The Furukawa Electric Co., Ltd.

Shinichiro Iizuka

Toshio Kimura

Kenji Suzuki

Takashi Shigematsu

Jie Xu

Shinya Saito

Takeshi Aikiyo

Tomoaki Toratani

Masato Shiino

Satoshi Fukuoka

Etsuo Tanabe

Kousuke Yamawaki

Shinji Hori

A rotation sensor including: a main rotor that integrally rotates with a rotor to be measured; a sub-rotor that rotates in accordance with rotation of the main rotor with a different number of revolutions from that of the main rotor; a first detector detecting rotation of the main rotor; and a second detector detecting rotation of the sub-rotor. The rotation sensor detects an absolute rotation angle of the rotor to be measured from detection signals from the first detector and the second detector. Respective detection signals obtained from the first detector and the second detector are cyclically output in accordance with rotation of each rotor, and the following relationship is satisfied:()&#xd7;(i and n are positive integers),wherein Tc is a cycle of the detection signal from the first detector, and Tm is a cycle of the detection signal from the second detector.

Rotation sensor with detection signal timing cycle features

A method, system and computer program product for assembling an optical module incorporates a far field pattern (FFP) optical measurement system and optionally a near field pattern (NFP) optical measurement system to obtain information about the axis and/or the divergent angle of light output from the optical elements to be assembled as part of the optical module. The optical elements include a light-emitting element, such as a laser diode, and at least one optical component, such as a collimating lens or a focusing lens. The system for assembling the optical module further includes a stage having the light-emitting element mounted thereon, a holding mechanism configured to hold and position the optical components to desired positions based on the measurements from the FFP and/or NFP optical measurement systems. A controller can control the stage, the holding mechanism and a fixing device configured to fix the positions of the optical elements once the optical elements are positioned in the desired positions.

Method, system and computer program product for assembling an optical module

A bottom plate ( ) of a box-shaped package ( ) is made of a metal. Portions of the package ( ) (peripheral wall ( ) and cover plate ( )) other than the bottom plate ( ) are made of a resin or a ceramic that is more economical than the metal. The material cost of the package ( ) can thus be reduced in comparison with the case where the package ( ) is made of the metal as a whole. A Peltier module ( ) is fixed to the bottom plate ( ). A base ( ) is fixed over the Peltier module ( ), and a semiconductor laser chip ( ) is disposed on this base ( ). Heat from the semiconductor laser chip ( ) and from the Peltier module ( ) can be efficiently radiated through the bottom plate ( ) made of the metal, and deterioration of heat radiation performance can be prevented.

Semiconductor laser module with peltier module for regulating a temperature of a semiconductor laser chip

The invention relates to a method for polishing optical connector end faces and a small-sized, light and easily transportable machine for doing the same, which are able to polish optical fiber end faces to desired shapes. A tape support member (,) is disposed at the connection end face (,) side of a multiple-core optical connector (,) attached on a machine, The tape support member(,) is linked to a supporting rod (,) which is able to freely advance and retreat along side plates (,) and (,), a tape travelling plane (,) shaped so as to correspond to a desired end face shape of bare optical fibers of a multiple-core optical connector (,) is formed at the tip end of the tape support member (,). The leading end of a polishing tape (,) wound on the pay-out roller (,) is advanced along the tape travelling plane (,) and is taken up on the winding roller (,). The polishing tape (,) is caused to travel by rotating the winding roller (,) together with the winding shaft (,), and the end faces of multiple-core bare optical fibers protruding forwards from the connection end face (,) of the multiple-core optical connector (,) are pressed to the polishing tape travelling along the tape travelling plane (,). As the tape is advanced, the pressing force of a biasing spring (,) presses the fiber end faces against the polishing tape and the tape support member and thereby polishes the fiber end faces to the desired face shape.

Method and apparatus for polishing optical connector end faces

A solder bump forming method includes a step of causing one end surface of a punch inserted into a through hole provided in a die to be retracted by a desired distance from an end surface of the die to thereby provide a recess of a desired volume in the end surface of the die, a step of embedding solder in the recess of the die, a step of moving the punch toward the end surface of the die to thereby extrude the solder, and a step of fusing the solder extruded by the movement of the punch.

Growing community of inventors

Tokyo, Japan

Shinichiro Iizuka