Canon Kabushiki Kaisha

Shinichiro Hirai

Yoshinori Ohsaki

Zenichi Hamaya

Ryo Takai

Keiji Emoto

Yoshiyuki Kuramoto

Seiya Miura

Tetsuya Mori

Kohei Suzuki

Junichi Motojima

Naoto Hayashi

Yuichi Fujita

Naoto Ohkawa

Takeshi Rokukawa

Takashi Miura

A inspection apparatus for detecting a foreign matter on a substrate on which a pattern is formed includes a detection unit including a light projector for projecting light on a surface of the substrate and a light receiver, a change mechanism for changing an area of the light projected by the light projector to a first area and a second area that is smaller than the first area without changing a light amount, and a control unit for detecting the foreign matter based on a first light amount received by the light receiver in a case where the light is projected in the first area on the surface of the substrate and a second light amount received by the light receiver in a case where the light is projected in the second area on the surface of the substrate.

Foreign matter inspection apparatus, foreign matter inspection method, processing apparatus, and article manufacturing method

Surface inspection apparatus includes stage for holding substrate, light source, scanning optical system for scanning light from the light source along first direction for plural times, stage scanning mechanism for scanning the stage in second direction intersecting with the first direction, and detector for detect scattered light from the substrate Inspection target region of the substrate is scanned by the light from the light source by an operation of the scanning optical system and the stage scanning mechanism. Chromatic aberration of the scanning optical system is corrected to fall within predetermined wavelength range. Fluctuation range of wavelength of the light from the light source is determined based on variation in total lighting time of the light source in scanning period of each light scanning operation along the first direction. The fluctuation range falls within the predetermined wavelength range.

Surface inspection apparatus, processing system, and method of manufacturing article

The present invention provides an exposure apparatus which exposes a substrate, comprising a measurement unit configured to measure a height of the substrate at each of a plurality of measurement points, and a control unit configured to control the height of the substrate based on measurement results obtained by the measurement unit, and control an operation to arrange a shot region of the substrate in a first position and expose the shot region, wherein the shot region includes a plurality of partial regions, and the control unit causes the measurement unit to measure the height of the substrate by arranging the shot region in a second position different from the first position so that the number of measurement points arranged in the plurality of partial regions is larger than that when arranging the shot region in the first position.

Exposure apparatus, exposure method, and method of manufacturing article

Provided is an interferometer system that irradiates an object to be measured with measuring light to thereby measure the position of the object to be measured. The interferometer system includes a laser light source; an interferometer configured to separate laser light emitted from an emission opening of the laser light source into the measuring light and reference light; and an optical path protecting member configured to surround an optical axis such that the laser light passes through the inside thereof and of which one opening is in contact with the emission opening.

Interferometer system, lithography apparatus, and article manufacturing method

A stage apparatus includes a stage, an interferometric measurement device which is arranged to be able to measure a position of a surface of a mirror arranged on a side surface of the stage, and a driving unit configured to position the stage based on a measurement result of the interferometric measurement device. The interferometric measurement device includes: a varying unit configured to periodically vary an incident position where measurement light is incident on the mirror; and a detecting unit configured to detect rotation of the mirror based on a variation amount of the measurement result of the interferometric measurement device, which is generated upon a periodic variation of the incident position.

Interferometric measurement of rotation of stage apparatus and adjustment method thereof, exposure apparatus and method of manufacturing device

An exposure apparatus includes an image sensor, a measurement optical system configured to guide measurement light to obliquely enter the projection optical system, and further, to guide the measurement light returned from the projection optical system to the image sensor, and a control unit configured to calculate surface position information of the substrate based on the output from the image sensor. The control unit calculates the surface position information of the substrate based on an interval between the image, of a mark arranged on the original stage, formed by the measurement light, which has passed through the mark, and the image of the mark formed by the measurement light reflected by the mark.

Exposure apparatus and device manufacturing method

The present invention provides an exposure apparatus including a measuring unit which includes an imaging optical system configured to guide light having propagated through a projection optical system to an image sensor, and is configured to measure the overall birefringence of the imaging optical system and the projection optical system, a calibration unit which is set on a side of an object plane of the projection optical system in order to measure a birefringence of the imaging optical system, and is configured to reflect the light from the measuring unit back to the measuring unit without using the projection optical system, and a calculation unit configured to isolate, from the result of measuring the overall birefringence, the birefringence of the imaging optical system measured by the measuring unit, thereby calculating the birefringence of the projection optical system.

Exposure apparatus and device fabrication method

A projection exposure apparatusprojects the pattern of an originalonto a substratevia a projection optical system PL. The projection exposure apparatusincludes an original stagewhich holds the original, a substrate stagewhich holds the substrate, and a measurement unit. The measurement unit includes a Fizeau interferometer IF including an optical unitand mirror. The optical unitincludes a Fizeau surface which splits a light beam into a reference light beam and a test light beam. The mirrorreflects the test light beam having passed through the projection optical system PL. The optical unitis mounted on the original stage. The mirroris mounted on the substrate stage

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Saitama, Japan

Shinichiro Hirai