Konishi Co., Ltd.

Nihon Dempa Kogyo Co., Ltd.

Pioneer Electronic Corporation

Fuji Electric Fa Components & Systems Co., Ltd.

Pioneer Corporation

Tohoku Pioneer Corporation

Chichibu Fuji Co., Ltd.

Shinichi Sato

Kazuo Akaike

Yukihiro Nomura

Tsukasa Kobata

Mitsuaki Koyama

Shigeki Mori

Jun Inui

Noriyoshi Machida

Kazuhiro Iyo

Akihiro Sato

Eijiro Shimoyama

Takayuki Ishikawa

Akira Shimizu

Takeru Mutoh

Takeshi Matsumoto

Hideo Yamamoto

Manabu Ishikawa

Kazunori Takagi

Manabu Hashimoto

Tetsuya Onuma

Masahiko Ito

Mitsuo Nishio

Toshihiko Kagami

Takehisa Takeuchi

Tomoaki Shoji

Toshirou Araki

Takashi Kida

Hiroyuki Fujimoto

A surface mount device in which a pin adapter that is integrally formed with a plurality of pins connects a base board and a main board is provided to enable an automatic mounting, to enable a reflow soldering, to increase the flexibility of design, and to satisfy requirements of customers. In the surface mount device, a pin adapterthat is formed integrally with a plurality of pinsis placed on a base board, the base boardand the main boardare connected by inserting the tips of the pinsinto the corresponding locations of the main board, the leg portions of the pin adapterare folded toward inside, and opening sectionsare formed at the leg portions.

Surface mount device

An oscillation device is provided. The oscillation device includes: a main circuit portion, a heating unit, first and second crystal units, first and second oscillator circuits, a frequency difference detector, a first addition unit, an integration circuit unit, a circuit unit configured to control an electric power to be supplied to the heating unit, a compensation value obtaining unit, and a second addition unit. The compensation value obtaining unit is configured to obtain a frequency compensation value for compensating an output frequency of the main circuit portion based on an integrated value output from the integration circuit unit, and based on a change in the clock signal due to a difference between the temperature of the atmosphere and the temperature setting value of the heating unit. The second addition unit is configured to add the frequency compensation value to a frequency setting value.

Oscillation device

A bearing mechanism has a rotary member made of a resin, having a cylindrical bearing integrally formed thereof and protruding from a side surface of the rotary member; a base member made of a resin and rotatably supporting the rotary member, the base member having a support shaft protruding from a position facing the cylindrical bearing of the rotary member; and an urging member constantly urging the rotary member in a predetermined direction. The cylindrical bearing of the rotary member has a bearing hole to fit and insert the support shaft of the base member.

Bearing mechanism for compact rotary member

A crystal resonator comprises a first vibrating region provided on a crystal wafer, a second vibrating region provided on the crystal wafer, the second vibrating region having a different thickness and positive/negative orientation of the X-axis from those of the first vibrating region, and excitation electrodes which are provided respectively on the first vibrating region and the second vibrating region for causing the vibrating regions to vibrate independently. Frequencies that change by different amounts from each other relative to a temperature change can be retrieved from one vibrating region and the other vibrating region. Thus, based on an oscillating frequency of the vibrating region in which a clear frequency change occurs relative to the temperature, the oscillating frequency of the other vibrating region can be controlled. Thereby, increases in the complexity of the crystal oscillator can be suppressed.

Crystal resonator and crystal oscillator

An oscillator includes a nominal frequency output unit, a frequency adjustment amount output unit, a gain output unit, a multiplier, and an adder. The nominal frequency output unit is configured to output a first digital value corresponding to the nominal frequency. The frequency adjustment amount output unit is configured to output a second digital value corresponding to a rate of frequency in order to set a frequency adjustment amount with respect to the nominal frequency using the rate of frequency. The gain output unit is configured to output a third digital value corresponding to a gain to be multiplied by the second digital value. The multiplier is configured to multiply the second digital value by the third digital value, thus outputting a fourth digital value. The adder adds the first digital value and the fourth digital value to output the added result as a setting signal of frequency.

Oscillator with frequency adjustment

An oscillation device capable of highly accurate temperature compensation of an output frequency is provided. The oscillation device includes: first and second oscillator circuits oscillating first and second quartz-crystal resonators with overtones respectively; a frequency difference detecting part finding a value corresponding to a difference value between values corresponding to differences between fand fand between fand f, where fand fare oscillation frequencies of the first and second oscillator circuits, and fand fare oscillation frequencies of the first and second oscillator circuits at a reference temperature; and a correction value obtaining part which, based on the value corresponding to the difference value and a relation between the value corresponding to the difference value and a frequency correction value of the oscillation frequency fobtains the frequency correction value of fwherein the output frequency is corrected based on the found frequency correction value.

It is provided a method for producing a pressure-sensitive adhesive tape or sheet which is superior in a heat-resistance. A mixture is prepared by uniformly mixing a specific polymer having hydrolyzable silyl end groups and urethane linkages and/or urea linkages in the main chains or side chains with tackifying resins. A fluorine-containing compound selected from the group consisting of boron trifluoride, complex of boron trifluoride, fluorinating agent and alkali metal salt of fluorine-containing inorganic acid is uniformly mixed into the mixture to obtain a precursor of a pressure-sensitive adhesive agent. The adhesive precursor is applied on the surface of a tape substrate or sheet substrate. It is obtained a pressure-sensitive adhesive layer having three-dimensional reticulation structures by curing the specific polymer having hydrolyzable silyl end groups. Thereby, it is obtained the pressure-sensitive adhesive tape or sheet.

Method for producing a pressure-sensitive adhesive tape or sheet

An operation portion and a switch portion of a push button switch are removably coupled. The switch portion includes a contact opening mechanism having a rotatably supported lever and a spring. The lever has one end acting on a part of the operation portion coupled with the switch portion, and the other end acting on a contact switching mechanism of the switching contact unit in the switch portion to open/close the contacts. The spring urges the lever in a fixed rotation direction. The contact switching mechanism is urged to move a movable contact from a standby state position toward an operating state position by the contact opening mechanism when the switch portion is separated from the operation portion. The contact switching mechanism is released from the urging when the switch portion is coupled with the operation portion.

Push button switch

Disclosed is a moisture-curing type curable resin composition containing: a curable resin intramolecularly having a silicon-containing functional group; and a Lewis acid or a complex of the Lewis acid as a curing catalyst, the Lewis acid being selected from the group consisting of metal halides and boron halides, which is rapidly cured at room temperature. The silicon-containing functional group is represented by general formula: &#x2014;SiXXXor &#x2014;SiRXX(wherein, X, Xand Xrespectively represent a hydrolytic group and may be the same as or different from each other, and Rrepresents a substituted or unsubstituted organic group having 1 to 20 carbons). If the silicon-containing functional group is &#x2014;SiRXX, the curable resin further contains intramolecularly a polar component that is one of urethane, thiourethane, urea, thiourea, substituted urea, substituted thiourea, amide, and sulfide bonds, and hydroxyl, secondary amino and tertiary amino groups. Two-part type adhesive is constitutable with separating the curable resin from the curing catalyst.

Curable resin composition

Disclosed is a moisture-curing type curable resin composition containing: a curable resin intramolecularly having a silicon-containing functional group; and a Lewis acid or a complex of the Lewis acid as a curing catalyst, the Lewis acid being selected from the group consisting of metal halides and boron halides, which is rapidly cured at room temperature. The silicon-containing functional group is represented by general formula: &#x2014;SiXXXor &#x2014;SiRXX(wherein, X, Xand Xrespectively represent a hydrolytic group and may be the same as or different from each other, and Rrepresents a substituted or unsubstituted organic group having 1 to 20 carbons). If the silicon-containing functional group is &#x2014;SiRXX, the curable resin further contains intramolecularly a polar component that is one of urethane, thiourethane, urea, thiourea, substituted urea, substituted thiourea, amide, and sulfide bonds, and hydroxyl, secondary amino and tertiary amino groups. Two-part type adhesive is constitutible with separating the curable resin from the curing catalyst.

A speaker apparatus is configured such that a speaker unit including a single magnetic circuit system, a plurality of vibration systems and a case is housed inside a speaker box. In the speaker unit, magnetic gaps having a magnetic field of the same magnitude are defined by a magnet holder, a magnet and a yoke in each of the vibration systems. In one vibration system and the other vibration system, voice coils are wound around voice coil bobbins in directions reverse to each other. Consequently, the vibration systems are moved in directions opposite to each other by the same force by applying the same electric signal to the voice coil in each of the vibration systems from an amplifier. Therefore, acoustic waves are radiated in the directions opposite to each other.

Speaker unit, method for fabricating the same, and speaker apparatus

An object of the present invention is to provide a curable resin having a silyl group at the terminal that is also moisture-hardening resin which has lower in viscosity when it is used and provides superior adhesiveness when it is utilized for adhesive, sealant, and paint. The object of the invention could be achieved by a curable resin that has silicon atom-containing groups having a silicon atom bound to one or more hydrolysable groups such as alkoxy groups, acetoxy groups and oxim groups at the ends of the molecule, thioether and hydroxyl groups in the molecule, and a polymer having a polyoxyalkylene, (meth)acrylic ester, or hydrocarbon polymer as the main chain skeleton.

Curing resin, method for producing same and curing resin composition

A process for the preparation of urethane resins, which comprises the steps of: preparing a product(A) having a hydrolysable group directly bonded to 1&#x2013;10 silicon atoms and having less than two secondary amino groups in one molecule; preparing a product(B) having a terminal isocyanate group in an amount 4% or less by weight of said product(B); and reacting said product(A) with said product(B) in proportions of at least 0.5 equivalent of the product(A) per free NCO group of said product(B). The process can readily give urethane resins which exhibit excellent storage stability and are enhanced in the degrees of freedom of physical properties of products of curing.

Process for the preparation of urethane resins and urethane resin compositions

A process for the preparation of urethane resins, which comprises the steps of: preparing a product (A) having a hydrolysable group directly bonded to 1&#x2013;10 silicon atoms and having less than two secondary amino groups in one molecule; preparing a product (B) having a terminal isocyanate group in an amount 4% or less by weight of the product (B); and reacting the product (A) with the product (B) in proportions of at least 0.5 equivalent of the product (A) per free NCO group of the product (B). The process readily gives urethane resins, which exhibit excellent storage stability and are enhanced in the degrees of freedom of the physical properties of the products of curing.

Difference compensation circuits are connected to a volume controller having a tap in series. Each of the difference compensation circuit comprises a voltage control amplifier and an external CR network. The difference compensation circuits are arranged so as to independently attenuate a bass range and increase a mid-range in accordance with an amount of volume control by the volume controller.

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Saitama, Japan

Shinichi Sato