Hitachi Chemical Company, Ltd.

Hitachi Powdered Metals Co., Ltd.

Hitachi, Ltd.

Other

Showa Denko Materials Co., Ltd.

Sony Corporation

Panasonic Holdings Corporation

Panasonic Corporation

Resonac Corporation

Shinichi Tachizono

Takashi Naito

Yuji Hashiba

Kei Yoshimura

Takuya Aoyagi

Tatsuya Miyake

Taigo Onodera

Tadashi Fujieda

Motomune Kodama

Ichiro Saito

Hiroki Yamamoto

Takeshi Yamagishi

Hajime Murakami

Yuichi Sawai

Takeshi Tsukamoto

Masanori Miyagi

Shinji Yamada

Akitoyo Konno

Satoru Amou

Kouji Inoue

Keiichi Kanazawa

Takahiro Ikabata

Hironobu Chiyoda

Hironori Suzuki

Hiroshi Yoshida

Katsumi Mabuchi

Koichi Iida

Masaharu Matsuura

Kiyomi Nakamura

Akihito Iwai

Toshiya Yamamoto

Hiroshi Yamane

Masayoshi Tsuboi

Eiichi Ogiwara

Shigeo Takashima

Keita Yuguchi

Minoru Aoki

Shigeo Kotera

There is provided a gas trapping material and vacuum heat insulation equipment where the gas trapping material can be activated in a sealing step of the vacuum heat insulation equipment, and production efficiency can be enhanced by maintaining a high gas trapping characteristic even when a gas is released in a baking step or in a sealing step under an air atmosphere. The gas trapping material contains porous metal oxide and silver particles having an average particle size of 0.5 nm to 100 nm inclusive.

Gas trapping member and vacuum heat insulation equipment

The present invention provides a highly reliable multilayered glass panel and an encapsulating material for achieving the highly reliable multilayered glass panel. The encapsulating material includes lead-free low melting glass particles containing vanadium oxide and tellurium oxide, low thermal expansion filler particles, and glass beads as a solid content. A volume fraction of the glass beads in the solid content is not less than 10% to not more than 35%, and a volume fraction of the lead-free low melting glass particles in the solid content is larger than a volume fraction of the low thermal expansion filler in the solid content.

Sealing material and multilayered glass panel using same

The lead-free glass composition contains vanadium oxide, tellurium oxide, alkali metal oxide, iron oxide, barium oxide, and tungsten oxide while containing substantially no phosphorus oxide, and further contains at least one of additional components including yttrium oxide, lanthanum oxide, cerium oxide, erbium oxide, ytterbium oxide, aluminum oxide, and gallium oxide. A content of the tellurium oxide is equal to or more than 25 mol %, and equal to or less than 43 mol % in terms of oxide TeO. A content of the alkali metal oxide is equal to or more than 4 mol %, and equal to or less than 27 mol % in terms of oxide RO (R: alkali metal element).

Lead-free glass composition, and glass composite material, glass paste, and sealing structure body containing the same

It is an objective of the invention to provide a conductive joint article exhibiting electrical joinability comparable to that of solder joining of easy-to-solder joinable metals even when a joined member of the conductive joint article is made of a hard-to-solder joinable metal. There is provided a conductive joint article with conductive joined members electrically joined via a joining layer, at least one of the joined members being made of a hard-to-solder joinable metal. The joining layer comprises an oxide glass phase and a conductive metal phase. The oxide glass phase includes vanadium as a major constituent and at least one of phosphorus, barium and tungsten as an accessory constituent, and has a glass transition point of 390&#xb0; C. or less. And, connection resistance between the joined members exhibits less than 1&#xd7;10&#x3a9;/mm.

Conductive joint article and method for manufacturing same

There is disclosed a heat-insulating member including a pair of substrates and an airtight sealing part, in which the airtight sealing part is formed in an outer peripheral part between the pair of substrates to form a space between the pair of substrates, the space being in a vacuum or reduced pressure state, a sealing material that forms the airtight sealing part includes a low-melting glass, and the low-melting glass contains a vanadium oxide, barium oxide, phosphorus oxide, and tungsten oxide, in which the following two relational expressions are satisfied in terms of oxide contents: VO+BaO+PO+WO&#x2265;90 and VO&#x3e;BaO&#x3e;PO&#x3e;WO(wherein unit: mol %). Thereby, influence on environmental impact can be reduced and maintenance of airtightness and an improvement in acid resistance can be achieved.

Heat-insulating member, low-melting glass composition, and sealing material paste

An object of the present invention is to provide a multi-layer glass with high degree of vacuum and high mass productivity. In order to achieve the object, the multi-layer glass according to the present invention includes a first glass substrate, a second glass substrate disposed facing the first glass substrate with a space therebetween, a sealing portion, which contains a glass composition and is disposed in a peripheral edge portion of the space between the first glass substrate and the second glass substrate, and column members disposed between the first glass substrate and the second glass substrate, wherein the column member is made of a metal or alloy, and a melting point of the metal or alloy is higher than a softening point of the glass composition and is lower than or equal to a temperature 20&#xb0; C. higher than a flow point of the glass composition.

Multi-layer glass and method for producing the same

An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing low melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.VO+TeO+FeO+PO&#x2265;90 (mass %)&#x2003;&#x2003;(1)VO&#x3e;TeO&#x3e;FeO&#x3e;PO(mass %)&#x2003;&#x2003;(2)

Electronic component, method for producing same, and sealing material paste used in same

An AgO&#x2014;VO&#x2014;TeOlead-free low-melting glass composition that is prevented or restrained from crystallization by heating so as to soften and flow more satisfactorily at a low temperature contains a principal component which includes a vanadium oxide, a tellurium oxide and a silver oxide; a secondary component which includes at least one selected from the group consisting of BaO, WOand PO; and an additional component which includes at least one selected from the group consisting of oxides of elements in Group 13 of periodic table. A total component of the principal component is 85 mole percent or more in terms of VO, TOand AgO. Contents of TeOand AgO each is 1 to 2 times as much as a content of VO. A content of the secondary component is 0 to 13 mole percent. A content of the additional component is 0.1 to 3.0 mole percent.

Lead-free low-melting glass composition, low-temperature sealing glass frit, low-temperature sealing glass paste, conductive material, and conductive glass paste containing glass composition, and glass-sealed component and electric/electronic component prepared using the same

The conductive paste contains the following dispersed in a binder resin dissolved in a solvent: a plurality of particles comprising aluminum and/or an aluminum-containing alloy; and an oxide-comprising powder. The oxide contains vanadium with a valence no greater than 4 and a glass phase. In the method for manufacturing an electronic component, the conductive paste is applied to a substrate and fired, forming electrode wiring. The electronic component is provided with electrode wiring that has: a plurality of particles comprising aluminum and/or an aluminum-containing alloy; and an oxide affixing the particles to a substrate. The oxide contains vanadium with a valence no greater than 4. A compound layer containing vanadium and aluminum is formed on the surfaces of the particles, and the vanadium in the compound layer includes vanadium with a valence no greater than 4. This results in an electrode wiring with high reliability and water resistance.

Electronic component, conductive paste, and method for manufacturing an electronic component

An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing to melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.VO+TeO+FeO+PO&#x2267;90(mass %)&#x2003;&#x2003;(1)VO&#x3e;TeO&#x3e;FeO&#x3e;PO(mass %)&#x2003;&#x2003;(2)

An AgO&#x2014;VO&#x2014;TeOlead-free low-melting glass composition that is prevented or restrained from crystallization by heating so as to soften and flow more satisfactorily at a low temperature contains a principal component which includes a vanadium oxide, a tellurium oxide and a silver oxide; a secondary component which includes at least one selected from the group consisting of BaO, WOand PO; and an additional component which includes at least one selected from the group consisting of oxides of elements in Group 13 of periodic table. A total component of the principal component is 85 mole percent or more in terms of VO, TeOand AgO. Contents of TeOand AgO each is 1 to 2 times as much as a content of VO. A content of the secondary component is 0 to 13 mole percent. A content of the additional component is 0.1 to 3.0 mole percent.

In an electronic component including two substrates at least one of which is transparent, an organic member arranged between these substrates, and a bonding portion located onto respective outer circumferential portions of the two substrates, this bonding portion includes a low-melting glass and filler particles. The low-melting glass includes vanadium oxide. The filler particles include a low thermally-expandable material, and an oxide containing a bivalent transition metal as a constituent element. The oxide is dispersed in the low thermally-expandable material, and the low thermally-expandable material has a thermal expansion coefficient of 5&#xd7;10/&#xb0; C. or less in a temperature range from 30 to 250&#xb0; C. This invention makes it possible to heat the filler particles by irradiation with a laser to give the electronic component which is a component having a highly reliable bonding portion.

Electronic component, process for producing same, sealing material paste, and filler particles

Disclosed is an AgO&#x2014;VO&#x2014;TeOlead-free low-melting glass composition that is prevented or restrained from crystallization so as to soften and flow more satisfactorily at a low temperature. This lead-free low-melting glass composition contains a principal component; and an additional component. The principal component includes a vanadium oxide, a tellurium oxide and a silver oxide. The additional component includes at least one selected from the group consisting of yttrium oxide and lanthanoid oxides. A content of the additional component is 0.1 to 3.0 mole percent in terms of oxide. The additional component preferably contains at least one selected from YO, LaO, CeO, ErO, and YbOin a content of 0.1 to 2.0 mole percent in terms of oxide. The additional component particularly effectively contains at least one of YOand LaOin a total content of 0.1 to 1.0 mole percent.

Disclosed is a constitution formed from an oxide of an element having a smaller work function than aluminum. This oxide is comprises an oxide of vanadium (V), an oxide of an alkaline earth metal and an oxide of an alkali metal. The elements for the alkaline earth metal are comprise one or more elements out of the elements calcium (Ca), strontium (Sr) and barium (Ba) and at least contain barium. The elements for the alkali metal include at least one or more of sodium (Na), potassium (K), rubidium (Rb) and cesium (Cs). When the element vanadium is included as vanadium pentoxide (VO), the vanadium pentoxide content is 40-70 wt %. Thus, a glass composition for aluminum electrode wiring with an apparent work function for electrode wiring that is smaller than the work function for aluminum (Al) can be provided without the inclusion of lead.

Glass composition and conductive paste for aluminum electrode wiring, electronic component provided with that aluminum electrode wiring and method for producing this electronic component

A glass composition according to the present invention comprises: transition metals; phosphorus; barium; and zinc, the transition metals including: vanadium; and tungsten and/or iron, the glass composition not containing substances included in the JIG level A and B lists, an softening point of the glass composition being from 430 to 530&#xb0; C., an average linear expansion coefficient of the glass composition being from 6 to 9 ppm/&#xb0; C. at temperatures from 30 to 250&#xb0; C.

Growing community of inventors

Tokyo, Japan

Shinichi Tachizono