: the swing member device having a temperature-raising unit for raising the temperature of ambient atmosphere in the region of swing motion of the swingable part, the temperature-raising unit raising the temperature of the ambient atmosphere to enable decrease of an influence of an unsteady dragging force caused by the ambient atmosphere.

Swing member device, and optical deflector and image-forming apparatus employing the swing member device

An oscillator device includes a first oscillator, a second oscillator configured to support the first oscillator for torsional rotation about a first rotational axis, through a first torsion spring, a supporting member configured to support the second oscillator for torsional rotation about a second rotational axis, through a second torsion spring, the second rotational axis having a predetermined angle with respect to the first rotational axis of the first oscillator, a coil disposed in relation to the second oscillator, an electrical current applying member configured to apply an electrical current to the coil, and a magnetic field generating member configured to apply a magnetic field to the coil. The coil is localized in at least one of zones of the second oscillator being quartered by extension lines of the first and second rotational axes.

Oscillator device, method of driving the same, optical deflector and image display device using the same

An oscillator device includes a supporting base plate, a supporting member, a movable plate supported by the supporting member for oscillating motion relative to the supporting base plate, a first functional device having a first function, a second functional device having a second function, a first wiring connected to the first functional device and formed on a first surface of the supporting member, and a second wiring connected to the second functional device and formed on a second surface of the supporting member different from the first surface thereof where the first wiring is formed, such that the width of the wirings on the supporting member can be made wide.

Growing community of inventors

Kawasaki, Japan

Shinichiro Watanabe