Murata Manufacturing Co., Ltd.

Shinichi Osada

Tomozo Yamanouchi

Takashi Shikama

Yuichi Takaoka

Organic thermistor devices are produced by a first step of molding an organic thermistor material by covering a plurality of electrically conductive members to form a conductor-containing member, which is elongated in a longitudinal direction, has a pair of mutually oppositely facing side surfaces, having the conductive plates buried parallel to one another inside the organic thermistor material, each mutually adjacent pair of these conductive members being externally exposed on different ones of the side surfaces, a second step of forming a pair of electrodes elongated in the longitudinal direction on the side surfaces of the conductor-containing member, and a third step of thereafter cutting this conductor-containing member transversely at specified positions so as to divide into individual units.

Method of producing organic thermistor devices

An organic thermistor device has a pair of outer electrodes formed facing each other on end parts of a thermistor body made of an organic thermistor material. Metallic wires extend inside and through the thermistor body transversely to the direction in which the outer electrodes face each other such that the resistance value at normal temperatures of the device can be significantly reduced. Both exposed surfaces of the thermistor body not covered by the outer electrodes and exposed end surfaces of the metallic wires not covered by the thermistor body may be all covered by an electrically insulating layer. To produce such organic thermistor devices, an elongated wire-containing member is prepared by molding an organic thermistor material by covering metallic wires extending longitudinally parallel to one another. It is then entirely covered with an electrically insulating material but portions of it are removed from a pair of longitudinally continuous external peripheral surface areas. Outer electrodes are thereafter formed on this pair of surface areas and the wire-containing member is then cut transversely to the direction of its elongation at specified positions to divide into individual elements. The newly exposed surfaces of these individual elements by cutting may be covered by an electrically insulating material.

Organic thermistor device and method of producing same

A pumping circuit for a semiconductor laser is formed by connecting a semiconductor laser in series with a positive temperature coefficient (PTC) thermistor element which has a temperature coefficient in the range between &minus;1.5%/&deg; C. and &minus;0.5%/&deg; C. within the temperature range between &minus;20&deg; C. and &plus;70&deg; C. and of which the temperature coefficient becomes positive at a temperature over &plus;70&deg; C. A resistor insensitive to temperature changes may be further connected to the PTC thermistor element either in series or in parallel. The semiconductor laser and the PTC thermistor element are disposed sufficiently close to each other so as to be thermally coupled inside a container such as a can to form a semiconductor apparatus.

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Shiga, Japan

Shinichi Osada