Murata Manufacturing Co., Ltd.

Shizuki Electric Company, Inc.

Shinichi Kobayashi

Tomomichi Ichikawa

Tomoki Inakura

Osamu Yamaoka

Norihiro Yoshikawa

Yasunori Hioki

Ichiro Nakaso

Ichiro Nakamura

Yoshitaka Kageyama

Satoru Jogan

Akira Nagai

Kimiaki Kikuchi

Satoshi Kamei

Shuji Watanabe

Yuko Ihara

Toshiya Esumi

Harunobu Sano

Shigeki Nishiyama

Takayuki Kayatani

Jun Harada

Shunjiro Imagawa

Mitsuru Nagashima

Kazuhito Oshita

Hajime Arakawa

Kazuhiro Harada

Kunio Okumura

Makoto Murata

Katsumi Yukawa

Hisao Yuasa

Kanichi Morishita

Shoji Oka

Kyosuke Yoshida

Kazuyoshi Obara

Akemi Ubata

Hideomi Kurihara

A film capacitor that includes a capacitor element including one or more wound or laminated metallized films, each metallized film including a resin film and a metal layer on a surface of the resin film; an outer case that houses the capacitor element; and a filling resin that fills a space between the capacitor element and the outer case, wherein the outer case is made of a resin composition containing a liquid crystal polymer and an inorganic filler.

Film capacitor, and outer case for film capacitor

A film capacitor that includes a metallized film having a metal layer on one surface of a dielectric resin film, in which, when a thermal expansion coefficient of the metallized film is &#x3b1;and a thermal expansion coefficient of the metal layer is &#x3b1;, a value of &#x3b1;/&#x3b1;is 5.1 or less.

Film capacitor and metallized film

A film capacitor that includes a laminate having a first resin film including a first metal layer on a surface thereof alternately laminated with a second resin film including a second metal layer on a surface thereof, the laminate having opposed first and second ends, a first external electrode on the first end of the laminate, and a second external electrode on the second end of the laminate, wherein the first resin film protrudes more than the second resin film by a first protruding length of 0.5 mm to 3 mm on the first end of the laminate, and the first resin film has a Young's modulus at 150&#xb0; C. of 0.6 GPa or more in a direction perpendicular to a lamination direction of the laminate and parallel to a direction from the first end to the second end of the laminate.

Film capacitor

A film capacitor that includes a dielectric resin film and a metal layer on one surface of the dielectric resin film. The dielectric resin film has a crosslink density at 225&#xb0; C. of 2700 mol/mor more, or the dielectric resin film has a storage elastic modulus at 125&#xb0; C. of 1.1 GPa or more.

Film capacitor having a delectric resin with a specific crosslink density and film for film capacitor

A film capacitor that includes a dielectric resin film having a first surface and a second surface opposite to the first surface, the second surface having a silicone resin-containing layer; a first metal layer opposite to the first surface of the dielectric resin film; and a second metal layer opposed to the second surface of the dielectric resin film.

Film capacitor, method of producing film capacitor, dielectric resin film, and method of producing dielectric resin film

A film capacitor that includes a resin layer having a linear protrusion on a first surface thereof and a linear recess on a second surface thereof opposite the first surface, and a metal layer on the first surface of the resin layer. A total length of the linear recess per 1 cmis 3 m or less, and an average depth of the linear recess is 0.01 &#x3bc;m to 1.3 &#x3bc;m.

Film capacitor, film for film capacitor, method of producing film for film capacitor, and method of producing film capacitor

A dielectric resin composition for a film capacitor is a mixture containing an organic material A and an organic material B. The organic material A includes at least two kinds of organic material components A, A, . . . having reactive groups (for example, OH, NCO) that cross-link each other. The organic material B does not have a reactive site capable of reacting with the organic material A and has a dielectric loss tan &#x3b4; of 0.3% or less at a temperature of 125&#xb0; C. The mixture has a glass transition temperature of 130&#xb0; C. or higher and preferably 280&#xb0; C. or lower.

Dielectric resin composition for film capacitor and film capacitor

To increase the heat resistance of a film capacitor, a dielectric resin composition is used as a material for a dielectric resin film used in a film capacitor, the dielectric resin composition being cured by mixing and crosslinking two or more organic materials having functional groups that react with each other to provide a cured article. At least one pair highly cohesive atomic groups which has a molecular cohesive energy equal to or higher than that of a methyl group and capable of cohering with each other due to the molecular cohesive energy is linked to the organic material. The highly cohesive atomic groups form a cohesive portion serving as pseudo-crosslinking.

To increase the heat resistance of a film capacitor, a cured article obtained by curing a mixed solution of a polyvinyl acetal having a hydroxyl group content of 10% to 38% by weight, the number of backbone carbon atoms of the polyvinyl acetal being 100 or more, and a polyisocyanate having an isocyanate content of 1% to 50% by weight is used as a dielectric resin films material arranged between first and second counter electrodes facing each other. At least the polyvinyl acetal is subjected to high-pressure homogenization in which a shearing force is applied such that a pressure applied to the polyvinyl acetal is 50 MPa or more when the material is passed through a path having a diameter of 0.125 mm and a length of 5 mm, so that the solubility is increased to allow a curing reaction to proceed uniformly. The cured article has a glass transition temperature of 130&#xb0; C. or higher and a breakdown voltage of 350 V/&#x3bc;m or more.

A resin composition constituting dielectric resin films of a film capacitor includes a first atom group including at least one functional group selected from among a methylene group, an aromatic ring and an ether group and having a relatively small molar polarizability, and a second atom group including at least one functional group selected from among a hydroxyl group, an amino group and a carbonyl group and having a relatively large molar polarizability. The resin composition satisfies the condition that a value calculated from the formula (sum of absorption band intensities of first atom group)/(sum of absorption band intensities of second atom group) is 1.0 or more. Herein, as absorption band intensities of the functional groups, peak intensities detected in specific wavenumber ranges are employed.

A capacitor circuit includes a first capacitor line including a film capacitor and a second capacitor line including a ceramic capacitor that are connected in parallel with each other. The second capacitor line includes an inductance element that is connected in series with the ceramic capacitor. The inductance element is set to a value such that a series resonant frequency of the first capacitor line and a series resonant frequency of the second capacitor line are matched.

Capacitor circuit and power conversion circuit including a resonant frequency adjustment element

A multilayer ceramic electronic component is prepared by covering a capacitor element with a thermoplastic resin layer that is mounted on a substrate by soldering. The thermoplastic resin layer is molten due to the heat required for soldering. The molten resin layer flows to expose external electrodes of the electronic component. The exposed external electrodes are soldered to electrodes of the substrate. In the resultant mounting structure, the thermoplastic resin layer covers substantially the entire surface except for the soldered portion of the electronic component and a portion of the solder.

Multilayer ceramic electronic component and mounting structure and method for the same

A nonlinear dielectric element in which degradation of nonlinear characteristics in an electric field-electric charge is not likely to occur and a large pulse voltage can be reliably achieved is provided. It is composed of an element body of a dielectric ceramic exhibiting nonlinear behavior in an electric field-electric charge, electrodes formed on the top face and bottom face, respectively, of the element main body, and insulation layers formed so as to cover from the neighborhood of the rims of the electrodes to each of the outer regions of the top face and the bottom face, the electrodes contain a conductive component and barium oxide borosilicate glass, and the insulation layers containing barium oxide borosilicate glass.

Nonlinear dielectric element

A capacitor including a ceramic body, a glass layer formed on each of opposite surfaces of the ceramic body, and a first metallic layer formed on the glass layer. Preferably, a lead terminal is connected to the first metallic layer or to a second metallic layer which is provided on the first metallic layer, by use of solder containing Pb in an amount of 2.5 wt. % or less. Preferably, a lead terminal which is plated with a substance containing Pb in an amount of 5 wt. % or less is soldered onto the first metallic layer or the second metallic layer.

Capacitor

A pulse generating capacitor is provided in which a capacitor element has electrodes provided on the front and rear faces thereof, and lead terminals connected to the electrodes by means of bonding members. The bonding members can contain Ag as a major component with a ZrO powder added thereto at a content of about 20% to 60% by volume. The capacitor solves a problem of crack generation on the capacitor element in response to thermal cycling, while maintaining the effects of preventing its pulse voltage from being decreased and enhancing the bonding strength of its lead terminals.

Growing community of inventors

Nagaokakyo, Japan

Shinichi Kobayashi