Tokyo Electron Limited

Shinichi Umeno

Yasuhiro Takaki

Nobuhiro Ogata

Takami Satoh

Yusuke Takamatsu

Jiro Higashijima

Koji Tanaka

Takashi Nagai

Hiroshi Komiya

Hiroki Sakurai

Shogo Fukui

Atsushi Anamoto

Hiroyuki Higashi

Kazuya Goda

Minsung Kim

Yenrui Hsu

Shoki Mizuguchi

Tetsurou Iriyama

Hisashi Morita

A substrate processing apparatus according to the present disclosure includes a substrate holding unit, a fluid supplying unit, a processing-liquid supplying unit, a nozzle, a fluid amount adjusting unit, and a controller. The substrate holding unit holds a substrate to be rotatable. The fluid supplying unit supplies fluid including pressurized vapor or mist of deionized water. The processing-liquid supplying unit supplies processing liquid including at least a sulfuric acid. The nozzle is connected to the fluid supplying unit and the processing-liquid supplying unit to discharge mixed fluid of the fluid and the processing liquid toward the substrate. The fluid amount adjusting unit adjusts a flow volume of the fluid that is flowing through the fluid supplying unit. The controller controls the fluid amount adjusting unit to adjust a ratio of the fluid to the processing liquid.

Substrate processing apparatus and substrate processing method

A liquid supply device includes: a storage tank configured to store a processing liquid including a first processing liquid (sulfuric acid) and a second processing liquid (hydrogen peroxide solution); a circulation path having a first pipeline through which the processing liquid passes in a horizontal direction, and configured to circulate the processing liquid stored in the storage tank; a branch path configured to supply the processing liquid to a processing unit; and a branching part having an opening for allowing the processing liquid to flow out from the first pipeline to the branch path, wherein the opening is formed in the branching part and formed below a periphery of the first pipeline when the first pipeline is viewed in section.

Liquid supply device and liquid supply method

A recovery route returns, to a retaining tank, mixed solution supplied to a substrate processing unit. A discarding route discards the supplied mixed solution to a place other than the retaining tank. A switching controller causes the supplied mixed solution to flow into the discarding route during a time interval until a first time interval has elapsed from a time point when the substrate processing unit starts to supply the mixed solution; causes the supplied mixed solution to flow into the recovery route during a time interval until a second time interval, which is decided based on a predetermined recovery rate, has elapsed after the first time interval elapses; and causes the supplied mixed solution to flow into the discarding route during a time interval until supply of the mixed solution has been ended from a time point when the second time interval elapses.

A liquid processing apparatus includes a processing unit, a first supply route, a first device, a second supply route, a second device, a housing, and an external housing. The processing unit processes a substrate by using processing liquid including first and second processing liquids. The first supply route is for supplying the first processing liquid to the processing unit. The first device is for supplying the first processing liquid to the first supply route. The second supply route is for supplying the second processing liquid to the processing unit. The second processing liquid has higher temperature than the first processing liquid. The second device is for supplying the second processing liquid to the second supply route. The housing accommodates the processing unit. The external housing accommodates the first and second devices, and is adjacent to the housing. The external housing includes a partition wall between the first and second devices.

Liquid processing apparatus

A substrate liquid processing apparatus includes a transfer section, a processing section, a reservoir and a liquid sending mechanism. The transfer section includes a transfer device configured to transfer a substrate. The processing section is provided adjacent to the transfer section in a horizontal direction, and includes a liquid processing unit configured to process the substrate by using a processing liquid. The reservoir is configured to store the processing liquid therein. The liquid sending mechanism is configured to send out the processing liquid stored in the reservoir into the liquid processing unit. The reservoir is disposed directly under the transfer section. Further, the liquid sending mechanism is disposed directly under the processing section. Space saving of the substrate liquid processing apparatus can be achieved.

Substrate liquid processing apparatus

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Kumamoto, Japan

Shinichi Umeno