Tokyo Electron Limited

Shinichiro Takase

Toshihiro Yonezawa

Jun Mochizuki

Kunihiro Furuya

A probe card according to the present invention includes a support plate for supporting probes that contact an object to be inspected, a circuit board, a holding member for holding a lower surface of an outer peripheral portion of the support plate, and an abutting member disposed between the lower surface of the outer peripheral portion of the support plate and the holding member and protruding upward to abut to the lower surface of the outer peripheral portion of the support plate. Accordingly, horizontal expansion of the support plate itself is allowed, and at the time of inspecting electrical characteristics of the object to be inspected, even though the temperature of the support plate is increased and the support plate expands, the support plate can expand in a horizontal direction, thereby suppressing vertical deformation of the support plate.

Probe card having a structure for being prevented from deforming

A reinforcing member is formed at a top surface side of a probe card including a support plate for supporting a contactor and a circuit board. A plurality of long guide holes are formed in an outer peripheral portion of the reinforcing member. Fixing members fixed to a holding member and collars formed around outer circumferences of the fixing members are formed in the guide holes. A length in a longitudinal direction of each of the guide holes is greater than a diameter of each of the collars, and a central line in the longitudinal direction of each of the guide holes passes through a center of the reinforcing member. Due to the guide holes, horizontal expansion of the reinforcing member itself is allowed.

Probe device having a structure for being prevented from deforming

A plurality of metal plates and an insulating plate having a polished surface are laminated in a probe supporting plate. Through-holes into which probes are to be inserted are respectively formed in the metal plates and the insulating plate. Diameters of the through-holes are greater than diameters of the through-holes, and the through-holes pass through the probe supporting plate in a thickness direction of the probe supporting plate. Hollow portions passing through the probe supporting plate in the thickness direction of the probe supporting plate are formed in the probe supporting plate. Each of the hollow portions is formed by connecting each of holes formed in each of the metal plates and each of holes formed in the insulating plate. Diameters of holes of a metal plate that is an uppermost layer, holes of a metal plate that is a lowermost player, and holes of a metal plate that is one of intermediate layers are less than diameters of holes of metal platesthat are the other intermediate layers.

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Nirasaki, Japan

Shinichiro Takase