Kyocera Corporation

International Superconductivity Technology Center

Sanyo Electric Co., Ltd.

The Tokyo Electric Power Company, Incorporated

Mitsubushi Metal Corporation

Shinichi Koriyama

Kenji Kitazawa

Hidehiro Minamiue

Hisao Yamauchi

Takaaki Ikemachi

Naoyuki Shino

Mikio Fujii

Shigeki Morioka

Shoji Tanaka

Nobuo Suzuki

Hiroshi Uchimura

Takahiro Wada

Takeshi Sakurai

Naoki Koshizuka

Masanobu Ishida

Satoru Tomie

Koichi Nagata

Takanori Kubo

Takayuki Miyatake

Yoshinobu Sawa

Akira Nakayama

A high frequency line-waveguide converter comprises a high frequency line including a dielectric layer, a line conductor disposed on an upper surface of the dielectric layer, and a ground conductor layer disposed on the same surface so as to surround one end of the line conductor, a slot formed in the ground conductor layer so as to be substantially orthogonal to the one end of the line conductor and coupled to the line conductor, a shield conductor part disposed on a side of or in an inside of the dielectric layer so as to surround the one end of the line conductor and the slot, and a waveguide disposed at the lower side of the dielectric layer so that an opening is made opposite to the one end of the line conductor and the slot, and electrically connected to the shield conductor part.

High frequency line-to-waveguide converter and high frequency package

An object of the invention is to provide a high-frequency line-waveguide converter in which a distance between a grounding conductor and a radiating conductor and a thickness of a dielectric layer of a high-frequency line can be freely set. A high-frequency line-waveguide converter for converting a high-frequency line to a waveguide comprises a high-frequency line including a first dielectric layer; a line conductor; and a grounding conductor; an opening portion of the grounding conductor; a second dielectric layer; a radiating conductor; a connecting conductor; a shielding conductor portion; and a waveguide.

High-frequency line-waveguide converter having the HF line terminated within an opening portion

A wiring board includes a dielectric substrate, a signal transmission line formed on one surface of the dielectric substrate, a grounded layer formed on the other surface of the dielectric substrate, and a connection portion for connecting portion for connecting the signal transmission line to a waveguide, the connection portion being formed on the grounded layer. The grounded layer has a slot at a position opposed to an end of the signal transmission line. The connection portion includes a first dielectric portion disposed to cover the slot of the ground layer, a second dielectric portion laminated on the first dielectric portion, and a patch conductor provided at a position opposed to said slot on an interface between the first dielectric portion and the second dielectric portion. The wiring board enables the signals to be efficiently transmitted from the signal transmission line to the waveguide with a small loss and a small reflection.

Multi-layered wiring board for slot coupling a transmission line to a waveguide

A wiring board module has two wiring boards placed on an external circuit board. In each wiring board, a terminal end of a laminated waveguide tube is exposed at a lateral side of a dielectric substrate, thus forming an exposed face, and the dielectric substrate is provided at the bottom thereof in the vicinity of the exposed face with connection pads to be used for mounting the wiring board on the surface of the external circuit board. The exposed faces of the laminated waveguide tubes of the two wiring boards are contacted with each other, and the connection pads at the bottoms of the wiring boards are connected and fixed to connection pads disposed on the surface of the external circuit board.

Wiring board with a waveguide tube and wiring board module for mounting plural wiring boards

A high frequency package is arranged such that it comprises a dielectric substrate provided with an input terminal and an output terminal, a high frequency element mounted on the surface of the dielectric substrate, and a high frequency line formed on the dielectric substrate for connecting the high frequency element with the input terminal and with the output terminal, wherein a transmission characteristic from the input terminal to the output terminal has the property of cyclically varying in relation to frequency. The length of the high frequency line is regulated such that the frequency of signals transmitted along the high frequency line is located at a part of the cyclic variation curve of the transmission characteristic where transmittance is large. By arranging the structure in such a manner, loss of high frequency signals having frequencies of 10 GHz or more can be reduced.

High frequency package, wiring board, and high frequency module having a cyclically varying transmission characteristic

A high frequency wiring board having a high frequency transmission line having a signal conductor line formed on the surface of a dielectric board and a grounding layer formed inside or on the reverse surface of the dielectric board parallel to the signal conductor line, and a connecting terminal portion provided at a terminal end of the high frequency transmission line and including connecting grounding conductors formed with spacing on both sides of the signal conductor line and through conductors for connecting the connecting grounding and the grounding layer. The distance between the through conductors and an end side surface of the dielectric board is not more than 0.3 times the signal wavelength, in the dielectric board, of a high frequency signal.

High frequency wiring board and its connecting structure

A high-frequency module comprising a high-frequency device-mounting package and an external circuit board, wherein said high-frequency device-mounting package includes a dielectric substrate having a first grounding layer contained therein, said dielectric substrate mounting a high-frequency device on one surface thereof and having, formed on one surface thereof, first high-frequency signal transmission lines connected to said high-frequency device, and having, formed on the other surface thereof, second high-frequency signal transmission lines coupled to said first high-frequency signal transmission lines; said external circuit board is constituted by a dielectric board having third high-frequency signal transmission lines and a second grounding layer, said third high-frequency signal transmission lines being formed on one surface of said dielectric board, and said second grounding layer being formed on the other surface of said dielectric board or inside thereof; and said high-frequency device-mounting package and said external circuit board are arranged side by side, and the second high-frequency signal transmission lines of the high-frequency package are electrically connected to the third high-frequency signal transmission lines of the external circuit board through linear electrically conducting members. The patterns of the second high-frequency signal transmission lines on the side of the high-frequency device-mounting package can be easily aligned with the patterns of the third high-frequency signal transmission lines on the side of the external circuit board, effectively reducing the transmission loss at the junction portions of the lines.

High-frequency module using slot coupling

A high-frequency module in which a plurality of cavities are formed on the surface of a dielectric board, internal high-frequency signal transmission lines are connected to high-frequency devices in the cavities and are located in the cavities, the internal high-frequency signal transmission lines being electromagnetically coupled to the external high-frequency signal transmission line, and the high-frequency devices in the cavities are connected to each other relying on the electromagnetic coupling through the external line. The high-frequency module enables high-frequency signals to be transmitted among the high-frequency devices with a small loss. The module has a very simple structure, and is cheaply produced, and offers an advantage that it can be easily obtained in a small size.

High-frequency module coupled via aperture in a ground plane

A high-frequency package comprising a dielectric substrate, a high-frequency element that operates in a high-frequency region and is mounted in a cavity formed on said dielectric substrate, and a microstrip line formed on the surface or in an inner portion of said dielectric substrate and electrically connected to said high-frequency element, wherein a signal transmission passage of a waveguide is connected to a linear conducting passage or to a ground layer constituting the microstrip line. In the junction portion of the waveguide, for example, an end of the linear conducting passage is electromagnetically opened, so that the end portion works as a monopole antenna inside the waveguide that is connected. The high-frequency package makes it possible to connect the waveguide without adversely affecting the sealing of the high-frequency element and to transmit high-frequency signals with a low loss.

High frequency package

A structure for mounting a high-frequency device on an insulating board having a circuit on a top surface and transmitting signals to the high-frequency device. The high-frequency device is sealed within a cavity on a top surface of a dielectric board. The dielectric board has a first signal transmission line on its top surface and a second signal transmission line on its bottom surface, the first and second signal transmission lines overlapping each other over a portion where the signal is transmitted through coupling of the first and second signal transmission lines. A recess is formed at the top surface of the insulating board below the overlapping portion of the first and second signal transmission lines to suppress transmission loss of the high-frequency signal between the first and second signal transmission lines. The recess may be filled with air or a material having a dielectric constant low than that of the insulating board.

Structure for mounting a high-frequency package

A high-frequency semiconductor device contains a semiconductor element in a cavity formed by a dielectric board and a cap. A first high-frequency transmission line connected to the semiconductor element is formed on the surface of said dielectric board in said cavity and a second high-frequency transmission line is formed on the bottom surface of said dielectric board, so that said first high-frequency transmission line and said second high-frequency transmission line are electromagnetically coupled together. In this semiconductor devise in which the first transmission line and the second transmission line are electromagnetically coupled together, the transmission lines need not be passed over the side wall of the cap, and neigther reflection loss or radiation loss takes place on the side wall. Besides, transmission loss of high-frequency signals is caused by neigther through-holes or via-holes, and is effectively suppressed.

High-frequency semiconductor device and mounted structure thereof

In the production of a 124-type or 123-type superconductor by a sol-gel method using alkoxides of respective metals, the use of a compound wherein a sec-butoxy group and a hydroxy group are coordinated with a copper atom gives a superconductor composed of flat particles having a broad C plane. The dimensional ratio defined by l/d is at least 6.7 in the case of the 124-type or is at least 8.4 in the case of the 123-type. It shows a superconducting property at a liquid nitrogen temperature. This superconductor shows a higher critical current density than one obtained by a sintering method.

1-2-4 copper oxide superconductor, a process for its production, and a

In the production of a 124-type or 123-type superconductor by a sol-gel method using alkoxides of respective metals, the use of a compound wherein a secbutoxy group and a hydroxy group are coordinated with a copper atom gives a superconductor composed of flat particles having a broad C plane. The dimensional ratio defined by l/d is at least 6.7 in the case of the 124-type or is at least 8.4 in the case of the 123-type. It shows a superconducting property at a liquid nitrogen temperature. This superconductor shows a higher critical current density than one obtained by a sintering method.

Growing community of inventors

Kokubu, Japan

Shinichi Koriyama