Sumitomo Osaka Cement Co., Ltd.

Tokyo Electron Limited

Shinichi Maeta

Mamoru Kosakai

Yukio Miura

Keisuke Maeda

Kei Furuuchi

Yoshiaki Moriya

Kazunori Ishimura

Hitoshi Kouno

Yuuki Kinpara

Takashi Sato

Takeshi Watanabe

Tomoyuki Takahashi

Yasuharu Sasaki

Takeshi Otsuka

Kentaro Takahashi

Kaoru Oohashi

Takashi Satou

Yuhki Kinpara

Tadashi Aoto

Kazuto Ando

Tomomi Ito

Masaki Ozaki

Masayuki Shiojiri

An electrostatic chuck device comprising a mounting table having a mounting surface, a focus ring; and a cooling element, wherein the mounting table has a holding portion surrounding the mounting surface, the holding portion has an annular groove portion having a through-hole, the holding portion has inner and outer peripheral surfaces which hold the focus ring and are located on both sides of the groove portion, the holding surface satisfies conditions (i) and (ii), (i) a straight line connecting a first point corresponding to an innermost periphery of the holding surface and a second point corresponding to an outermost periphery of the holding surface has a positive or a negative inclination from the innermost periphery toward the outermost periphery, wherein a difference between a height of the first point and a height of the second point is 0 &#x3bc;m to 10 &#x3bc;m, and (ii) leak areas of the inner peripheral surface and the outer peripheral surface are less than 0.7 mm.

Electrostatic chuck device and electrostatic chuck device manufacturing method

According to an electrostatic chuck device of the present invention, a cross-sectional shape of a base body in a thickness direction is a convex curved surface or a concave curved surface that gradually curves from a center of one main surface toward an outer periphery of the one main surface, an annular projection portion is provided on a peripheral portion on the one main surface of the base body so as to go around the peripheral portion, a plurality of convex projection portions are provided in a region surrounded by the annular projection portion, the convex projection portion has the top surface in contact with the plate-shaped sample, a side surface, and an R surface continuously connecting the top surface and the side surface.

Electrostatic chuck device

An electrostatic chuck device includes: an electrostatic chuck part which incorporates an internal electrode for electrostatic attraction and has a placing surface on which a plate-like sample is placed; a base part which cools the electrostatic chuck part; and an adhesion layer which bonds the electrostatic chuck part and the base part to integrate the parts together, in which a first through-hole is provided in the electrostatic chuck part, a second through-hole that communicates with the first through-hole is provided in the base part, a tubular insulator is fixed in the second through-hole, an annular sealing member is sandwiched between the electrostatic chuck part and a distal end surface of the insulator, wherein the distal end surface is located on the electrostatic chuck part side of the insulator, and a tubular insulating wall member is located at the inner side of the sealing member in the radial direction.

An electrostatic chuck device includes: a placing plate having a placement surface on which a plate-like sample is placed on one side thereof; an electrostatic attraction electrode provided on the other side of the first ceramic plate; and a first organic insulating layer provided between the first ceramic plate and the electrostatic attraction electrode. The electrostatic chuck device further has a supporting plate provided between the first organic insulating layer and the electrostatic attraction electrode.

An electrostatic chuck part of an electrostatic chuck device has an electrostatic chuck part inner peripheral surface surrounding an opening of a chuck part through-hole, and an electrostatic chuck part outer peripheral surface surrounding the electrostatic chuck part inner peripheral surface. An insulator has an insulator main body in which an insulator through-hole having an opening on the electrostatic chuck part side is formed, an insulator inner end face, and an insulator outer end face which faces the electrostatic chuck part outer peripheral surface. The insulator inner end face and the electrostatic chuck part inner peripheral surface are in contact with each other, or an adhesion layer or a plasma-resistant adhesive layer extends in a gap between the insulator inner end face and the electrostatic chuck part inner peripheral surface. The plasma-resistant adhesive layer is formed between the electrostatic chuck part outer peripheral surface and the insulator outer end face.

Electrostatic chuck device, and semiconductor manufacturing device

An electrostatic chuck device includes an electrostatic chuck member and a temperature controlling base member. The electrostatic chuck member has a ceramic plate having a mounting surface on which a plate-shaped sample is mounted, and an electrode for electrostatic attraction provided on the other surface on the side opposite the mounting surface of the ceramic plate. The temperature controlling base member is disposed on the surface on the side opposite the ceramic plate side of the electrode for electrostatic attraction and cools the electrostatic chuck member. The ceramic plate has a dike portion which extends to the temperature controlling base member side and surrounds the electrode for electrostatic attraction, the temperature controlling base member has a groove portion accommodating an end part of the dike portion, and a space between the groove portion and the dike portion is filled with a filling part formed of a resin material.

An electrostatic chuck device according to the present invention includes: an electrostatic chuck portion having a placement surface on which a plate-like sample is placed; a base portion for temperature adjustment disposed in opposition to the side of the electrostatic chuck portion on the opposite side from the placement surface; a bonding portion for bonding the electrostatic chuck portion and the base portion for temperature adjustment together; and an annular focus ring surrounding the periphery of the placement surface, in which the volume of a space surrounded by the electrostatic chuck portion, the focus ring, the bonding portion, and a dam portion of the base portion for temperature adjustment is greater than the amount of volume expansion of the bonding portion at the working temperature.

An electrostatic chuck apparatus is disclosed which can be prevented from being damaged or fractured when the temperature abruptly increases or decreases when plasma is irradiated on a plate-like specimen, the heater is heated, or the like, and can also prevent corrosion when a corrosive gas or plasma is provided. The electrostatic chuck apparatus has an electrostatic chuck portionhaving a mounting platemade of a corrosion-resistant ceramic, a supporting platewhich is integrated with the mounting plateso as to support the mounting plateand is made of an insulating ceramic having a larger thermal conductivity than the thermal conductivity of the corrosion-resistant ceramic, and an internal electrode for electrostatic adsorptionprovided between the mounting plateand the supporting plate; and a temperature-controlling base portionwhich adjusts the electrostatic chuck portionto a desired temperature.

Electrostatic chuck apparatus

An electrostatic chuck device is provided in which there is no concern that a plate-shaped sample may be deformed when adsorbing the plate-shaped sample or when detaching the plate-shaped sample, the temperature of the plate-shaped sample is uniformized, and particles are not easily produced. In an electrostatic chuck deviceprovided with an electrostatic chuck sectionwhich has a placement plate, an upper surfaceof which is a placement surface on which a plate-shaped sample W such as a semiconductor wafer is placed, a support plateintegrated with the placement plate, and an internal electrode for electrostatic adsorptionand an insulating material layerwhich are provided between the placement plateand the support plate, an annular projection portionis provided at a peripheral border portion on the upper surface, a plurality of projection portionshaving the same height as the height of the annular projection portionare provided in an area surrounded by the annular projection portionof the upper surface, and an upper end portion of the annular projection portionand an upper end portion of each of the plurality of projection portionsare located on a concave surfacewith a central portion of the upper surfaceas a basal plane.

An electrostatic chuck device includes an electrostatic chuck part that has an upper surface as a placement surface for placing a plate-shaped sample and has an internal electrode for electrostatic attraction built therein; and a cooling base part that cools the electrostatic chuck part. The electrostatic chuck part and the cooling base part are integrally adhered to each other via an adhesive layer. An insulator having a double pipe structure including an insulator and an insulator provided coaxially with an outer peripheral portion of the insulator is provided in a cooling gas hole, formed in the electrostatic chuck part and the cooling base part, so as to cover an exposed surface of the adhesive layer on the cooling gas hole side.

An electrostatic chuck device () according to the invention includes an electrostatic chuck section () that has a principal surface as a placement surface on which a plate-shaped sample is placed, and is made to have an internal electrode for electrostatic adsorption built-in, and a cooling plate section () that cools the electrostatic chuck section (), wherein a heating member () is bonded to a principal surface on the opposite side to the placement surface of the electrostatic chuck section () through a first adhesive material layer (), and the electrostatic chuck section () and the heating member () are bonded to and integrated with the cooling plate section () through an acrylic adhesive layer () having flexibility and insulation properties.

The electrostatic chucking deviceof the invention includes an electrostatic chucking portionwhich includes a plate-like body, a top surfaceof which is used as a mounting surface that mounts a plate-like specimen W, an electrostatic adsorption electrodeprovided in the plate-like bodyand a power-feeding terminalthat applies a direct-current voltage to the electrostatic adsorption electrode; and a base portionthat supports the electrostatic chucking portion, in which the plate-like bodyis a corrosion-resistant ceramic, a circular insulation memberis provided in a circumferential edge portion between the electrostatic chucking portionand the base portion, and a heat radiation plateis provided on the top surfaceof the base portion

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Tokyo, Japan

Shinichi Maeta