Intel Corporation

Shinichi Sakamoto

Jiamiao Tang

Henry Xu

Ryo Shimada

Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.

Apparatus, system, and method for wireless connection in integrated circuit packages

In one embodiment a method is provided. The method comprises inserting a first end of a P-type semiconductor pin in a first through hole via in a substrate; inserting a first end of an N-type semiconductor pin in a second through hole via in the substrate; and electrically connecting the first ends of the P and N-type semiconductor pins to form a precursor Peltier cooling device which in cooperation with a semiconductor die, bridges the P and N-type semiconductor pins between their ends remote from the first ends to define a Peltier cooling device in the substrate.

Silicon die substrate manufacturing process and silicon die substrate with integrated cooling mechanism

Embodiments of the present invention provide a method, apparatus and system for absorbing heat from an active side of a die by a plurality of cold conductive elements embedded in said die, and releasing said absorbed heat by a plurality of hot conductive elements embedded in a substrate connected to said die.

Growing community of inventors

Tsukuba, Japan

Shinichi Sakamoto