Matsushita Electric Industrial Co., Ltd.

Shinichi Kudo

Yukio Maeda

Keiji Saeki

Hachiro Nakatsuji

Haruyuki Otani

Method and apparatus for drawing thick film circuit

Method and apparatus for drawing a thick film circuit

Disclosed is a method for forming thick film circuits or the like to be used when forming elements such as conductors and resistors on a thick film circuit board. The method is performed with a writing head for storing paste to form patterns and which lowers and approaches an arbitrary point in close proximity to the board of a thick film circuit and while same state, moves laterally to another other arbitrary point along the surface of the board, and then ascends to be separated from the board. The paste in the writing head is pressurized to be forced out of the head before the writing head begins to move laterally such that the paste is immediately applied on the board when the writing head begins to move laterally. This pressurization of the paste is stopped before the writing head finishes its lateral movement, so that the extrusion of the paste may be stopped the moment the writing head finishes the lateral movement. As a result, blurring or blotting at the beginning and ending part of the pattern writing may be prevented, so that patterns may be formed at high speed and with high precision.

Method of forming thick film circuits

A pickup arm device for disc phonograph player comprising a pickup arm and a pivot holder integrally combined with the pickup arm and having an opening substantially at the center thereof to receive a pivot bearing and a pair of holes formed at opposite sides of the pivot holder. A pair of pivots are inserted into the pair of the holes so that they are brought into contact with the pivot bearing from the opposite sides. At least one of the paired pivots is fixedly secured to the pivot holder by means of a hardenable adhesive.

Pickup arm device

Growing community of inventors

Neyagawa, Japan

Shinichi Kudo