Fujitsu Corporation

Shinichiro Maki

Fumitoshi Fujisaki

Kazuto Tsuji

Masafumi Tetaka

Masanori Onodera

Yoshiyuki Yoneda

Hideharu Sakoda

Masaki Waki

Seiichi Orimo

Yukio Saigo

Kenji Itasaka

Terumi Kamifukumoto

Nobuo Ooyama

Yasuo Yatsuda

Youichi Matae

Atsushi Yano

Nobuo Ohyama

Akihiro Shigeno

Ryoichi Yokoyama

Masao Fukunaga

Masao Takehiro

Syunichi Kuramoto

The present invention relates to a leadless surface-mount resin-sealing semiconductor device and a manufacturing method thereof; in a semiconductor device comprising a semiconductor element, a resin package sealing this semiconductor element, a terminal formed on a mount side of this resin package so as to protrude thereon, and a wire electrically connecting this terminal and an electrode pad on the semiconductor element to each other, a heat sink dissipating heat generated in the semiconductor element is provided on an undersurface of the semiconductor element so as to improve a heat-dissipation property.

Semiconductor device, method of manufacturing semiconductor device, lead frame, method of manufacturing lead frame, and method of manufacturing semiconductor device with lead frame

A semiconductor device and a method of producing the same are provided. The semiconductor device includes: a semiconductor chip; a resin package which seals the semiconductor chip; signal passages which guide the signal terminals of the semiconductor chip outward from the resin package; a grounding metal film in contact with the bottom surface of the semiconductor chip; and a grounding passage which is connected to the grounding metal film and guided outward from the resin package.

Semiconductor device and method of producing the same

There is provided a method for fabricating semiconductor devices including resin packages sealing semiconductor elements and external connection terminals respectively resin projections formed on the resin packages and metallic film parts provided to the resin projections. The semiconductor elements are mounted to a lead frame having recess portions located in positions corresponding to positions of the resin projections, metallic film parts being provided in the recess portions. The semiconductor elements are electrically connected to the metallic film parts. The resin packages that seal the semiconductor elements and gate portions are integrally formed with the resin packages. The lead frame is etched so that the resin packages are separated from the lead frame together with the metallic layer parts. The resin packages are attached to an adhesive tape provided to a frame and being used as a carrier.

Method and apparatus for fabricating semiconductor device

Growing community of inventors

Satsuma, Japan

Shinichiro Maki