Yamatake Corporation

Azbil Corporation

Shinichi Ike

Shoji Kamiunten

Nobuhiko Zushi

Takeshi Nishi

Hideyuki Tanaka

Satoshi Tsuchiya

Yoshiyuki Ishikura

Seiichiro Kinugasa

Koji Seki

Hiroshi Hatakeyama

Seishi Nakano

Junji Kumasa

Tarou Nakata

A measuring device includes two sensor chips that measure a flow rate of a fluid flowing through a pipe, electrode pads extending from a temperature measuring section and from a heater, respectively, toward peripheries of the two sensor chips, and wires that are electrically connected to the electrode pads and via which a measurement signal that is output from the temperature measuring section or the heater is transmitted to outside of the sensor chips. Each of the electrode pads includes a straight portion that extends linearly from the temperature measuring section or the heater and a wide portion that is formed at a leading end of each of the electrode pads and is wider than the straight portion, and an entire surface area of the wide portion is set as a wire-bonding-allowed region, to which one of the wires is to be bonded.

Measuring device

A measuring apparatus including a tubular member, a sensor fixed to an outer peripheral surface of the tubular member, and a circuit board that relays a detection signal from the sensor, the circuit board being fixed to the outer peripheral surface in an area different from an area where the sensor is fixed and being separated from the sensor, and a wire that electrically connects the sensor and the circuit board.

Measuring apparatus and method of manufacturing the measuring apparatus

A flow sensor may be formed by bonding a sensor chip formed with a flow rate detecting part and a flow path-forming member that is provided on the sensor chip and is formed with a flow path for a fluid flowing in the flow rate detecting part to each other on the upper surface of a substrate. The flow path-forming member may be formed by bonding a transparent first flow path forming member and a second flow path-forming member to each other. The first flow path forming member has a plate shape, and is provided with an inflow port and a outflow port for the fluid to be measured, and the second flow path forming member has a plate shape, and is provided with a through hole that forms the flow path along the flow of the fluid flowing along the flow rate detecting part.

Flow sensor and manufacturing method therefor

Flow sensor

A flow sensor may be formed of a sensor chip in which a flow rate detecting section is formed on an electric insulating film applied to cover at least a part of a concave portion formed on an upper surface of a substrate and may also include a flow path forming member which is provided on the sensor chip and has a flow path of a fluid flowing through the flow rate detecting section formed therein.

Flow sensor unit including an insulating member interposed between the sensor chip and the attachment plate

The package structure may includes: a sensor chip having a detecting device formed on a front surface of a substrate; through electrodes that are arranged at predetermined positions of the substrate around the detecting device, electrically insulated at circumferences thereof, pierce the substrate from the front surface to a rear surface, are connected with lead patterns of the detecting device on the front surface side, and connected with signal fetching means for the outside on the rear surface side; a flow path body on which the sensor chip is mounted and which has a flow path (a conduction path) for a fluid being formed on a surface facing the detecting device and sealing means.

Package structure of sensor and flow sensor having the same

In a flow sensor () including an anticorrosion metallic diaphragm; an insulating film formed on one surface of the metallic diaphragm; and a flow rate measuring sensor formed on the insulating film, the other surface of the metallic diaphragm being in contact with a fluid under measure, between the insulating film () on which sensor devices () are formed and the metallic diaphragm, a buffer layer () having an intermediate linear expansion coefficient between the linear expansion coefficient of the insulating film () and the linear expansion coefficient of an anticorrosion metal is interposed. Thereby, the sensitivity and response of the flow sensor are improved, and also the heat resistance is improved, by which the flow sensor is made especially suitable for measuring the flow rate of a corrosive fluid.

A flow sensor () is constituted by a substrate () having a front surface () side facing a channel () for a measurement target fluid (), and a channel forming member () and a plate () disposed oppositely across the substrate (). The substrate () is formed of stainless steel having a thickness of about 50 &#x3bc;m to 150 &#x3bc;m into a plate. An electric insulating film is formed on that surface () of the substrate () which is opposite to the channel () side, and a temperature detection sensor () for measuring the flow velocity (flow rate) of the fluid (), an ambient temperature sensor (), an electrode pad (), and a thin metal film () for wiring are formed on it.

A flow sensor includes a substrate, an electrical insulating film, and a flow velocity detection mechanism. In the substrate, a diaphragm portion having a first surface in contact with a measurement target fluid and a thick fixing portion surrounding the diaphragm portion are integrally formed. The electrical insulating film is formed on a second surface of the diaphragm portion which is on a side opposite to the first surface. The flow velocity detection mechanism is arranged on the electrical insulating film. A method of manufacturing a flow sensor is also disclosed.

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Tokyo, Japan

Shinichi Ike