Denki Kagaku Kogyo Kabushiki Kaisha

Shinichiro Asai

Tatsuo Nakano

Masayuki Kobayashi

Minoru Handa

Hiroko Ogawa

Takuzi Nishizawa

Kazuo Katoh

Masatoshi Iji

An epoxy resin composition is provided for encapsulating a semiconductor. The resin composition contains an epoxy resin, a phenol resin, a phenol-modified silicon-containing compound and an inorganic filler. The phenol-modified silicon-containing compound is obtained by reacting a first and/or second organic silicone compound (formulae (1-a), (1-b) and (2)) with an organic silicon compound (formula (3)) and with a phenol resin: ##STR1## wherein X stands for an organic group containing an epoxy group, Y for a polyoxyalkylene group and Z for a mercapto group, an amino group or a ureido group.

Epoxy resin composition for encapsulating semiconductor

A hybrid integrated circuit is prepared by laminating an aluminum-copper clad foil on an insulating layer, etching the aluminum-copper clad foil with etching agents to form an aluminum circuit and a copper circuit and connecting a semiconductor element to the aluminum circuit through an aluminum wire or a gold wire while connecting a circuit element to the copper circuit by soldering.

Hybrid integrated circuit and preparation thereof

Block copolymers of a vinyl-substituted aromatic hydrocarbon and a conjugated diene, having alkali metal atoms linked to at least one terminal of the polymer chain are obtained by polymerizing vinyl-substituted aromatic hydrocarbon and conjugated diene monomers with use of an alkali metal or organo alkali metal initiator. The block copolymer thus obtained is treated with a polar reactant to introduce polar groups into the polymer chain terminal. Compositions for paints and printing inks are prepared by incorporating inorganic pigments into the block copolymer having the terminal polar group.

Compositions for paints and printing inks

Growing community of inventors

Machida, Japan

Shinichiro Asai