Hitachi, Ltd.

Hitachi Seiko, Ltd.

Shinichi Kazui

Hideaki Sasaki

Kaoru Katayama

Yasuhiro Iwata

Mitsugu Shirai

Hiroshi Fukuda

Yutaka Hashimoto

Toshihiko Ohta

Mitsunori Tamura

Mitugu Shirai

Hitoshi Odashima

Mamoru Kobayashi

Keiji Fujikawa

Kenji Morita

Takashi Matsumoto

Tateoki Miyauchi

Makoto Matsuoka

Tsutomu Shibuya

Hiroyuki Ogino

Ryohei Satoh

Makoto Morijiri

Masanobu Hanazono

Kuninori Imai

Takeji Shiokawa

Masayuki Kawaharata

Isamu Takaoka

Midori Imura

Masatake Muranaga

Madoka Tanouchi

Hiroyuki Doi

Mikio Hongo

Shigeo Shiono

Takao Terabayashi

Kiyoshi Matsui

Hideyuki Fukasawa

Shigenobu Maruyama

Takeshi Kawana

Kenichi Okada

Osamu Isshiki

Tatsuji Sakamoto

Haruhisa Sakamoto

Kyoko Amemiya

Takao Oguro

Toshihiro Mine

Youzi Miura

Kazuo Shirase

A laser processing apparatus includes a stage for mounting a workpiece, which moves the workpiece along two axes which are in parallel with the workpiece, the two axes being perpendicular to one other; a laser optical unit including a light source uniting laser light for irradiating the workpiece mounted on the stage with laser light, a stage controller for controlling the movement of the stage in each direction of the two axes, a collecting lens for collecting laser light and irradiating the workpiece with the laser light; a casing for placing the collecting lens on an optical path of the laser light, and a driving unit for moving the casing in a direction parallel to the optical path of the laser light. The driving unit moves the casing and focuses a focal point of the collecting lens on the workpiece.

Laser processing apparatus

Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.

Thin electronic circuit component and method and apparatus for producing the same

A plurality of green sheets are prepared, and at least one board pattern is formed on each of the sheets. The sheets are laminated and bonded with each other to form a multi-layer board. The unsintered multi-layer board is cut by irradiating the periphery of at least one board pattern on the surface of the multi-layer board with laser light. When the multi-layer board is cut, the width of the cut portion of the multi-layer board is measured. The cutting width is held constant by controlling the velocity at which the multi-layer board is cut, according to the measured width. Thus a section in the multi-layer board where at least one board pattern is formed is cut away from the other section of the multi-layer board. The cut away multi-layer board is then sintered. As a result, a multi-layer board is produced.

Method and an apparatus for manufacturing multi-layer boards using laser light

There is disclosed a surface reformation method of a high polymer material such that by irradiating and excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface, wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be soldered with preferable durability by a fluxess reflow soldering.

Surface reformation method of high polymer material

The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.

Process for manufacturing electronic circuits

A surface of a wafer (semiconductor substrate) is subjected to grinding by rotating it and bringing it into contact with a rotating grinding wheel. The grinding wheel is rotated in a first direction at a rotating speed N The wafer is rotated in a second direction which is opposite to the first direction at a rotating speed N wherein a value of N N is in the range of 0.006 to 0.025. The wafer is then carried from the grinding process to a dicing process while being maintained in a horizontal position by using a wafer handling jig to prevent the breakage of the wafer. A flash etching process may also be used at the end of the grinding process.

Grinding method, semiconductor device and method of manufacturing semiconductor device

A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.

Solder bump measuring method and apparatus

A method of measuring solder bumps formed on a substrate mounting a semiconductor element thereon includes mounting a work to be measured on a work position mechanism, and scanning the work by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be satisfactory.

In a method for manufacturing a printed circuit board, this printed circuit board can be manufactured by executing a simple manufacturing step within a short time period at in low cost without requiring a complex manufacturing process. A conductive material is pattern-printed on a base board and the printed conductive material is hardened to form a first conductor layer. Subsequently, an insulating material is pattern-printed on the first conductor layer, and the printed insulating material is hardened to thereby form a first insulating layer. A manufacturing step similar to the above-described step is repeatedly performed to thereby form a second conductor layer, a second insulating layer, and a third conductor layer. Furthermore, a manufacturing step similar to the above-explained step is repeatedly performed, so that a printed circuit board having a multi-conductor layer can be manufactured.

Printed circuit board, IC card, and manufacturing method thereof

A method and an apparatus for measuring the height of an apex of an object with high accuracy without influence of the surface state of the object are disclosed. Correlation coefficients of respective positions of a waveform formed from digital data indicative of the height of the object detected by a head portion of a detector and a previously prepared standard waveform are calculated while moving the waveforms in the vertical and horizontal directions and the height of an apex position of the standard waveform at a position having a largest correlation coefficient from the calculated result is decided as the height of the apex of the object. Accordingly, the height of the apex can be decided from the whole detected waveforms without influence of local abnormality of the reflected light quantity waveform due to minute ruggedness or discoloration of the surface of the object.

Method and apparatus for measuring the height of an object

A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.

Laser assisted surface reformation method of high polymer material

Growing community of inventors

Hadano, Japan

Shinichi Kazui