Mitsui Chemicals, Inc.

Mitsui Chemicals Tohcello, Inc.

A School Corporation Kansai University

Shinichi Usugi

Atsuo Otsuji

Hiroshi Naruse

Jun Kamada

Mitsuo Nakamura

Noboru Kawasaki

Akimitsu Morimoto

Kouji Igarashi

Seiichi Kobayashi

Masanobu Ajioka

Masao Imai

Mitsunobu Yoshida

Yoshiro Tajitsu

Hidetoshi Hayashi

Yoshiyuki Totani

Kenichi Goto

Takuzo Aida

Osamu Kohgo

Akira Hasegawa

Hitoshi Onishi

Ichiro Fujio

Jin Kinoshita

Takeharu Isaki

Takayuki Onogi

Akifumi Kagayama

Hideshi Hori

Shintaro Maekawa

Takeshi Karino

Hirokazu Mizuma

Hideki Yamamoto

Makoto Sukegawa

Ryohei Ogawa

Takaharu Isaki

Yoshiaki Aso

Masashi Tsuji

This semiconductor wafer surface protection film has a substrate layer A, an adhesive absorption layer B, and adhesive surface layer C, in the stated order. The adhesive absorption layer B comprises an adhesive composition containing a thermoset resin b1, said adhesive absorption layer B having a minimum value G'bmin of the storage elastic modulus G&#x2032;b in the range of 25&#xb0; C. to less than 250&#xb0; C. of 0.001 MPa to less than 0.1 MPa, a storage elastic modulus G&#x2032;b250 at 250&#xb0; C. of 0.005 MPa or above, and a temperature at which G&#x2032;bmin is exhibited of 50-150&#xb0; C. The adhesive surface layer C has a minimum value G&#x2032;cmin of the storage elastic modulus G&#x2032;c in the range of 25&#xb0; C. to less than 250&#xb0; C. of 0.03 MPa.

Semiconductor wafer surface protection film and method for manufacturing semiconductor device

An adhesive film of the present invention includes a base material layer and a self-peeling adhesive layer laminated therein. The base material layer has a thermal contraction percentage in a direction of flow (thermal contraction percentage in an MD direction) and a thermal contraction percentage in an orthogonal direction with respect to the direction of flow (thermal contraction percentage in a TD direction) that satisfy the following conditions: (1) after heating at 150&#xb0; C. for 30 minutes, 0.4&#x2266;|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|&#x2266;2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction&#x2266;2%, and (2) after heating at 200&#xb0; C. for 10 minutes, 0.4&#x2266;|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|&#x2266;2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction&#x2267;3%.

Adhesive film and method for manufacturing semiconductor device

An adhesive resin composition includes an expandable sticky polymer having a structure derived from a Meldrum's acid derivative, or a Meldrum's acid derivative represented by the following general formula (1) and an adhesive resin. 

Adhesive resin composition, laminate, and self-stripping method

Disclosed are a biodegradable resin composition comprising a copolymer (A) with a weight average molecular weight of 1,000 to 30,000, which comprises a constituent unit (a-1) derived from a multivalent carboxylic acid except for an amino acid and a constituent unit (a-2) derived from a hydroxycarboxylic acid, and a biodegradable resin (B), which has excellent hydrolyzability and excellent transparency; and a biodegradable molded article composed of this biodegradable resin composition.

Biodegradable resin composition and molded article of the same

The invention provides a piezoelectric polymer material including a helical chiral polymer having a weight average molecular weight of from 50,000 to 1,000,000 and having optical activity, the piezoelectric polymer material having a piezoelectric constant dat 25&#xb0; C. of 10 pC/N or more, a degree of crystallinity obtained by X-ray diffraction of from 40% to 80%, and a haze of from 0.5 to 30.

Piezoelectric polymer material, process for producing same, and piezoelectric element

A polymerizable composition including a compound represented by following General Formula (1): 

Polymerizable composition, and resin and optical part using the same

Polyester resins (C) of the invention have a practically sufficient high molecular weight and a high crystallinity and have an amide group in the molecular chain. Processes for producing the polyester resins are also disclosed. In detail, the polyester resins (C) have a practically sufficient high molecular weight and a high crystallinity and have a biodegradable amide group in the molecular chain. Processes for producing the polyester resins are also disclosed. The polyester resins (C) are obtained by reacting an aliphatic polyester resin (A) and a polyisocyanate compound (B) in the presence of an amidation catalyst and contain a specific structural unit.

Polyester resin, production process therefor and use thereof

Disclosed is a polymerizable composition containing a compound represented by the following general formula (1), 

Polymerizable composition, resin using the same, optical component and compound

Growing community of inventors

Chiba, Japan

Shinichi Usugi