Mitsubishi Electric Corporation

Mitsubishi Denki Kabushiki Kaisha

Shinichi Iura

Yukimasa Hayashida

Daisuke Oya

Yasuhiro Sakai

Ryutaro Date

Ryo Tsuda

Kenji Hatori

Hitoshi Uemura

Kazufumi Ishii

Power semiconductor device

Power semiconductor devices, and particularly a power semiconductor device which contains a plurality of power semiconductor elements. The power semiconductor device capable of reducing differences in impedance caused by differences in length among wire interconnections, facilitating the electric connection between main circuit terminals and the outside, and lightening restrictions on the number and layout of the power semiconductor elements installed. In the power semiconductor device, a rectangular-loop-shaped interconnection board is disposed above a bottom substrate to cover an area above edges of the bottom substrate, with an opening above the center part of the bottom substrate. A main collector electrode terminal and a main emitter electrode terminal pass through the opening to protrude from an opening of a resin case so that they can be electrically connected to the outside. Control emitter pads and gate pads are electrically connected to the control emitter electrodes and the gate terminals through wire interconnections of equal length.

Plurality of power elements with gate interconnections having equal lengths

In order to provide semiconductor device modules which are capable of solving problems caused by the presence of the control board, and facilitating electric connection between power semiconductor elements and main circuit terminals and lightening restrictions on the number and layout of the power semiconductor elements, a control emitter relay terminal, a gate relay terminal, and a relay terminal are connected to a control board disposed above an edge portion of the semiconductor device module. The control board has control circuitry and elements for controlling operations of an IGBT device and a diode device, and also has a control emitter interconnection pattern to which the control emitter relay terminal is connected and a gate interconnection pattern to which the gate relay terminal is connected, where these interconnection patterns are connected to control circuitry.

Growing community of inventors

Tokyo, Japan

Shinichi Iura