Murata Manufacturing Co., Ltd.

Shinichiro Banba

Yoshihito Otsubo

Norio Sakai

Mitsuyoshi Nishide

Noboru Kato

Akihiro Muranaka

Hiroji Tani

Hideki Ueda

Osamu Yamaguchi

Satoshi Ishino

Shinya Mizoguchi

Makoto Yasutake

Tsubasa Nishida

Koji Yasojima

Hideaki Yamada

Tadashi Nomura

Keiichi Ichikawa

Masahiro Ozawa

Ryuken Mizunuma

Haruhiko Mori

Tetsuya Ikeda

Takafumi Kusuyama

Michiharu Yokoyama

Tatsuyuki Yamada

Motohiko Kusunoki

Masaaki Mizushiro

Tsuneo Murata

Yutaka Fukuda

Tsuyoshi Takakura

Noboru Morioka

Tetsuya Kanagawa

Atsuko Omori

An electronic component module is provided that includes a substrate, an electronic component, a heat dissipating member, and a sealing resin. The electronic component is mounted on the substrate. The heat dissipating member includes a flat plate and columnar bodies. The sealing resin covers a side of a first main surface of the substrate and the electronic component. Moreover, the heat dissipating member, except for a top surface of the flat plate, is covered with the sealing resin. The columnar bodies are disposed at an outer peripheral of the flat plate, and have a shape protruding from a bottom surface of the flat plate. The columnar bodies include a root connected to the flat plate, and a tip connected to the substrate. In a plan view of the electronic component module, the tip is not outside the root.

Electronic component module

A coil element assembly includes a plurality of coil elements each including a pair of leg portions and a bridge portion connecting first end portions of the pair of leg portions together, the coil elements being disposed to cross a predetermined winding axis, and a block comprising a resin and fixing the plurality of coil elements arranged along the winding axis. A coil module includes a coil conductor including a plurality of coil elements and a plurality of wire electrodes disposed on a circuit board, each of the plurality of coil elements including a pair of leg portions and a bridge portion connecting one end portions of the pair of leg portions together, the plurality of coil elements being disposed to cross a winding axis.

Coil element assembly and coil module

A module includes components on an upper surface and a lower surface of a substrate, a second sealing resin layer laminated on the upper surface of the substrate, a first sealing resin layer on the lower surface of the substrate, and terminal blocks on the lower surface of the substrate. Each of the terminal blocks is formed by integrating a plurality of connection conductors, each of the plurality of connection conductors including a terminal portion and a substrate connecting portion formed by bending an end portion of the connection conductor, and each of the terminal blocks forms an external connection terminal of the module or functions as a shield wall for the components. Each of the terminal blockscan be formed by mounting a terminal assembly onto the lower surface of the substrate, sealing the terminal assembly with a resin, and removing connecting portions.

Module with built-in component and method for manufacturing the same

A coil module includes a coil conductor including a plurality of coil elements and a plurality of wire electrodes disposed on a circuit board, each of the plurality of coil elements including a pair of leg portions and a bridge portion connecting one end portions of the pair of leg portions together, the plurality of coil elements being disposed to cross a winding axis. A method for manufacturing the coil module includes an assembly forming step of integrating the plurality of coil elements with resin to form a coil element assembly, and a conductor forming step of mounting the coil element assembly on the circuit board to complete the coil conductor wound about the winding axis. In the conductor forming step, the resin is introduced into a die set in which the plurality of coil elements are arranged to form a block, to thus form the coil element assembly.

Method for manufacturing a coil element assembly

A coil component includes an insulating layer; an annular ring-shaped coil core embedded in the insulating layer; a coil electrode wound around the coil core; an input electrode designed for external connection, disposed on a lower surface of the insulating layer, and connected to a first end of the coil electrode; and an output electrode designed for external connection, disposed on the lower surface of the insulating layer, and connected to a second end of the coil electrode. One of the input electrode and the output electrode is disposed inside the coil core in a plan view. With this configuration, unlike a conventional coil component in which both input and output electrodes are disposed outside a coil core, it is possible not only to easily reduce the area of the coil component in a plan view, but also to improve heat dissipation characteristics of the coil component.

Coil component

A surface mount coil component includes an element body defining a compact including magnetic material particles; a coil that is buried, excluding an end portion of the coil, in the element body; and an input-output terminal electrically connected to the end portion of the coil. A thermoplastic resin layer is provided on a surface on a mounting surface side of the element body. An interlayer connection conductor is provided in the thermoplastic resin layer. The input-output terminal is provided on a surface of the thermoplastic resin layer and is electrically connected to the end portion of the coil via the interlayer connection conductor.

Surface mount coil component and manufacturing method for the same, and DC-DC converter

A surface mount coil component includes an element body with a first surface, a second surface that opposes the first surface, and a third surface connecting the first surface and the second surface, the element body being defined by a compact including magnetic particles; a first conductor pattern provided at the first surface of the element body; a second conductor pattern provided at the second surface of the element body; input/output terminals provided at the third surface of the element body; and metal pins embedded in the element body, ends of each metal pin being connected to the first and second conductor patterns. The first conductor pattern, the second conductor pattern, and the metal pins define a coil conductor. The input/output terminals are defined by a pair of metal pins exposed at the third surface.

Surface mount coil component, method of manufacturing the same, and DC-DC converter using the same

A radiation conductor is constructed of a metal plate having a pair of main surfaces pointing in opposite directions. Each main surface of the pair of main surfaces includes a first surface region that includes at least part of a peripheral edge portion of the main surface. At least one main surface of the pair of main surfaces includes a second surface region that is a region other than the first surface region. A dielectric member holds the radiation conductor in such a manner that the first surface region of each main surface of the pair of main surfaces is sandwiched between portions of the dielectric member in a thickness direction of the radiation conductor. The second surface region of the at least one main surface is exposed.

Antenna device, antenna module, and communication apparatus

An inductor component includes an inductor electrode having two metal pins that form input and output terminals and a connecting conductor that connects one end of each of the metal pins to each other, the inductor electrode arranged such that other ends of the metal pins oppose each other, and a resin layer containing the inductor electrode such that other ends of the metal pins are exposed. The resin layer is formed having a single-layer structure. Variation in the characteristics of the inductor electrode can be reduced as compared to a case where the parts corresponding to the metal pins of the inductor electrode are formed as via conductors or through-hole conductors. Because the resin layer has a single-layer structure, stress acting on joint portions between the metal pins and the connecting conductor can be reduced, which makes it possible to improve the reliability of the inductor component.

Inductor component manufacturing method and inductor component

A radiation conductor is constructed of a metal plate having a pair of main surfaces pointing in opposite directions. Each main surface of the pair of main surfaces includes a first surface region that includes at least part of a peripheral edge portion of the main surface. At least one main surface of the pair of main surfaces includes a second surface region that is a region other than the first surface region. A dielectric member holds the radiation conductor in such a manner that the first surface region of each main surface of the pair of main surfaces is sandwiched between portions of the dielectric member in a thickness direction of the radiation conductor. A housing supports and accommodates the dielectric member. The second surface region of the at least one main surface is exposed.

A first resin layer (resin insulating layer) is formed by forming first and third covering portions in close contact with peripheral surfaces of respective end portions of first and second metal pins on the side closer to first end surfaces thereof, and by forming a body portion in a state of covering the respective surfaces of the first and third covering portions. Therefore, even when the first resin layer is thermally contracted, boundary regions of the one principal surface of the first resin layer around the respective end portions of the first and second metal pins on the side closer to the first end surfaces are filled with the first and third covering portions. Hence gaps can be prevented from being generated in those boundary regions, and a columnar conductor (first metal pin) can be avoided from deviating in position.

Inductor component

A high-frequency module () includes a component () mounted on an upper surface () of a substrate (), a second sealing resin layer () stacked on the upper surface () of the substrate (), a component () mounted on a lower surface () of the substrate (), a first sealing resin layer () stacked on the lower surface () of the substrate (), and a first terminal assembly () and a second terminal assembly () that are mounted on the lower surface () of the substrate (). The first terminal assembly () is mounted on a four-corner portion of the substrate () and includes a connection conductor () thicker than a connection conductor () of the second terminal assembly ().

High-frequency module

A multilayer substrate includes a first dielectric layer and a conductor pattern disposed in at least an interior of the first dielectric layer. A second dielectric layer formed of a different material from a material of the first dielectric layer is disposed on the multilayer substrate. At least one radiation element is formed on the second dielectric layer. A feeding wire connects the radiation element and the conductor pattern. The feeding wire includes a conductor pin that is conductive and extends in a thickness direction of the second dielectric layer. The conductor pin electrically connects the radiation element and the conductor pattern. Provided is an antenna-integrated type communication module having such a structure that the accuracy of circuit simulation is easily enhanced and the degree of freedom in selection of dielectric materials is large.

Antenna-integrated type communication module and manufacturing method for the same

Substrate-side wiring electrode patterns, which form a part of a coil electrode, are provided on a wiring substrate, and as a result reductions in the size and profile of a resin insulating layer, in which a coil coreis buried, can be achieved. Therefore, reductions in the size and the profile of a coil modulecan be achieved compared with a coil module of the related art which is formed by mounting a coil component on a wiring substrate. In addition, since the substrate-side wiring electrode patterns, which form a part of the coil electrode, are provided on the wiring substrate, the heat generated by a coilcan be efficiently released from the substrate-side wiring electrode patternsto the wiring substrate. Therefore, the heat dissipation property of the coil modulecan be improved at low cost.

Coil module

A wireless IC device includes a resin member including first and second surfaces, a substrate including first and second principal surfaces, a coil antenna provided in the resin member, and an RFIC element mounted on the substrate and connected to the coil antenna. The substrate is embedded in the resin member so that the second principal surface is at a second surface side. The coil antenna is defined by first linear conductor patterns on the second surface, first metal posts extending between the first and second surfaces, second metal posts extending between the first and second surfaces, and second linear conductor patterns on the first surface. The RFIC element is disposed in the coil antenna.

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Kyoto, Japan

Shinichiro Banba