Screen Holdings Co., Ltd.

Shinichi Takada

Masashi Kanaoka

Tsuyoshi Mitsuhashi

Atsushi Tanaka

Masanori Imamura

Hidetoshi Sagawa

Takehiro Wajiki

Kazuhiro Tadokoro

Kazuya Ono

Taiji Matsu

A substrate treating method includes a determining step for determining a treating condition for hydrophobizing a surface of a substrate, based on a target regarding a dissolved area size in a resist pattern, and a treating step for hydrophobizing the surface of the substrate with the treating condition determined in the determining step before forming resist film on the surface of the substrate.

Substrate treating method

A nozzle starts discharging a processing liquid while a spin chuck holds and rotates a substrate having a water-repellent film being formed on a surface thereof. The processing liquid is discharged to a position spaced away from the center of the substrate by a preset distance, and flows so as to converge into one stream on the substrate immediately after discharge of the processing liquid starts. This achieves suppression of the minute water droplets. Moreover, the nozzle is moved toward outside of the substrate while discharging the processing liquid successively. This allows entire flow of the processing liquid to move toward outside of the substrate while the processing liquid converging into one stream on the substrate is maintained. Here, inside the flow of the processing liquid is a dried region.

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Kyoto, Japan

Shinichi Takada