Origin Electric Company, Limited

Origin Company, Limited

Shinichi Shinohara

Hideo Kobayashi

Masahiro Nakamura

Takayuki Suzuki

Koji Yamaguchi

Hironobu Nishimura

Kanya Kaji

Makoto Yamamoto

Jun Matsuda

Masahiko Kotoyori

Naoto Ozawa

Tatsuo Okubo

Yukio Utsunomiya

Saori Muraki

Miya Yamazaki

Yuji Honma

Masanobu Nagahama

A method for manufacturing a coated object and a coating substance spreading apparatus, which coat, as uniformly as possible, a coating substance on a curved coating target surface are provided. A method for manufacturing a coated object, the coated object being an object coated with a coating substance on a coating target surface Tf of the object T, the coating target surface Tf having a curved surface, includes dispensing the coating substance onto the coating target surface Tf; and revolving the object T, having the coating substance dispensed onto the coating target surface Tf, about a revolution axislocated remotely from the object T. A coating substance spreading apparatusincludes a revolution sectionconfigured to revolve an object T about a revolution axislocated remotely from the object T. With these, a coating-substance-moving force that acts on each portion of the coating target surface Tf can be made close to an intensity proportional to a distance from the revolution axis, and it is possible to suppress thickness differences or variation of the coating substance coated on the coating target surface Tf.

Method for manufacturing coated object and coating substance spreading apparatus

An apparatus for bonding disc substrates is provided with a spinner which spreads adhesive placed between a first substrate and second substrate, and a curing device which radiates ultraviolet light onto the adhesive through the substrate to cure it. The curing device includes; a support mechanism which supports the first substrate and second substrate after the adhesive is spread by the spinner, a semiconductor light emitting apparatus having a plurality of light emitting semiconductor elements arranged facing a region where the adhesive is cured, and a positioning mechanism which positions the semiconductor light emitting apparatus such that the light emitting semiconductor elements are a predetermined distance away from the adhesive. The adhesive is cured or semi-cured by ultraviolet light emitted from the plurality of light emitting semiconductor elements.

Method and apparatus for curing adhesive between substrates, and disc substrate bonding apparatus

The object of the present invention is to considerably reduce the amount of heat generated in comparison with a conventional lamp to decrease the thermal effects on an optical disc in an adhesive curing method suitable for curing adhesive supplied between the substrates of a DVD or other optical disc in particular. In the adhesive curing method as claimed in the present invention, an adhesive is cured by irradiating with ultraviolet rays using semiconductor elements that emit ultraviolet rays instead of a lamp. In this case, light-emitting semiconductor elements are used that emit ultraviolet rays having a wavelength within a range in which the transmittance relative to the adhesive before curing is lower than the transmittance relative to the adhesive after curing.

Adhesive curing method, curing apparatus, and optical disc lamination apparatus using the curing apparatus

A molded disc substrate obtained by injection molding is rotated at high speed before the molded disc substrate has solidified, and a gas is also made to flow in an outward radial direction along a bottom surface of the molded disc substrate while the molded disc substrate is rotating, and the rotation is stopped after the molded disc substrate has solidified. Thus, a disc substrate with little warping is obtained in a short time.

Method and apparatus for treating a disc substrate

A method of treating a disc plate. has the following operations of: molding a mold disc plate through an injection molding; and spinning the mold disc plate at a high spin speed. The spinning operation has at least one of the following two sub-operations of: reducing a warp of the mold disc plate with a centrifugal force caused during the spinning operation, and reducing a temperature of the mold disc plate during the spinning operation. Moreover, an apparatus of treating a disc plate has: a conveyer for conveying a mold disc plate obtained through an injection molding; a disc bench for receiving the mold disc plate conveyed with the conveyer; and a spin driver for spinning the disc bench when a temperature of the mold disc plate is higher than 90&#xb0; C., to thereby spin the mold disc plate.

Method and apparatus of treating a disc plate

In a plate bonding system for bonding first and second substrate discs (or other plates) with adhesive, there are provided a first section for bringing the first and second substrate discs closer to each other with the interposition of adhesive, and a second section for producing an electric field in the interspace between the first and second substrate discs. The second section produces the field and thereby deforms the adhesive into a tapered shape to minimize the initial contact area and thereby prevent voids from being involved in the adhesive.

Bonding system and method

Adhering apparatus for plate shaped matter includes absorbing-and-holding means serving also as electrodes for absorbing and holding respectively first optical disc substrate and second optical disc substrate , optical disc substrate moving means for moving second optical disc substrate to be approached to first optical disc substrate, distance detecting means for detecting the distance between optical disc substrates, velocity controlling means for controlling a relative velocity of the second plate shaped matter to the first plate shaped matter and controlling the plate shaped matter moving means in such a manner that the relative velocity immediately after and at a time point at which the adhesive applied onto the first plate shaped matter is brought in contact with the second plate shaped matter is slower than that immediately before the adhesive applied onto the first plate shaped matter is brought in contact with the second plate shaped matter; and voltage application means for applying voltage between the first plate shaped matter and the second plate shaped matter before the adhesive applied onto the first plate shaped matter is brought in contact with the second plate shaped matter.

Plate shaped matter adhering apparatus and method

A method of treating a disc plate. has the following operations of: molding a mold disc plate through an injection molding; and spinning the mold disc plate at a high spin speed. The spinning operation has at least one of the following two sub-operations of: reducing a warp of the mold disc plate with a centrifugal force caused during the spinning operation, and reducing a temperature of the mold disc plate during the spinning operation. Moreover, an apparatus of treating a disc plate has: a conveyer for conveying a mold disc plate obtained through an injection molding; a disc bench for receiving the mold disc plate conveyed with the conveyer; and a spin driver for spinning the disc bench when a temperature of the mold disc plate is higher than 90&deg; C., to thereby spin the mold disc plate.

The object of the present invention is to significantly inhibit the formation of voids between substrates bonded together when a liquid adhesive is supplied onto an optical disc substrate or when the optical disc substrate is bonded to another optical disc substrate. Accordingly, the present invention discloses a method for bonding two optical disc substrates together which comprises the steps of joining the optical disc substrates together with an adhesive and curing the adhesive, wherein the adhesive is supplied onto the optical disc substrate by an electric field formed between the adhesive-supplying nozzle, for supplying the adhesive onto the optical disc substrate, and the optical disc substrate, and the two optical disc substrates are then joined together and subjected to spun by a spinning process.

Method and apparatus for bonding optical disc substrates together, and method for supplying liquid material

A capacitor charger is provided that can control charging voltage with high accuracy, and repeat a process of increasing it to a target charging voltage at high speed. In a first step, an ac voltage is generated in a resonant type inverter section by fixed frequency driving pulses, the ac voltage is converted to a dc voltage, a load capacitor is charged by the dc voltage, a calculation pulse in the driving pulse has a predetermined, fixed driving pulse width, and the load capacitor is charged by &Dgr;Vn each pulse. In a second step, when the charging voltage V of the load capacitor and the target voltage V satisfy an inequality relationship &ldquo;V >V >V &minus;&Dgr;Vn&rdquo;, charging is performed by a single or a plurality of final pulses having a driving pulse width W (W >W ) as required to step up the voltage by &ldquo;V &minus;V

Capacitor charging method and capacitor charger

A disk bonding system or method comprises a first element for forming an annular adhesive layer on an upwardly facing joint surface of a lower side disk, and a second element for forming a dotted adhesive layer on a downwardly facing joint surface of an upper side disk. Then, a third element sets the upper and lower side disks in a confronting state, and reduces the spacing between the upper and lower side disks until the annular adhesive layer and the dotted adhesive layer are sandwiched between the upper and lower side disks. During this, the annular adhesive layer and the dotted adhesive layer are brought into contact with each other, and the contact region expands in a manner to prevent occurrence of bubbles.

Growing community of inventors

Tokyo, Japan

Shinichi Shinohara