Fujikura Limited

Shinichi Nikaido

Haruo Miyazawa

Katsuya Yamagami

Yasuhiro Ouchi

Hirohito Watanabe

Nobumasa Misaki

Hiroki Maruo

Yasushi Nakamura

Akira Kamijima

A socket contact terminal for electrical connection between a connection portion formed of a metal conductor on a printed circuit board and a connection terminal of an IC package. The contact terminal comprises a metal terminal composed of a main columnar portion and arm portions on both sides and having an angular U shape and an elastomeric member attached to the metal terminal. A metal surface is exposed from the outer surface of each arm portion. The elastomeric member is firmly held between the arm portions of the metal terminal and exhibits a repulsive force when the arm portions are pressed in the direction that the arm portions approach each other.

Socket contact terminal and semiconductor device

A socket includes an insulating elastomeric sheet having a penetration hole, metal circuits formed on at least one of the front and rear surfaces of the elastomeric sheet, and a through-hole having a metal film formed on an inner wall of the penetration hole. The metal circuit on the front surface of the elastomeric sheet is electrically connected to the metal circuit on the rear surface of the elastomeric sheet via the through-hole. With such a configuration of the socket, it is possible to provide a socket contact terminal and a semiconductor device having the same, which is suitable for low-resistance, large-current, and high-speed configurations.

Socket, method for manufacturing socket, and semiconductor device

A connector is provided that includes: a molded base part having a substrate and elastomers arranged on both sides of the substrate; a plurality of through holes in the molded base part, which pass through the molded base part in a stacked direction of the substrate and the elastomers, and are arranged in parallel at predetermined spacing; and L-shaped contacts arranged via the through holes from one surface side of the molded base part to another surface side, wherein: the elastomers incorporate a plurality of first protruding parts whose top faces are inclined, and second protruding parts that protrude from top faces of the first protruding parts in a dome shape; said contact has dome shaped convex parts whose insides are hollow, and said convex parts are formed at two ends of the contact, and the convex parts are arranged such that they cover the respective second protruding parts. Also provided is an electronic component provided with this connector.

Connector and electronic component provided with same

A double-sided connector is provided including: an insulating member having an insulating substrate and an elastomer insert-molded on both faces of the insulating substrate, and a through-hole formed along a thickness direction of the insulating substrate and the elastomer; a conductive member formed on an inner face of the through-hole, both ends of the conductive member exposed at the both faces; and a contact terminal part provided at one end of the conductive member. A protrusion is formed on at least a first face of the two faces of the insulating member and near one of the two ends of the through-hole. The protrusion formed by a part of the elastomer protruding from the first face enables an approximately hemispherical point of contact part connected to the sloping part and covering the top.

Double-sided connector with protrusions

An aspect of the present invention inheres in an IC socket includes a plate-like socket base body which includes through hole forming portions having a plurality of contact housing holes formed so as to penetrate the plate-like socket base in a front-to-back direction, and having through holes formed around the respective contact housing holes so as to penetrate the plate-like socket base in the front-to-back direction, and a plated layer formed continuously on an inner wall of the through hole, on the front and back surfaces of the through hole forming portion, and on a surface of the contact piece.

IC socket and manufacturing method for the same

There is provided a configuration in which rigid substrates are connected via flexible substrates, the connection configuration having a pair of rigid substrates each having a predetermined circuit pattern on a front and a reverse surface thereof, a first flexible substrate attached on the front surfaces of the pair of the rigid substrates so as to electrically connect the circuit patterns provided respectively on the front surfaces, a second flexible substrate attached on the reverse surfaces of the pair of the rigid substrates so as to electrically connect the circuit patterns provided respectively on the reverse surfaces. The first and the second substrate have a gap therebetween smaller than a thickness of the pair of the rigid substrates.

Connection configuration for rigid substrates

An IC socket includes a plurality of contacts each including a spring formed by winding a conductive material around a winding axis with an effective winding number of at least 1 round, and arms provided on both ends of the spring, and a housing including the same number of holes as the plurality of contacts, the holes each having one of the contacts inserted therein in a state in which the spring is compressed in a direction of the winding axis so as to allow adjacent coil portions in the spring to come into contact with each other and to be electrically conductive.

IC socket and IC package mounting device

A hybrid sensor is formed by stacking a plurality of flexible sheets each provided with electrode patterns. The hybrid sensor includes a contact pressure sensor which has switches turning on or off by a pressure load, and an electrostatic capacitance sensor which detects a nearby object without contacting the object. The electrode patterns include a switching electrode pattern as the switch of the contact pressure sensor and a detecting electrode pattern as the detecting electrode of the electrostatic capacitance sensor. The detecting electrode is formed to cover substantially the entire area other than the area on which the switching electrode pattern is formed.

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Sakura, Japan

Shinichi Nikaido